FR1211000A - Procédé et appareil pour la fabrication de transistors - Google Patents
Procédé et appareil pour la fabrication de transistorsInfo
- Publication number
- FR1211000A FR1211000A FR1211000DA FR1211000A FR 1211000 A FR1211000 A FR 1211000A FR 1211000D A FR1211000D A FR 1211000DA FR 1211000 A FR1211000 A FR 1211000A
- Authority
- FR
- France
- Prior art keywords
- manufacturing transistors
- transistors
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J7/00—Micromanipulators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8536—Bonding interfaces of the semiconductor or solid state body
- H01L2224/85365—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8593—Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US690595A US2928931A (en) | 1957-09-26 | 1957-09-26 | Fabrication of electrical devices |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1211000A true FR1211000A (fr) | 1960-03-11 |
Family
ID=24773110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1211000D Expired FR1211000A (fr) | 1957-09-26 | 1958-09-23 | Procédé et appareil pour la fabrication de transistors |
Country Status (6)
Country | Link |
---|---|
US (1) | US2928931A (fr) |
BE (1) | BE571509A (fr) |
CH (1) | CH367568A (fr) |
DE (1) | DE1165755B (fr) |
FR (1) | FR1211000A (fr) |
GB (1) | GB902530A (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3045715A (en) * | 1958-11-12 | 1962-07-24 | Western Electric Co | Apparatus for mounting wires on articles |
US3042792A (en) * | 1959-05-12 | 1962-07-03 | Philips Corp | Method and device for the machine soldering of a crystal to the cathode portion of crystal diodes |
US3149510A (en) * | 1960-07-05 | 1964-09-22 | Kulicke & Soffa Mfg Co | Fine wire manipulator and bonding instrument for transistors |
NL269297A (fr) * | 1960-10-06 | 1900-01-01 | ||
US3050617A (en) * | 1960-10-31 | 1962-08-21 | Electroglas Inc | Thermocompression lead bonding aparatus |
US3048690A (en) * | 1960-11-02 | 1962-08-07 | Bell Telephone Labor Inc | Bonding apparatus |
US3186446A (en) * | 1961-05-09 | 1965-06-01 | Sylvania Electric Prod | Apparatus for attaching filamentary material |
DE1266886B (de) * | 1961-07-08 | 1968-04-25 | Siemens Ag | Verfahren zum stumpfen Verschweissen eines Anschlussdrahtes an einen Gehaeuseteil eines Halbleiterkleingleichrichters |
US3230338A (en) * | 1962-07-02 | 1966-01-18 | Ibm | Selective heating apparatus |
NL301740A (fr) * | 1963-01-02 | 1900-01-01 | ||
DE1223061B (de) * | 1964-03-12 | 1966-08-18 | Telefunken Patent | Verfahren zum Kontaktieren von Halbleitersystemen |
US3337710A (en) * | 1964-05-11 | 1967-08-22 | Western Electric Co | Apparatus for forming and attaching an elongated element to an article |
EP0539989B1 (fr) | 1991-11-01 | 1997-06-18 | SOLVAY (Société Anonyme) | Procédé pour préparer 1,1,1,2,3,3,3-heptafluoropropane (R 227) |
CN107050658B (zh) * | 2017-04-17 | 2023-07-25 | 宁波中哲医疗科技有限公司 | 一种碳棒自动更换设备 |
CN109625943B (zh) * | 2019-01-23 | 2023-12-29 | 广陵区兴维机电设备经营部 | 一种刷柄抓取送料装置及其方法 |
CN110497363B (zh) * | 2019-08-22 | 2023-03-17 | 陕西科技大学 | 一种模块化宏微结合的三自由度微夹持平台及其使用方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2734119A (en) * | 1956-02-07 | Method of forming and welding pins to | ||
US2283158A (en) * | 1940-12-31 | 1942-05-12 | Bell Telephone Labor Inc | Solder connecting apparatus |
US2354028A (en) * | 1943-02-11 | 1944-07-18 | Kershaw Henry | Method of producing flush contacts |
US2677173A (en) * | 1947-06-20 | 1954-05-04 | Sylvania Electric Prod | Automatic machine for forming and mounting crystal diode electrodes |
US2683205A (en) * | 1951-02-07 | 1954-07-06 | Gen Electric | Machine for making crystal rectifiers and the like |
BE517459A (fr) * | 1952-02-07 | |||
GB774800A (en) * | 1954-05-03 | 1957-05-15 | Gen Electric Co Ltd | Improvements in or relating to the manufacture of semi-conductor devices |
NL98752C (fr) * | 1955-02-04 | |||
US2813191A (en) * | 1955-11-07 | 1957-11-12 | Western Electric Co | Resistance soldering fixture |
US2796512A (en) * | 1955-11-29 | 1957-06-18 | Western Electric Co | Assembly fixture |
-
0
- BE BE571509D patent/BE571509A/xx unknown
- DE DENDAT1165755D patent/DE1165755B/de active Pending
-
1957
- 1957-09-26 US US690595A patent/US2928931A/en not_active Expired - Lifetime
-
1958
- 1958-08-29 CH CH6342158A patent/CH367568A/de unknown
- 1958-09-23 FR FR1211000D patent/FR1211000A/fr not_active Expired
- 1958-09-26 GB GB30810/58A patent/GB902530A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE1165755B (de) | 1964-03-19 |
CH367568A (de) | 1963-02-28 |
GB902530A (en) | 1962-08-01 |
US2928931A (en) | 1960-03-15 |
BE571509A (fr) | 1900-01-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR1210936A (fr) | Procédé et appareillage pour la fabrication de courroies et courroies en résultant | |
FR1215279A (fr) | Procédé et appareil de réfrigération | |
FR1211000A (fr) | Procédé et appareil pour la fabrication de transistors | |
FR1221091A (fr) | Procédé et appareil pour la fabrication des pneumatiques | |
CH397618A (fr) | Procédé et appareil pour la fabrication du diphényle | |
FR1184558A (fr) | Procédé et dispositif pour la fabrication de saucisses | |
FR1206050A (fr) | Dispositifs semi-conducteurs et procédé pour les fabriquer | |
FR1198796A (fr) | Procédé et appareil de fabrication de fermetures étanches | |
FR1235191A (fr) | Procédé et appareil pour la fabrication des transistors alliés | |
FR1208430A (fr) | Procédé et dispositif pour la fabrication de plomb tétraéthyle | |
FR1197466A (fr) | Procédé et appareil pour la fabrication de profilés tréfilés en résine de polyester | |
FR1214352A (fr) | Dispositif semi-conducteur et procédé pour le fabriquer | |
FR1212929A (fr) | Procédé et appareil de soudage de boîtes | |
FR1195239A (fr) | Procédé et appareil pour la rééducation de la voix | |
FR1256430A (fr) | Procédé et appareil utilisables pour la fabrication des pneumatiques | |
FR1201308A (fr) | Procédé et dispositif pour la fabrication de fascines | |
FR1169824A (fr) | Procédé et appareil pour la fabrication de pièces manufacturées en plâtre | |
BE585948A (fr) | Appareil à semi-conducteurs et procédé pour sa fabrication. | |
FR1145296A (fr) | Procédé et appareil pour la fabrication de tubes | |
FR1197571A (fr) | Procédé et appareils pour la fabrication de tournevis | |
FR1250787A (fr) | Procédé et appareil de fabrication de lingots | |
FR1170552A (fr) | Procédé et appareil pour la métallisation de portées intérieures | |
FR1294975A (fr) | Procédé et appareil pour la fabrication de tuyaux thermoplastiques | |
FR1226011A (fr) | Procédé et appareil pour la fabrication de boîtes | |
BE581219A (fr) | Procédé et appareil pour la fabrication de semi-conducteurs. |