FR1153749A - Procédé de fabrication d'éléments semi-conducteurs - Google Patents
Procédé de fabrication d'éléments semi-conducteursInfo
- Publication number
- FR1153749A FR1153749A FR1153749DA FR1153749A FR 1153749 A FR1153749 A FR 1153749A FR 1153749D A FR1153749D A FR 1153749DA FR 1153749 A FR1153749 A FR 1153749A
- Authority
- FR
- France
- Prior art keywords
- manufacturing process
- semiconductor elements
- semiconductor
- elements
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/12—Etching of semiconducting materials
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US51745355A | 1955-06-23 | 1955-06-23 | |
| US55969556A | 1956-01-17 | 1956-01-17 | |
| US637972A US2937124A (en) | 1955-06-23 | 1957-02-04 | Method of fabricating semiconductive devices and the like |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1153749A true FR1153749A (fr) | 1958-03-20 |
Family
ID=27414665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1153749D Expired FR1153749A (fr) | 1955-06-23 | 1956-06-06 | Procédé de fabrication d'éléments semi-conducteurs |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US2937124A (enrdf_load_stackoverflow) |
| BE (1) | BE564480A (enrdf_load_stackoverflow) |
| DE (1) | DE1072045B (enrdf_load_stackoverflow) |
| FR (1) | FR1153749A (enrdf_load_stackoverflow) |
| GB (1) | GB834821A (enrdf_load_stackoverflow) |
| NL (2) | NL104994C (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3012921A (en) * | 1958-08-20 | 1961-12-12 | Philco Corp | Controlled jet etching of semiconductor units |
| US3058895A (en) * | 1958-11-10 | 1962-10-16 | Anocut Eng Co | Electrolytic shaping |
| DE1248169B (de) * | 1958-06-18 | 1967-08-24 | Siemens Ag | Verfahren zur Oberflaechenbehandlung von Halbleiterbauelementen mit einem stroemenden AEtzmittel |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1165583A (fr) | 1956-12-03 | 1958-10-27 | Procédé et appareillage pour le traitement chimique ou électrolytique des surfaces | |
| DE1225017B (de) | 1957-06-05 | 1966-09-15 | Westinghouse Electric Corp | Vorrichtung zur Behandlung der Oberflaeche von Halbleiteranordnungen mit pn-UEbergang |
| US3039514A (en) * | 1959-01-16 | 1962-06-19 | Philco Corp | Fabrication of semiconductor devices |
| GB919158A (en) * | 1959-02-26 | 1963-02-20 | Mullard Ltd | Improvements in methods of etching bodies |
| NL125378C (enrdf_load_stackoverflow) * | 1959-11-27 | |||
| US3172831A (en) * | 1960-06-15 | 1965-03-09 | Anocut Eng Co | Grinding machine |
| US3384567A (en) * | 1965-10-22 | 1968-05-21 | Gen Electric | Electrolyte guide member |
| US3409534A (en) * | 1965-12-29 | 1968-11-05 | Gen Electric | Electrolytic material removal apparatus |
| US3630795A (en) * | 1969-07-25 | 1971-12-28 | North American Rockwell | Process and system for etching metal films using galvanic action |
| US3793170A (en) * | 1971-06-09 | 1974-02-19 | Trw Inc | Electrochemical machining method and apparatus |
| GB1445296A (en) * | 1973-04-21 | 1976-08-11 | Inoue Japax Res | Electrical discharge machining |
| GB1464404A (en) * | 1974-11-06 | 1977-02-16 | Rolls Royce | Electrical leakage control in electrochemical machine tools electrolyte drains systems |
| US4174261A (en) * | 1976-07-16 | 1979-11-13 | Pellegrino Peter P | Apparatus for electroplating, deplating or etching |
| DE2705158C2 (de) * | 1977-02-04 | 1986-02-27 | Schering AG, 1000 Berlin und 4709 Bergkamen | Verfahren zum Teilgalvanisieren |
| US4289947A (en) * | 1978-03-02 | 1981-09-15 | Inoue-Japax Research Incorporated | Fluid jetting system for electrical machining |
| JPS56102590A (en) * | 1979-08-09 | 1981-08-17 | Koichi Shimamura | Method and device for plating of microarea |
| US4344809A (en) * | 1980-09-29 | 1982-08-17 | Wensink Ben L | Jet etch apparatus for decapsulation of molded devices |
| US4359360A (en) * | 1981-12-10 | 1982-11-16 | The United States Of America As Represented By The Secretary Of The Air Force | Apparatus for selectively jet etching a plastic encapsulating an article |
| US6344106B1 (en) | 2000-06-12 | 2002-02-05 | International Business Machines Corporation | Apparatus, and corresponding method, for chemically etching substrates |
| DE102005011298A1 (de) * | 2005-03-04 | 2006-09-07 | Gebr. Schmid Gmbh & Co. | Vorrichtung und Verfahren zum Ätzen von Substraten |
| US9645108B2 (en) * | 2012-06-01 | 2017-05-09 | California Institute Of Technology | Scanning drop sensor |
| RU2640213C1 (ru) * | 2016-12-30 | 2017-12-27 | Федеральное государственное автономное научное учреждение "Центральный научно-исследовательский и опытно-конструкторский институт робототехники и технической кибернетики" (ЦНИИ РТК) | Способ струйного электролитно-плазменного полирования металлических изделий сложного профиля и устройство для его реализации |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1114592A (en) * | 1914-02-26 | 1914-10-20 | Clinton C De Witt | Hydropneumatic window-cleaning apparatus. |
| US1654727A (en) * | 1925-07-13 | 1928-01-03 | Green Edward William | Apparatus for removing normally viscous liquid from surfaces |
| US1814866A (en) * | 1926-09-30 | 1931-07-14 | American Laundry Machinery Co | Carpet cleaning machine |
| DE565765C (de) * | 1929-07-24 | 1932-12-08 | Vladimir Gusseff | Verfahren und Vorrichtung zur elektrolytischen Bearbeitung von Metallen |
| US1982345A (en) * | 1930-06-13 | 1934-11-27 | James B Kirby | Window washer |
| US2523018A (en) * | 1946-12-12 | 1950-09-19 | Paper Patents Co | Method of cylinder etching and machine therefor |
| US2568803A (en) * | 1949-06-09 | 1951-09-25 | Guenst William | Etching machine |
-
0
- NL NL208297D patent/NL208297A/xx unknown
- NL NL104994D patent/NL104994C/xx active
- DE DENDAT1072045D patent/DE1072045B/de active Pending
- BE BE564480D patent/BE564480A/xx unknown
-
1956
- 1956-06-06 FR FR1153749D patent/FR1153749A/fr not_active Expired
- 1956-06-19 GB GB18921/56A patent/GB834821A/en not_active Expired
-
1957
- 1957-02-04 US US637972A patent/US2937124A/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1248169B (de) * | 1958-06-18 | 1967-08-24 | Siemens Ag | Verfahren zur Oberflaechenbehandlung von Halbleiterbauelementen mit einem stroemenden AEtzmittel |
| US3012921A (en) * | 1958-08-20 | 1961-12-12 | Philco Corp | Controlled jet etching of semiconductor units |
| DE1183600B (de) * | 1958-08-20 | 1964-12-17 | Philco Corp Eine Ges Nach Den | Verfahren und Vorrichtung zum Reinigen von Teilen der Oberflaeche eines Halbleiterkoerpers von Halbleiterbauelementen durch einen Fluessigkeitsstrahl |
| US3058895A (en) * | 1958-11-10 | 1962-10-16 | Anocut Eng Co | Electrolytic shaping |
Also Published As
| Publication number | Publication date |
|---|---|
| NL208297A (enrdf_load_stackoverflow) | |
| NL104994C (enrdf_load_stackoverflow) | |
| BE564480A (enrdf_load_stackoverflow) | |
| DE1072045B (de) | 1959-12-24 |
| US2937124A (en) | 1960-05-17 |
| GB834821A (en) | 1960-05-11 |
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