FR2363887A1 - Nouveau procede pour l'attaque chimique de copolymeres polyimide-silicone deposes sur un corps semi-conducteur - Google Patents
Nouveau procede pour l'attaque chimique de copolymeres polyimide-silicone deposes sur un corps semi-conducteurInfo
- Publication number
- FR2363887A1 FR2363887A1 FR7727050A FR7727050A FR2363887A1 FR 2363887 A1 FR2363887 A1 FR 2363887A1 FR 7727050 A FR7727050 A FR 7727050A FR 7727050 A FR7727050 A FR 7727050A FR 2363887 A1 FR2363887 A1 FR 2363887A1
- Authority
- FR
- France
- Prior art keywords
- layer
- polyimide
- semiconductor body
- chemical attack
- deposited
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 2
- 229920001296 polysiloxane Polymers 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 239000000126 substance Substances 0.000 title abstract 2
- 239000010410 layer Substances 0.000 abstract 7
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract 1
- 239000011247 coating layer Substances 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229920002120 photoresistant polymer Polymers 0.000 abstract 1
- 239000010936 titanium Substances 0.000 abstract 1
- 229910052719 titanium Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
- H01L21/3121—Layers comprising organo-silicon compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32131—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by physical means only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/945—Special, e.g. metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/95—Multilayer mask including nonradiation sensitive layer
Abstract
L'invention concerne un procédé d'attaque chimique sélective de copolymère polyimide-silicone déposé en couche de revêtement sur un corps semi-conducteur. On dépose, sur la couche de copolymère 28, une couche de titane métal 30 puis une couche de matériau photorésistant 32. On applique sur le tout un cache convenable et fixe les parties non cachées de la couche 32 en les exposant aux UV, puis les développe ce qui élimine les zones non fixées de cette couche 32. On attaque les parties ainsi mises à nu de la couche 30 à l'acide fluoroborique, découvrant alors les parties correspondantes de la couche 28, qui sont, à leur tour, attaquées à laide d'une solution à base de phénol.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/720,584 US4140572A (en) | 1976-09-07 | 1976-09-07 | Process for selective etching of polymeric materials embodying silicones therein |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2363887A1 true FR2363887A1 (fr) | 1978-03-31 |
FR2363887B1 FR2363887B1 (fr) | 1982-05-14 |
Family
ID=24894544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7727050A Granted FR2363887A1 (fr) | 1976-09-07 | 1977-09-07 | Nouveau procede pour l'attaque chimique de copolymeres polyimide-silicone deposes sur un corps semi-conducteur |
Country Status (5)
Country | Link |
---|---|
US (1) | US4140572A (fr) |
JP (1) | JPS5937495B2 (fr) |
DE (1) | DE2739847C2 (fr) |
FR (1) | FR2363887A1 (fr) |
GB (1) | GB1534475A (fr) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4209356A (en) * | 1978-10-18 | 1980-06-24 | General Electric Company | Selective etching of polymeric materials embodying silicones via reactor plasmas |
US4515887A (en) * | 1983-08-29 | 1985-05-07 | General Electric Company | Photopatternable dielectric compositions, method for making and use |
JP2516897B2 (ja) * | 1983-10-21 | 1996-07-24 | 信越化学工業株式会社 | 感光性組成物 |
US4487652A (en) * | 1984-03-30 | 1984-12-11 | Motorola, Inc. | Slope etch of polyimide |
US4670497A (en) * | 1984-10-19 | 1987-06-02 | General Electric Company | Soluble silicone-imide copolymers |
US4586997A (en) * | 1984-10-19 | 1986-05-06 | General Electric Company | Soluble silicone-imide copolymers |
US4701511A (en) * | 1984-10-19 | 1987-10-20 | General Electric Company | Method of making diglyme soluble siloxane-imide copolymers |
US4968757A (en) * | 1984-10-19 | 1990-11-06 | Microsi, Inc. | Soluble silicone-imide copolymers |
JPH0727217B2 (ja) * | 1985-09-30 | 1995-03-29 | 松下電子工業株式会社 | 基板上へのレジストパタ−ン形成方法 |
US4692205A (en) * | 1986-01-31 | 1987-09-08 | International Business Machines Corporation | Silicon-containing polyimides as oxygen etch stop and dual dielectric coatings |
GB2215087B (en) * | 1988-02-03 | 1992-04-01 | Plessey Co Plc | A method of processing substrates for mounting optical elements and components |
US5094919A (en) * | 1988-06-30 | 1992-03-10 | Nippon Steel Chemical Co., Ltd. | Polyimide copolymers and process for preparing the same |
JPH02117041U (fr) * | 1989-03-01 | 1990-09-19 | ||
US5045159A (en) * | 1989-07-18 | 1991-09-03 | International Business Machines Corporation | Derivatives of compounds containing a carbonyl group conjugated to an aromatic moiety and electrophilic methods of fabrication thereof |
CN1061058C (zh) * | 1996-01-09 | 2001-01-24 | 河北工业大学 | 耐热光敏聚酰亚胺 |
CN100375310C (zh) * | 1999-12-21 | 2008-03-12 | 造型逻辑有限公司 | 喷墨制作的集成电路 |
EP1243035B1 (fr) * | 1999-12-21 | 2016-03-02 | Flexenable Limited | Formation d'interconnexions |
GB0130485D0 (en) * | 2001-12-21 | 2002-02-06 | Plastic Logic Ltd | Self-aligned printing |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1580665A (fr) * | 1967-09-15 | 1969-09-05 | ||
US3597269A (en) * | 1969-09-30 | 1971-08-03 | Westinghouse Electric Corp | Surfce stabilization of semiconductor power devices and article |
FR2088333A7 (fr) * | 1970-05-05 | 1972-01-07 | Licentia Gmbh | |
US3846166A (en) * | 1971-09-25 | 1974-11-05 | Hitachi Ltd | Method of producing multilayer wiring structure of integrated circuit |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3024138A (en) * | 1959-09-30 | 1962-03-06 | Curtiss Wright Corp | Method of cleaning |
US3416962A (en) * | 1964-08-05 | 1968-12-17 | Sperry Rand Corp | Preparing etched substances for vacuum deposition of a metal thereon |
US3817844A (en) * | 1968-10-04 | 1974-06-18 | Rohr Corp | Method of electrolitic descaling activating and brightening and plating titanium and its alloys |
US3615913A (en) * | 1968-11-08 | 1971-10-26 | Westinghouse Electric Corp | Polyimide and polyamide-polyimide as a semiconductor surface passivator and protectant coating |
US3657029A (en) * | 1968-12-31 | 1972-04-18 | Texas Instruments Inc | Platinum thin-film metallization method |
US3640778A (en) * | 1969-03-27 | 1972-02-08 | United Aircraft Corp | Coating of titanium alloys |
US3890177A (en) * | 1971-08-27 | 1975-06-17 | Bell Telephone Labor Inc | Technique for the fabrication of air-isolated crossovers |
US3770560A (en) * | 1971-10-21 | 1973-11-06 | American Cyanamid Co | Composite laminate with a thin, perforated outer layer and cavitated bonded backing member |
US3926911A (en) * | 1973-06-07 | 1975-12-16 | Ciba Geigy Corp | Crosslinked polymers containing siloxane groups |
US3871929A (en) * | 1974-01-30 | 1975-03-18 | Allied Chem | Polymeric etch resist strippers and method of using same |
US3978578A (en) * | 1974-08-29 | 1976-09-07 | Fairchild Camera And Instrument Corporation | Method for packaging semiconductor devices |
US3962004A (en) * | 1974-11-29 | 1976-06-08 | Rca Corporation | Pattern definition in an organic layer |
-
1976
- 1976-09-07 US US05/720,584 patent/US4140572A/en not_active Expired - Lifetime
-
1977
- 1977-09-03 DE DE2739847A patent/DE2739847C2/de not_active Expired
- 1977-09-07 JP JP52106839A patent/JPS5937495B2/ja not_active Expired
- 1977-09-07 FR FR7727050A patent/FR2363887A1/fr active Granted
- 1977-09-07 GB GB37300/77A patent/GB1534475A/en not_active Expired
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1580665A (fr) * | 1967-09-15 | 1969-09-05 | ||
US3597269A (en) * | 1969-09-30 | 1971-08-03 | Westinghouse Electric Corp | Surfce stabilization of semiconductor power devices and article |
FR2088333A7 (fr) * | 1970-05-05 | 1972-01-07 | Licentia Gmbh | |
US3846166A (en) * | 1971-09-25 | 1974-11-05 | Hitachi Ltd | Method of producing multilayer wiring structure of integrated circuit |
Non-Patent Citations (1)
Title |
---|
EXBK/76 * |
Also Published As
Publication number | Publication date |
---|---|
FR2363887B1 (fr) | 1982-05-14 |
JPS5937495B2 (ja) | 1984-09-10 |
US4140572A (en) | 1979-02-20 |
DE2739847A1 (de) | 1978-03-09 |
JPS5344012A (en) | 1978-04-20 |
GB1534475A (en) | 1978-12-06 |
DE2739847C2 (de) | 1985-09-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |