NL104994C - - Google Patents

Info

Publication number
NL104994C
NL104994C NL104994DA NL104994C NL 104994 C NL104994 C NL 104994C NL 104994D A NL104994D A NL 104994DA NL 104994 C NL104994 C NL 104994C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL104994C publication Critical patent/NL104994C/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063Electrolytic etching
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/02Etching
    • C25F3/12Etching of semiconducting materials
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/02Etching
    • C25F3/14Etching locally
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
NL104994D 1955-06-23 NL104994C (enrdf_load_stackoverflow)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51745355A 1955-06-23 1955-06-23
US55969556A 1956-01-17 1956-01-17
US637972A US2937124A (en) 1955-06-23 1957-02-04 Method of fabricating semiconductive devices and the like

Publications (1)

Publication Number Publication Date
NL104994C true NL104994C (enrdf_load_stackoverflow)

Family

ID=27414665

Family Applications (2)

Application Number Title Priority Date Filing Date
NL208297D NL208297A (enrdf_load_stackoverflow) 1955-06-23
NL104994D NL104994C (enrdf_load_stackoverflow) 1955-06-23

Family Applications Before (1)

Application Number Title Priority Date Filing Date
NL208297D NL208297A (enrdf_load_stackoverflow) 1955-06-23

Country Status (6)

Country Link
US (1) US2937124A (enrdf_load_stackoverflow)
BE (1) BE564480A (enrdf_load_stackoverflow)
DE (1) DE1072045B (enrdf_load_stackoverflow)
FR (1) FR1153749A (enrdf_load_stackoverflow)
GB (1) GB834821A (enrdf_load_stackoverflow)
NL (2) NL104994C (enrdf_load_stackoverflow)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1165583A (fr) 1956-12-03 1958-10-27 Procédé et appareillage pour le traitement chimique ou électrolytique des surfaces
DE1225017B (de) 1957-06-05 1966-09-15 Westinghouse Electric Corp Vorrichtung zur Behandlung der Oberflaeche von Halbleiteranordnungen mit pn-UEbergang
NL239732A (enrdf_load_stackoverflow) 1958-06-18
US3012921A (en) * 1958-08-20 1961-12-12 Philco Corp Controlled jet etching of semiconductor units
US3058895A (en) * 1958-11-10 1962-10-16 Anocut Eng Co Electrolytic shaping
US3039514A (en) * 1959-01-16 1962-06-19 Philco Corp Fabrication of semiconductor devices
GB919158A (en) * 1959-02-26 1963-02-20 Mullard Ltd Improvements in methods of etching bodies
NL125378C (enrdf_load_stackoverflow) * 1959-11-27
US3172831A (en) * 1960-06-15 1965-03-09 Anocut Eng Co Grinding machine
US3384567A (en) * 1965-10-22 1968-05-21 Gen Electric Electrolyte guide member
US3409534A (en) * 1965-12-29 1968-11-05 Gen Electric Electrolytic material removal apparatus
US3630795A (en) * 1969-07-25 1971-12-28 North American Rockwell Process and system for etching metal films using galvanic action
US3793170A (en) * 1971-06-09 1974-02-19 Trw Inc Electrochemical machining method and apparatus
GB1445296A (en) * 1973-04-21 1976-08-11 Inoue Japax Res Electrical discharge machining
GB1464404A (en) * 1974-11-06 1977-02-16 Rolls Royce Electrical leakage control in electrochemical machine tools electrolyte drains systems
US4174261A (en) * 1976-07-16 1979-11-13 Pellegrino Peter P Apparatus for electroplating, deplating or etching
DE2705158C2 (de) * 1977-02-04 1986-02-27 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zum Teilgalvanisieren
US4289947A (en) * 1978-03-02 1981-09-15 Inoue-Japax Research Incorporated Fluid jetting system for electrical machining
JPS56102590A (en) * 1979-08-09 1981-08-17 Koichi Shimamura Method and device for plating of microarea
US4344809A (en) * 1980-09-29 1982-08-17 Wensink Ben L Jet etch apparatus for decapsulation of molded devices
US4359360A (en) * 1981-12-10 1982-11-16 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for selectively jet etching a plastic encapsulating an article
US6344106B1 (en) 2000-06-12 2002-02-05 International Business Machines Corporation Apparatus, and corresponding method, for chemically etching substrates
DE102005011298A1 (de) * 2005-03-04 2006-09-07 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zum Ätzen von Substraten
US9645108B2 (en) * 2012-06-01 2017-05-09 California Institute Of Technology Scanning drop sensor
RU2640213C1 (ru) * 2016-12-30 2017-12-27 Федеральное государственное автономное научное учреждение "Центральный научно-исследовательский и опытно-конструкторский институт робототехники и технической кибернетики" (ЦНИИ РТК) Способ струйного электролитно-плазменного полирования металлических изделий сложного профиля и устройство для его реализации

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1114592A (en) * 1914-02-26 1914-10-20 Clinton C De Witt Hydropneumatic window-cleaning apparatus.
US1654727A (en) * 1925-07-13 1928-01-03 Green Edward William Apparatus for removing normally viscous liquid from surfaces
US1814866A (en) * 1926-09-30 1931-07-14 American Laundry Machinery Co Carpet cleaning machine
DE565765C (de) * 1929-07-24 1932-12-08 Vladimir Gusseff Verfahren und Vorrichtung zur elektrolytischen Bearbeitung von Metallen
US1982345A (en) * 1930-06-13 1934-11-27 James B Kirby Window washer
US2523018A (en) * 1946-12-12 1950-09-19 Paper Patents Co Method of cylinder etching and machine therefor
US2568803A (en) * 1949-06-09 1951-09-25 Guenst William Etching machine

Also Published As

Publication number Publication date
FR1153749A (fr) 1958-03-20
NL208297A (enrdf_load_stackoverflow)
BE564480A (enrdf_load_stackoverflow)
DE1072045B (de) 1959-12-24
US2937124A (en) 1960-05-17
GB834821A (en) 1960-05-11

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