JPS5527463B2 - - Google Patents
Info
- Publication number
- JPS5527463B2 JPS5527463B2 JP2320973A JP2320973A JPS5527463B2 JP S5527463 B2 JPS5527463 B2 JP S5527463B2 JP 2320973 A JP2320973 A JP 2320973A JP 2320973 A JP2320973 A JP 2320973A JP S5527463 B2 JPS5527463 B2 JP S5527463B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/121—
-
- H10W74/131—
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- H10W72/01515—
-
- H10W72/075—
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- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2320973A JPS5527463B2 (en:Method) | 1973-02-28 | 1973-02-28 | |
| US05/446,792 US3939488A (en) | 1973-02-28 | 1974-02-28 | Method of manufacturing semiconductor device and resulting product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2320973A JPS5527463B2 (en:Method) | 1973-02-28 | 1973-02-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49114356A JPS49114356A (en:Method) | 1974-10-31 |
| JPS5527463B2 true JPS5527463B2 (en:Method) | 1980-07-21 |
Family
ID=12104263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2320973A Expired JPS5527463B2 (en:Method) | 1973-02-28 | 1973-02-28 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US3939488A (en:Method) |
| JP (1) | JPS5527463B2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5833452A (ja) * | 1981-08-25 | 1983-02-26 | 帝人株式会社 | シ−ト |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4096521A (en) * | 1976-07-08 | 1978-06-20 | Motorola Inc. | Protective coating for high voltage devices |
| JPS5390761A (en) * | 1977-01-19 | 1978-08-09 | Matsushita Electric Ind Co Ltd | Semiconductor device |
| US4203792A (en) * | 1977-11-17 | 1980-05-20 | Bell Telephone Laboratories, Incorporated | Method for the fabrication of devices including polymeric materials |
| US4331970A (en) * | 1978-09-18 | 1982-05-25 | General Electric Company | Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation |
| DE2922005A1 (de) * | 1979-05-30 | 1980-12-04 | Siemens Ag | Halbleiterbauelement mit passiviertem halbleiterkoerper |
| JPS57122549A (en) * | 1980-11-08 | 1982-07-30 | Plessey Overseas | Plastic sealed electronic equipment |
| GB2087159B (en) * | 1980-11-08 | 1984-05-10 | Plessey Co Ltd | Plastics encapsulated electronic devices |
| JPS5987840A (ja) * | 1982-11-10 | 1984-05-21 | Toray Silicone Co Ltd | 半導体装置 |
| JPS59198740A (ja) * | 1983-04-25 | 1984-11-10 | Mitsubishi Electric Corp | 樹脂封止形半導体複合素子 |
| US5221641A (en) * | 1991-06-21 | 1993-06-22 | Rohm Co., Ltd. | Process for making light emitting diodes |
| US7041771B1 (en) | 1995-08-11 | 2006-05-09 | Kac Holdings, Inc. | Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
| JP2000511711A (ja) * | 1997-03-18 | 2000-09-05 | オブシェストボ エス オグラノチェノイ オトヴェツトヴェノスチウ（コルヴェト ライツ） | 発光ダイオード |
| DE10213294B4 (de) * | 2002-03-25 | 2015-05-13 | Osram Gmbh | Verwendung eines UV-beständigen Polymers in der Optoelektronik sowie im Außenanwendungsbereich, UV-beständiges Polymer sowie optisches Bauelement |
| US20090233225A1 (en) * | 2008-03-12 | 2009-09-17 | Johnson Donald W | Low chlorine epoxy resin formulations |
| US10497587B1 (en) * | 2018-06-13 | 2019-12-03 | Infineon Technologies Ag | Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3533965A (en) * | 1966-09-13 | 1970-10-13 | Nippon Electric Co | Low expansion material |
| GB1230421A (en:Method) * | 1967-09-15 | 1971-05-05 | ||
| GB1285708A (en) * | 1968-10-28 | 1972-08-16 | Lucas Industries Ltd | Semi-conductor devices |
| US3684592A (en) * | 1969-09-30 | 1972-08-15 | Westinghouse Electric Corp | Passivated surfaces and protective coatings for semiconductor devices and processes for producing the same |
| US3653959A (en) * | 1970-04-14 | 1972-04-04 | Grace W R & Co | Encapsulating and potting composition and process |
| US3696263A (en) * | 1970-05-25 | 1972-10-03 | Gen Telephone & Elect | Solid state light source with optical filter containing metal derivatives of tetraphenylporphin |
| US3749601A (en) * | 1971-04-01 | 1973-07-31 | Hughes Aircraft Co | Encapsulated packaged electronic assembly |
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1973
- 1973-02-28 JP JP2320973A patent/JPS5527463B2/ja not_active Expired
-
1974
- 1974-02-28 US US05/446,792 patent/US3939488A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5833452A (ja) * | 1981-08-25 | 1983-02-26 | 帝人株式会社 | シ−ト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49114356A (en:Method) | 1974-10-31 |
| US3939488A (en) | 1976-02-17 |