FR1235191A - Procédé et appareil pour la fabrication des transistors alliés - Google Patents

Procédé et appareil pour la fabrication des transistors alliés

Info

Publication number
FR1235191A
FR1235191A FR805195A FR805195A FR1235191A FR 1235191 A FR1235191 A FR 1235191A FR 805195 A FR805195 A FR 805195A FR 805195 A FR805195 A FR 805195A FR 1235191 A FR1235191 A FR 1235191A
Authority
FR
France
Prior art keywords
manufacturing alloy
transistors
alloy transistors
manufacturing
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR805195A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Application granted granted Critical
Publication of FR1235191A publication Critical patent/FR1235191A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
FR805195A 1958-09-16 1959-09-15 Procédé et appareil pour la fabrication des transistors alliés Expired FR1235191A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US761402A US3073006A (en) 1958-09-16 1958-09-16 Method and apparatus for the fabrication of alloyed transistors

Publications (1)

Publication Number Publication Date
FR1235191A true FR1235191A (fr) 1960-07-01

Family

ID=25062071

Family Applications (1)

Application Number Title Priority Date Filing Date
FR805195A Expired FR1235191A (fr) 1958-09-16 1959-09-15 Procédé et appareil pour la fabrication des transistors alliés

Country Status (3)

Country Link
US (1) US3073006A (fr)
FR (1) FR1235191A (fr)
GB (1) GB879492A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3175274A (en) * 1960-05-20 1965-03-30 Columbia Broadcasting Syst Inc Method for applying electrodes to semiconductor devices
NL267267A (fr) * 1960-07-20
DE1230917B (de) * 1962-03-03 1966-12-22 Telefunken Patent Vorrichtung zum Legieren von Halbleiterkristallen
US3373481A (en) * 1965-06-22 1968-03-19 Sperry Rand Corp Method of electrically interconnecting conductors
US3271507A (en) * 1965-11-02 1966-09-06 Alloys Unltd Inc Flat package for semiconductors

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL175652B (nl) * 1952-02-07 Krings Josef Glijschoen voor een spaninrichting van een greppelbouwinrichting.
US2699594A (en) * 1952-02-27 1955-01-18 Sylvania Electric Prod Method of assembling semiconductor units
US2862470A (en) * 1953-11-19 1958-12-02 Raytheon Mfg Co Transistor mold assemblies
GB774388A (en) * 1954-01-28 1957-05-08 Marconi Wireless Telegraph Co Improvements in or relating to semi-conducting amplifiers
US2846626A (en) * 1954-07-28 1958-08-05 Raytheon Mfg Co Junction transistors and methods of forming them
US2743693A (en) * 1954-11-22 1956-05-01 Motorola Inc Transistor assembly jig
US2796563A (en) * 1955-06-10 1957-06-18 Bell Telephone Labor Inc Semiconductive devices
NL276978A (fr) * 1956-09-05

Also Published As

Publication number Publication date
US3073006A (en) 1963-01-15
GB879492A (en) 1961-10-11

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