FR1492275A - Procédé permettant de relier un microcircuit à des dispositifs électriques extérieurs - Google Patents

Procédé permettant de relier un microcircuit à des dispositifs électriques extérieurs

Info

Publication number
FR1492275A
FR1492275A FR68569A FR68569A FR1492275A FR 1492275 A FR1492275 A FR 1492275A FR 68569 A FR68569 A FR 68569A FR 68569 A FR68569 A FR 68569A FR 1492275 A FR1492275 A FR 1492275A
Authority
FR
France
Prior art keywords
microcircuit
electrical devices
external electrical
external
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR68569A
Other languages
English (en)
Inventor
Georges Ortino
Yves Suel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RADIOTECHNIQUE COPRIM RTC
Original Assignee
RADIOTECHNIQUE COPRIM RTC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RADIOTECHNIQUE COPRIM RTC filed Critical RADIOTECHNIQUE COPRIM RTC
Priority to FR68569A priority Critical patent/FR1492275A/fr
Priority to US649545A priority patent/US3500013A/en
Priority to GB30680/67A priority patent/GB1177517A/en
Priority to DE1665253A priority patent/DE1665253C3/de
Application granted granted Critical
Publication of FR1492275A publication Critical patent/FR1492275A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10924—Leads formed from a punched metal foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Resistance Welding (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
FR68569A 1966-07-07 1966-07-07 Procédé permettant de relier un microcircuit à des dispositifs électriques extérieurs Expired FR1492275A (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR68569A FR1492275A (fr) 1966-07-07 1966-07-07 Procédé permettant de relier un microcircuit à des dispositifs électriques extérieurs
US649545A US3500013A (en) 1966-07-07 1967-06-28 Method of making connections to a microcircuit
GB30680/67A GB1177517A (en) 1966-07-07 1967-07-04 Method of Securing a Connecting Wire to a Microcircuit.
DE1665253A DE1665253C3 (de) 1966-07-07 1967-07-21 Verfahren zum Verbinden mindestens eines Anschlußdrahtes mit einer Mikroschaltung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR68569A FR1492275A (fr) 1966-07-07 1966-07-07 Procédé permettant de relier un microcircuit à des dispositifs électriques extérieurs

Publications (1)

Publication Number Publication Date
FR1492275A true FR1492275A (fr) 1967-08-18

Family

ID=8612763

Family Applications (1)

Application Number Title Priority Date Filing Date
FR68569A Expired FR1492275A (fr) 1966-07-07 1966-07-07 Procédé permettant de relier un microcircuit à des dispositifs électriques extérieurs

Country Status (4)

Country Link
US (1) US3500013A (fr)
DE (1) DE1665253C3 (fr)
FR (1) FR1492275A (fr)
GB (1) GB1177517A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2424689A1 (fr) * 1978-04-28 1979-11-23 Comatel Perfectionnements apportes aux contacts a souder

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3689684A (en) * 1971-02-05 1972-09-05 Du Pont Lead frame connector and electronic packages containing same
CH557618A (fr) * 1972-07-07 1974-12-31 Oscilloquartz Sa Procede de fabrication d'un resonateur piezo-electrique et, resonateur obtenu par ce procede.
EP0158230B1 (fr) * 1984-04-11 1987-07-29 Siemens Aktiengesellschaft Transducteur piézo-électrique-acoustique pour cellules électroacoustiques avec mise en oeuvre de construction pour l'assemblage
US5192843A (en) * 1991-03-14 1993-03-09 Aluminum Company Of America Pin attachment tool and method of capacitive brazing
JP3132287B2 (ja) * 1994-04-27 2001-02-05 株式会社村田製作所 電子部品用端子連及びその製造装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3126619A (en) * 1964-03-31 E brent
GB929828A (en) * 1958-10-14 1963-06-26 Emi Ltd Improvements in or relating to methods of soldering conductors to semi-conducting elements

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2424689A1 (fr) * 1978-04-28 1979-11-23 Comatel Perfectionnements apportes aux contacts a souder

Also Published As

Publication number Publication date
US3500013A (en) 1970-03-10
DE1665253A1 (de) 1970-11-05
DE1665253B2 (de) 1977-12-29
GB1177517A (en) 1970-01-14
DE1665253C3 (de) 1978-09-07

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