FR1604130A - Production of ti,zr, or hf coatings for use - in printed or integrated circuits, brazing - Google Patents
Production of ti,zr, or hf coatings for use - in printed or integrated circuits, brazingInfo
- Publication number
- FR1604130A FR1604130A FR1604130DA FR1604130A FR 1604130 A FR1604130 A FR 1604130A FR 1604130D A FR1604130D A FR 1604130DA FR 1604130 A FR1604130 A FR 1604130A
- Authority
- FR
- France
- Prior art keywords
- brazing
- coatings
- printed
- production
- integrated circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
Abstract
A metallizing mixture consisting of metal particles suspended in an aqueous solution of at least one alkali(ne earth) metal chloride salt is applied to the surface to be metallized and then the coated surface is heated to a predetermined temp. in a non-oxidising atmosphere for long enough time to melt the salts and deposit the metal as a coating consisting of a thin transition layer and a second porous layer bonded to the first layer.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR118097 | 1967-08-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1604130A true FR1604130A (en) | 1971-07-12 |
Family
ID=8636976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1604130D Expired FR1604130A (en) | 1967-08-17 | 1967-08-17 | Production of ti,zr, or hf coatings for use - in printed or integrated circuits, brazing |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR1604130A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007128015A2 (en) * | 2006-05-04 | 2007-11-15 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for producing at least one conductive element of a printed-circuit board, printed-circuit board and use of this method |
-
1967
- 1967-08-17 FR FR1604130D patent/FR1604130A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007128015A2 (en) * | 2006-05-04 | 2007-11-15 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for producing at least one conductive element of a printed-circuit board, printed-circuit board and use of this method |
WO2007128015A3 (en) * | 2006-05-04 | 2008-03-27 | Austria Tech & System Tech | Method for producing at least one conductive element of a printed-circuit board, printed-circuit board and use of this method |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |