FR1580665A - - Google Patents

Info

Publication number
FR1580665A
FR1580665A FR1580665DA FR1580665A FR 1580665 A FR1580665 A FR 1580665A FR 1580665D A FR1580665D A FR 1580665DA FR 1580665 A FR1580665 A FR 1580665A
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of FR1580665A publication Critical patent/FR1580665A/fr
Expired legal-status Critical Current

Links

Classifications

    • H10P14/69215—
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • H10P14/6342—
    • H10P14/683—
    • H10P14/69433—
    • H10P95/00—
    • H10W20/40—
    • H10W74/131—

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR1580665D 1967-09-15 1968-09-12 Expired FR1580665A (en:Method)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US66808067A 1967-09-15 1967-09-15
US2680670A 1970-04-08 1970-04-08

Publications (1)

Publication Number Publication Date
FR1580665A true FR1580665A (en:Method) 1969-09-05

Family

ID=26701675

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1580665D Expired FR1580665A (en:Method) 1967-09-15 1968-09-12

Country Status (4)

Country Link
US (1) US3700497A (en:Method)
FR (1) FR1580665A (en:Method)
GB (1) GB1230421A (en:Method)
NL (1) NL6813133A (en:Method)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2209218A1 (en:Method) * 1972-10-18 1974-06-28 Hitachi Ltd
JPS508469A (en:Method) * 1973-05-21 1975-01-28
FR2335960A1 (fr) * 1975-12-18 1977-07-15 Gen Electric Element semi-conducteur perfectionne
FR2339252A1 (fr) * 1976-01-26 1977-08-19 Gen Electric Element semi-conducteur a revetement de protection perfectionne et solution pour la fabrication de ce revetement
FR2363192A1 (fr) * 1976-08-27 1978-03-24 Ibm Procede permettant d'ameliorer l'adherence des lignes conductrices metalliques formees sur une couche de polyimide
FR2363887A1 (fr) * 1976-09-07 1978-03-31 Gen Electric Nouveau procede pour l'attaque chimique de copolymeres polyimide-silicone deposes sur un corps semi-conducteur

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3787207A (en) * 1971-12-16 1974-01-22 Matsushita Electric Industrial Co Ltd Electrophotographic photosensitive plate having a polyimide intermediate layer
US3911475A (en) * 1972-04-19 1975-10-07 Westinghouse Electric Corp Encapsulated solid state electronic devices having a sealed lead-encapsulant interface
US4001870A (en) * 1972-08-18 1977-01-04 Hitachi, Ltd. Isolating protective film for semiconductor devices and method for making the same
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
US3952324A (en) * 1973-01-02 1976-04-20 Hughes Aircraft Company Solar panel mounted blocking diode
DE2326314C2 (de) * 1973-05-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Reliefstrukturen
JPS5527463B2 (en:Method) * 1973-02-28 1980-07-21
JPS5012973A (en:Method) * 1973-06-01 1975-02-10
US3869704A (en) * 1973-09-17 1975-03-04 Motorola Inc Semiconductor device with dispersed glass getter layer
US3873361A (en) * 1973-11-29 1975-03-25 Ibm Method of depositing thin film utilizing a lift-off mask
JPS5421073B2 (en:Method) * 1974-04-15 1979-07-27
DE2428373C2 (de) * 1974-06-12 1982-05-27 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen von weichlötbaren Anschlußkontakten auf einer Halbleiteranordnung
US4113550A (en) * 1974-08-23 1978-09-12 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
US4218283A (en) * 1974-08-23 1980-08-19 Hitachi, Ltd. Method for fabricating semiconductor device and etchant for polymer resin
JPS5131186A (en:Method) * 1974-09-11 1976-03-17 Hitachi Ltd
US3959047A (en) * 1974-09-30 1976-05-25 International Business Machines Corporation Method for constructing a rom for redundancy and other applications
DE2547792C3 (de) * 1974-10-25 1978-08-31 Hitachi, Ltd., Tokio Verfahren zur Herstellung eines Halbleiterbauelementes
DE2459665C2 (de) * 1974-12-17 1982-12-30 Siemens AG, 1000 Berlin und 8000 München Anordnung zum Herstellen eines Körperschnittbildes mit fächerförmigen Bündeln von Röntgenstrahlen
US3985597A (en) * 1975-05-01 1976-10-12 International Business Machines Corporation Process for forming passivated metal interconnection system with a planar surface
US4086375A (en) * 1975-11-07 1978-04-25 Rockwell International Corporation Batch process providing beam leads for microelectronic devices having metallized contact pads
US4092442A (en) * 1976-12-30 1978-05-30 International Business Machines Corporation Method of depositing thin films utilizing a polyimide mask
US4244799A (en) * 1978-09-11 1981-01-13 Bell Telephone Laboratories, Incorporated Fabrication of integrated circuits utilizing thick high-resolution patterns
JPS5850417B2 (ja) * 1979-07-31 1983-11-10 富士通株式会社 半導体装置の製造方法
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
DE3027941A1 (de) * 1980-07-23 1982-02-25 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von reliefstrukturen aus doppellackschichten fuer integrierte halbleiterschaltungen, wobei zur strukturierung hochenergetische strahlung verwendet wird
US4334949A (en) * 1980-11-25 1982-06-15 International Business Machines Corporation Reducing carbonate concentration in aqueous solution
US4423547A (en) 1981-06-01 1984-01-03 International Business Machines Corporation Method for forming dense multilevel interconnection metallurgy for semiconductor devices
DE3132452A1 (de) * 1981-08-17 1983-02-24 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen einer nach dem galvanischen aufbau von metallischen strukturen planaren strukturebene
US4411735A (en) * 1982-05-06 1983-10-25 National Semiconductor Corporation Polymeric insulation layer etching process and composition
EP0145727A4 (en) * 1983-04-22 1985-09-18 M & T Chemicals Inc POLYAMIDE-ACIDS AND IMPROVED POLYIMIDES.
US4495220A (en) * 1983-10-07 1985-01-22 Trw Inc. Polyimide inter-metal dielectric process
US4656050A (en) * 1983-11-30 1987-04-07 International Business Machines Corporation Method of producing electronic components utilizing cured vinyl and/or acetylene terminated copolymers
EP0162017B1 (de) * 1984-05-17 1991-08-21 Ciba-Geigy Ag Homo- und Copolymere, Verfahren zu deren Vernetzung und derenVerwendung
US4639277A (en) * 1984-07-02 1987-01-27 Eastman Kodak Company Semiconductor material on a substrate, said substrate comprising, in order, a layer of organic polymer, a layer of metal or metal alloy and a layer of dielectric material
US4599136A (en) * 1984-10-03 1986-07-08 International Business Machines Corporation Method for preparation of semiconductor structures and devices which utilize polymeric dielectric materials
US4568601A (en) * 1984-10-19 1986-02-04 International Business Machines Corporation Use of radiation sensitive polymerizable oligomers to produce polyimide negative resists and planarized dielectric components for semiconductor structures
US4624740A (en) * 1985-01-22 1986-11-25 International Business Machines Corporation Tailoring of via-hole sidewall slope
US4693780A (en) * 1985-02-22 1987-09-15 Siemens Aktiengesellschaft Electrical isolation and leveling of patterned surfaces
USH274H (en) 1985-05-28 1987-05-05 Method of manufacturing an integrated circuit chip and integrated circuit chip produced thereby
US4886573A (en) * 1986-08-27 1989-12-12 Hitachi, Ltd. Process for forming wiring on substrate
US5284801A (en) * 1992-07-22 1994-02-08 Vlsi Technology, Inc. Methods of moisture protection in semiconductor devices utilizing polyimides for inter-metal dielectric
JP2698827B2 (ja) * 1993-11-05 1998-01-19 カシオ計算機株式会社 バンプ電極を備えた半導体装置の製造方法
US5723385A (en) * 1996-12-16 1998-03-03 Taiwan Semiconductor Manufacturing Company, Ltd Wafer edge seal ring structure
US7018776B2 (en) * 2002-12-12 2006-03-28 Arch Specialty Chemicals, Inc. Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems
KR100510543B1 (ko) * 2003-08-21 2005-08-26 삼성전자주식회사 표면 결함이 제거된 범프 형성 방법
US7098544B2 (en) * 2004-01-06 2006-08-29 International Business Machines Corporation Edge seal for integrated circuit chips

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2209218A1 (en:Method) * 1972-10-18 1974-06-28 Hitachi Ltd
JPS508469A (en:Method) * 1973-05-21 1975-01-28
FR2335960A1 (fr) * 1975-12-18 1977-07-15 Gen Electric Element semi-conducteur perfectionne
FR2339252A1 (fr) * 1976-01-26 1977-08-19 Gen Electric Element semi-conducteur a revetement de protection perfectionne et solution pour la fabrication de ce revetement
FR2363192A1 (fr) * 1976-08-27 1978-03-24 Ibm Procede permettant d'ameliorer l'adherence des lignes conductrices metalliques formees sur une couche de polyimide
FR2363887A1 (fr) * 1976-09-07 1978-03-31 Gen Electric Nouveau procede pour l'attaque chimique de copolymeres polyimide-silicone deposes sur un corps semi-conducteur

Also Published As

Publication number Publication date
GB1230421A (en:Method) 1971-05-05
US3700497A (en) 1972-10-24
NL6813133A (en:Method) 1969-03-18
DE1764977B1 (de) 1972-06-08

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Legal Events

Date Code Title Description
ST Notification of lapse