FI962277A0 - Loed- eller tennknoelstruktur foer oinkapslade mikrokretsar - Google Patents
Loed- eller tennknoelstruktur foer oinkapslade mikrokretsarInfo
- Publication number
- FI962277A0 FI962277A0 FI962277A FI962277A FI962277A0 FI 962277 A0 FI962277 A0 FI 962277A0 FI 962277 A FI962277 A FI 962277A FI 962277 A FI962277 A FI 962277A FI 962277 A0 FI962277 A0 FI 962277A0
- Authority
- FI
- Finland
- Prior art keywords
- tennknoelstruktur
- oinkapslade
- microcret
- loed
- eller
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
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- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/05124—Aluminium [Al] as principal constituent
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI962277A FI962277A0 (fi) | 1996-05-31 | 1996-05-31 | Loed- eller tennknoelstruktur foer oinkapslade mikrokretsar |
EP97924046A EP0958606A1 (en) | 1996-05-31 | 1997-05-30 | Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof |
AU29642/97A AU2964297A (en) | 1996-05-31 | 1997-05-30 | Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof |
PCT/FI1997/000331 WO1997045871A1 (en) | 1996-05-31 | 1997-05-30 | Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof |
JP09541692A JP2000511001A (ja) | 1996-05-31 | 1997-05-30 | カプセル化されないマイクロ回路用のはんだ合金又は錫接触バンプ構造と同時にそれを製造するための手順 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI962277A FI962277A0 (fi) | 1996-05-31 | 1996-05-31 | Loed- eller tennknoelstruktur foer oinkapslade mikrokretsar |
Publications (1)
Publication Number | Publication Date |
---|---|
FI962277A0 true FI962277A0 (fi) | 1996-05-31 |
Family
ID=8546126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI962277A FI962277A0 (fi) | 1996-05-31 | 1996-05-31 | Loed- eller tennknoelstruktur foer oinkapslade mikrokretsar |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0958606A1 (ja) |
JP (1) | JP2000511001A (ja) |
AU (1) | AU2964297A (ja) |
FI (1) | FI962277A0 (ja) |
WO (1) | WO1997045871A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2799578B1 (fr) | 1999-10-08 | 2003-07-18 | St Microelectronics Sa | Procede de realisation de connexions electriques sur un boitier semi-conducteur et boitier semi-conducteur |
US6413851B1 (en) * | 2001-06-12 | 2002-07-02 | Advanced Interconnect Technology, Ltd. | Method of fabrication of barrier cap for under bump metal |
TWI225899B (en) * | 2003-02-18 | 2005-01-01 | Unitive Semiconductor Taiwan C | Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4782380A (en) * | 1987-01-22 | 1988-11-01 | Advanced Micro Devices, Inc. | Multilayer interconnection for integrated circuit structure having two or more conductive metal layers |
US4880708A (en) * | 1988-07-05 | 1989-11-14 | Motorola, Inc. | Metallization scheme providing adhesion and barrier properties |
JPH07321114A (ja) * | 1994-05-23 | 1995-12-08 | Sharp Corp | 半導体装置のハンダバンプ形成の方法および構造 |
US5587336A (en) * | 1994-12-09 | 1996-12-24 | Vlsi Technology | Bump formation on yielded semiconductor dies |
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1996
- 1996-05-31 FI FI962277A patent/FI962277A0/fi not_active Application Discontinuation
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1997
- 1997-05-30 JP JP09541692A patent/JP2000511001A/ja not_active Ceased
- 1997-05-30 EP EP97924046A patent/EP0958606A1/en not_active Withdrawn
- 1997-05-30 AU AU29642/97A patent/AU2964297A/en not_active Abandoned
- 1997-05-30 WO PCT/FI1997/000331 patent/WO1997045871A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU2964297A (en) | 1998-01-05 |
JP2000511001A (ja) | 2000-08-22 |
EP0958606A1 (en) | 1999-11-24 |
WO1997045871A1 (en) | 1997-12-04 |
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