FR1245591A - Procédé et appareil de fabrication d'éléments semi-conducteurs - Google Patents

Procédé et appareil de fabrication d'éléments semi-conducteurs

Info

Publication number
FR1245591A
FR1245591A FR801564A FR801564A FR1245591A FR 1245591 A FR1245591 A FR 1245591A FR 801564 A FR801564 A FR 801564A FR 801564 A FR801564 A FR 801564A FR 1245591 A FR1245591 A FR 1245591A
Authority
FR
France
Prior art keywords
semiconductor elements
manufacturing semiconductor
manufacturing
elements
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR801564A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of FR1245591A publication Critical patent/FR1245591A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/04—Joining glass to metal by means of an interlayer
    • C03C27/042—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts
    • C03C27/044—Joining glass to metal by means of an interlayer consisting of a combination of materials selected from glass, glass-ceramic or ceramic material with metals, metal oxides or metal salts of glass, glass-ceramic or ceramic material only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/20—Seals between parts of vessels
    • H01J5/22—Vacuum-tight joints between parts of vessel
    • H01J5/24—Vacuum-tight joints between parts of vessel between insulating parts of vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0037—Solid sealing members other than lamp bases
    • H01J2893/0038—Direct connection between two insulating elements, in particular via glass material
    • H01J2893/0039—Glass-to-glass connection, e.g. by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Die Bonding (AREA)
  • Packaging Frangible Articles (AREA)
FR801564A 1958-07-31 1959-07-30 Procédé et appareil de fabrication d'éléments semi-conducteurs Expired FR1245591A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US752307A US3077754A (en) 1958-07-31 1958-07-31 Apparatus for making semiconductor units

Publications (1)

Publication Number Publication Date
FR1245591A true FR1245591A (fr) 1960-11-10

Family

ID=25025741

Family Applications (1)

Application Number Title Priority Date Filing Date
FR801564A Expired FR1245591A (fr) 1958-07-31 1959-07-30 Procédé et appareil de fabrication d'éléments semi-conducteurs

Country Status (6)

Country Link
US (1) US3077754A (fr)
CH (1) CH377002A (fr)
DE (1) DE1150154B (fr)
FR (1) FR1245591A (fr)
GB (1) GB874816A (fr)
NL (2) NL241700A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1639574B1 (de) * 1961-07-27 1969-09-04 Tokyo Shibaura Electric Co Vorrichtung zum Verkapseln eines Halbleiterelements unter Schutzgas

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3273989A (en) * 1963-12-20 1966-09-20 Western Electric Co Apparatus for assembling switches

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US828318A (en) * 1905-07-13 1906-08-14 Henry C Fry Apparatus for forming hollow glass articles.
US1436197A (en) * 1921-04-02 1922-11-21 Vacuum Glass Machine Company Machine for the manufacture of vacuum-wall containers
US2432491A (en) * 1939-03-06 1947-12-09 Hygrade Sylvania Corp Apparatus for lamp bulb sealing
US2508233A (en) * 1941-08-21 1950-05-16 Hartford Nat Bank & Trust Co Method of producing a gas-tight joint between a glass object and a metal object which have mutually different coefficients of expansion
FR926001A (fr) * 1945-05-02 1947-10-01
US2455317A (en) * 1945-08-03 1948-11-30 Nat Union Radio Corp Tube sealing machine
US2522949A (en) * 1947-12-11 1950-09-19 Western Electric Co Sealing fixture
US2480364A (en) * 1948-08-20 1949-08-30 Western Electric Co Apparatus for assembling and sealing glass and metal parts
NL87381C (fr) * 1950-03-31
US2779134A (en) * 1952-01-03 1957-01-29 Sylvania Electric Prod Semiconductor assembling apparatus
GB753135A (en) * 1953-08-28 1956-07-18 Standard Telephones Cables Ltd Improvements in or relating to dry rectifiers
US2736847A (en) * 1954-05-10 1956-02-28 Hughes Aircraft Co Fused-junction silicon diodes
US2815608A (en) * 1955-01-03 1957-12-10 Hughes Aircraft Co Semiconductor envelope sealing device and method
US2877603A (en) * 1955-04-01 1959-03-17 Hughes Aircraft Co Object joining and sealing device
US2902796A (en) * 1955-09-27 1959-09-08 Western Electric Co Method and apparatus for sealing metal to glass

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1639574B1 (de) * 1961-07-27 1969-09-04 Tokyo Shibaura Electric Co Vorrichtung zum Verkapseln eines Halbleiterelements unter Schutzgas

Also Published As

Publication number Publication date
CH377002A (de) 1964-04-30
US3077754A (en) 1963-02-19
GB874816A (en) 1961-08-10
NL241700A (fr)
NL113343C (fr) 1966-06-15
DE1150154B (de) 1963-06-12

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