AU2964297A - Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof - Google Patents

Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof

Info

Publication number
AU2964297A
AU2964297A AU29642/97A AU2964297A AU2964297A AU 2964297 A AU2964297 A AU 2964297A AU 29642/97 A AU29642/97 A AU 29642/97A AU 2964297 A AU2964297 A AU 2964297A AU 2964297 A AU2964297 A AU 2964297A
Authority
AU
Australia
Prior art keywords
microcircuits
unencapsulated
production
well
solder alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU29642/97A
Inventor
Jorma Kivilahti
Petteri Palm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ELCOTEQ NETWORK Oy
Original Assignee
ELCOTEQ NETWORK Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ELCOTEQ NETWORK Oy filed Critical ELCOTEQ NETWORK Oy
Publication of AU2964297A publication Critical patent/AU2964297A/en
Abandoned legal-status Critical Current

Links

Classifications

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
AU29642/97A 1996-05-31 1997-05-30 Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof Abandoned AU2964297A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI962277 1996-05-31
FI962277A FI962277A0 (en) 1996-05-31 1996-05-31 Loed- eller tennknoelstruktur Foer oinkapslade microcret
PCT/FI1997/000331 WO1997045871A1 (en) 1996-05-31 1997-05-30 Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof

Publications (1)

Publication Number Publication Date
AU2964297A true AU2964297A (en) 1998-01-05

Family

ID=8546126

Family Applications (1)

Application Number Title Priority Date Filing Date
AU29642/97A Abandoned AU2964297A (en) 1996-05-31 1997-05-30 Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof

Country Status (5)

Country Link
EP (1) EP0958606A1 (en)
JP (1) JP2000511001A (en)
AU (1) AU2964297A (en)
FI (1) FI962277A0 (en)
WO (1) WO1997045871A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2799578B1 (en) 1999-10-08 2003-07-18 St Microelectronics Sa METHOD FOR MAKING ELECTRICAL CONNECTIONS ON A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
TW531873B (en) * 2001-06-12 2003-05-11 Advanced Interconnect Tech Ltd Barrier cap for under bump metal
TWI225899B (en) * 2003-02-18 2005-01-01 Unitive Semiconductor Taiwan C Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4782380A (en) * 1987-01-22 1988-11-01 Advanced Micro Devices, Inc. Multilayer interconnection for integrated circuit structure having two or more conductive metal layers
US4880708A (en) * 1988-07-05 1989-11-14 Motorola, Inc. Metallization scheme providing adhesion and barrier properties
JPH07321114A (en) * 1994-05-23 1995-12-08 Sharp Corp Method of formation and structure of solder bump for semiconductor device
US5587336A (en) * 1994-12-09 1996-12-24 Vlsi Technology Bump formation on yielded semiconductor dies

Also Published As

Publication number Publication date
FI962277A0 (en) 1996-05-31
JP2000511001A (en) 2000-08-22
WO1997045871A1 (en) 1997-12-04
EP0958606A1 (en) 1999-11-24

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