FR1198796A - Procédé et appareil de fabrication de fermetures étanches - Google Patents
Procédé et appareil de fabrication de fermetures étanchesInfo
- Publication number
- FR1198796A FR1198796A FR1198796DA FR1198796A FR 1198796 A FR1198796 A FR 1198796A FR 1198796D A FR1198796D A FR 1198796DA FR 1198796 A FR1198796 A FR 1198796A
- Authority
- FR
- France
- Prior art keywords
- making tight
- tight closures
- closures
- making
- tight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/32—Sealing leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Joining Of Glass To Other Materials (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US863022XA | 1957-04-24 | 1957-04-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1198796A true FR1198796A (fr) | 1959-12-09 |
Family
ID=22197659
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1198796D Expired FR1198796A (fr) | 1957-04-24 | 1958-02-10 | Procédé et appareil de fabrication de fermetures étanches |
Country Status (4)
Country | Link |
---|---|
BE (1) | BE566982A (fr) |
DE (1) | DE1085262B (fr) |
FR (1) | FR1198796A (fr) |
GB (1) | GB863022A (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3088299A (en) * | 1960-07-14 | 1963-05-07 | Philco Corp | Method of making glass to metal seal |
NL272139A (fr) * | 1960-12-15 | 1900-01-01 | ||
DE1639574B1 (de) * | 1961-07-27 | 1969-09-04 | Tokyo Shibaura Electric Co | Vorrichtung zum Verkapseln eines Halbleiterelements unter Schutzgas |
NL281748A (fr) * | 1961-08-18 | |||
US3214651A (en) * | 1961-10-27 | 1965-10-26 | Westinghouse Electric Corp | Semiconductor device base electrode assembly and process for producing the same |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH222880A (de) * | 1940-03-27 | 1942-08-15 | Philips Nv | Vorrichtung mit einer vakuum- und gasdichten Einschmelzung und Verfahren zur Herstellung dieser Vorrichtung. |
BE462923A (fr) * | 1944-04-04 | |||
DE1764699U (de) * | 1955-02-04 | 1958-04-10 | Siemens Ag | Richtleiter- oder transistoranordnung. |
-
0
- BE BE566982D patent/BE566982A/xx unknown
-
1958
- 1958-02-10 FR FR1198796D patent/FR1198796A/fr not_active Expired
- 1958-04-23 DE DEP20554A patent/DE1085262B/de active Pending
- 1958-04-24 GB GB13022/58A patent/GB863022A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
BE566982A (fr) | |
DE1085262B (de) | 1960-07-14 |
GB863022A (en) | 1961-03-15 |
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