FR1153749A - Manufacturing process of semiconductor elements - Google Patents

Manufacturing process of semiconductor elements

Info

Publication number
FR1153749A
FR1153749A FR1153749DA FR1153749A FR 1153749 A FR1153749 A FR 1153749A FR 1153749D A FR1153749D A FR 1153749DA FR 1153749 A FR1153749 A FR 1153749A
Authority
FR
France
Prior art keywords
manufacturing process
semiconductor elements
semiconductor
elements
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxar Space LLC
Original Assignee
Philco Ford Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philco Ford Corp filed Critical Philco Ford Corp
Application granted granted Critical
Publication of FR1153749A publication Critical patent/FR1153749A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/12—Etching of semiconducting materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
FR1153749D 1955-06-23 1956-06-06 Manufacturing process of semiconductor elements Expired FR1153749A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51745355A 1955-06-23 1955-06-23
US55969556A 1956-01-17 1956-01-17
US637972A US2937124A (en) 1955-06-23 1957-02-04 Method of fabricating semiconductive devices and the like

Publications (1)

Publication Number Publication Date
FR1153749A true FR1153749A (en) 1958-03-20

Family

ID=27414665

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1153749D Expired FR1153749A (en) 1955-06-23 1956-06-06 Manufacturing process of semiconductor elements

Country Status (6)

Country Link
US (1) US2937124A (en)
BE (1) BE564480A (en)
DE (1) DE1072045B (en)
FR (1) FR1153749A (en)
GB (1) GB834821A (en)
NL (2) NL208297A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3012921A (en) * 1958-08-20 1961-12-12 Philco Corp Controlled jet etching of semiconductor units
US3058895A (en) * 1958-11-10 1962-10-16 Anocut Eng Co Electrolytic shaping
DE1248169B (en) * 1958-06-18 1967-08-24 Siemens Ag Process for the surface treatment of semiconductor components with a flowing etchant

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039514A (en) * 1959-01-16 1962-06-19 Philco Corp Fabrication of semiconductor devices
GB919158A (en) * 1959-02-26 1963-02-20 Mullard Ltd Improvements in methods of etching bodies
NL125378C (en) * 1959-11-27
US3172831A (en) * 1960-06-15 1965-03-09 Anocut Eng Co Grinding machine
US3384567A (en) * 1965-10-22 1968-05-21 Gen Electric Electrolyte guide member
US3409534A (en) * 1965-12-29 1968-11-05 Gen Electric Electrolytic material removal apparatus
US3630795A (en) * 1969-07-25 1971-12-28 North American Rockwell Process and system for etching metal films using galvanic action
US3793170A (en) * 1971-06-09 1974-02-19 Trw Inc Electrochemical machining method and apparatus
GB1445296A (en) * 1973-04-21 1976-08-11 Inoue Japax Res Electrical discharge machining
GB1464404A (en) * 1974-11-06 1977-02-16 Rolls Royce Electrical leakage control in electrochemical machine tools electrolyte drains systems
US4174261A (en) * 1976-07-16 1979-11-13 Pellegrino Peter P Apparatus for electroplating, deplating or etching
DE2705158C2 (en) * 1977-02-04 1986-02-27 Schering AG, 1000 Berlin und 4709 Bergkamen Partial plating process
US4289947A (en) * 1978-03-02 1981-09-15 Inoue-Japax Research Incorporated Fluid jetting system for electrical machining
JPS56102590A (en) * 1979-08-09 1981-08-17 Koichi Shimamura Method and device for plating of microarea
US4344809A (en) * 1980-09-29 1982-08-17 Wensink Ben L Jet etch apparatus for decapsulation of molded devices
US4359360A (en) * 1981-12-10 1982-11-16 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for selectively jet etching a plastic encapsulating an article
US6344106B1 (en) 2000-06-12 2002-02-05 International Business Machines Corporation Apparatus, and corresponding method, for chemically etching substrates
DE102005011298A1 (en) * 2005-03-04 2006-09-07 Gebr. Schmid Gmbh & Co. Apparatus and method for etching substrates
US9645108B2 (en) * 2012-06-01 2017-05-09 California Institute Of Technology Scanning drop sensor
RU2640213C1 (en) * 2016-12-30 2017-12-27 Федеральное государственное автономное научное учреждение "Центральный научно-исследовательский и опытно-конструкторский институт робототехники и технической кибернетики" (ЦНИИ РТК) Method ofelectrolytic plasma processing of metal products of complex profile and device for its realization

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1114592A (en) * 1914-02-26 1914-10-20 Clinton C De Witt Hydropneumatic window-cleaning apparatus.
US1654727A (en) * 1925-07-13 1928-01-03 Green Edward William Apparatus for removing normally viscous liquid from surfaces
US1814866A (en) * 1926-09-30 1931-07-14 American Laundry Machinery Co Carpet cleaning machine
DE565765C (en) * 1929-07-24 1932-12-08 Vladimir Gusseff Method and device for the electrolytic processing of metals
US1982345A (en) * 1930-06-13 1934-11-27 James B Kirby Window washer
US2523018A (en) * 1946-12-12 1950-09-19 Paper Patents Co Method of cylinder etching and machine therefor
US2568803A (en) * 1949-06-09 1951-09-25 Guenst William Etching machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248169B (en) * 1958-06-18 1967-08-24 Siemens Ag Process for the surface treatment of semiconductor components with a flowing etchant
US3012921A (en) * 1958-08-20 1961-12-12 Philco Corp Controlled jet etching of semiconductor units
DE1183600B (en) * 1958-08-20 1964-12-17 Philco Corp Eine Ges Nach Den Method and device for cleaning parts of the surface of a semiconductor body of semiconductor components by means of a liquid jet
US3058895A (en) * 1958-11-10 1962-10-16 Anocut Eng Co Electrolytic shaping

Also Published As

Publication number Publication date
NL208297A (en)
DE1072045B (en) 1959-12-24
BE564480A (en)
US2937124A (en) 1960-05-17
GB834821A (en) 1960-05-11
NL104994C (en)

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