FI962277A0 - Loed- eller tennknoelstruktur Foer oinkapslade microcret - Google Patents
Loed- eller tennknoelstruktur Foer oinkapslade microcretInfo
- Publication number
- FI962277A0 FI962277A0 FI962277A FI962277A FI962277A0 FI 962277 A0 FI962277 A0 FI 962277A0 FI 962277 A FI962277 A FI 962277A FI 962277 A FI962277 A FI 962277A FI 962277 A0 FI962277 A0 FI 962277A0
- Authority
- FI
- Finland
- Prior art keywords
- tennknoelstruktur
- oinkapslade
- microcret
- loed
- eller
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L2224/05001—Internal layers
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- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/05124—Aluminium [Al] as principal constituent
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI962277A FI962277A0 (en) | 1996-05-31 | 1996-05-31 | Loed- eller tennknoelstruktur Foer oinkapslade microcret |
EP97924046A EP0958606A1 (en) | 1996-05-31 | 1997-05-30 | Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof |
JP09541692A JP2000511001A (en) | 1996-05-31 | 1997-05-30 | Procedures for producing solder alloy or tin contact bump structures for non-encapsulated microcircuits simultaneously |
PCT/FI1997/000331 WO1997045871A1 (en) | 1996-05-31 | 1997-05-30 | Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof |
AU29642/97A AU2964297A (en) | 1996-05-31 | 1997-05-30 | Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI962277A FI962277A0 (en) | 1996-05-31 | 1996-05-31 | Loed- eller tennknoelstruktur Foer oinkapslade microcret |
Publications (1)
Publication Number | Publication Date |
---|---|
FI962277A0 true FI962277A0 (en) | 1996-05-31 |
Family
ID=8546126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI962277A FI962277A0 (en) | 1996-05-31 | 1996-05-31 | Loed- eller tennknoelstruktur Foer oinkapslade microcret |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0958606A1 (en) |
JP (1) | JP2000511001A (en) |
AU (1) | AU2964297A (en) |
FI (1) | FI962277A0 (en) |
WO (1) | WO1997045871A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2799578B1 (en) * | 1999-10-08 | 2003-07-18 | St Microelectronics Sa | METHOD FOR MAKING ELECTRICAL CONNECTIONS ON A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE |
TW531873B (en) * | 2001-06-12 | 2003-05-11 | Advanced Interconnect Tech Ltd | Barrier cap for under bump metal |
TWI225899B (en) * | 2003-02-18 | 2005-01-01 | Unitive Semiconductor Taiwan C | Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4782380A (en) * | 1987-01-22 | 1988-11-01 | Advanced Micro Devices, Inc. | Multilayer interconnection for integrated circuit structure having two or more conductive metal layers |
US4880708A (en) * | 1988-07-05 | 1989-11-14 | Motorola, Inc. | Metallization scheme providing adhesion and barrier properties |
JPH07321114A (en) * | 1994-05-23 | 1995-12-08 | Sharp Corp | Method of formation and structure of solder bump for semiconductor device |
US5587336A (en) * | 1994-12-09 | 1996-12-24 | Vlsi Technology | Bump formation on yielded semiconductor dies |
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1996
- 1996-05-31 FI FI962277A patent/FI962277A0/en not_active Application Discontinuation
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1997
- 1997-05-30 JP JP09541692A patent/JP2000511001A/en not_active Ceased
- 1997-05-30 AU AU29642/97A patent/AU2964297A/en not_active Abandoned
- 1997-05-30 WO PCT/FI1997/000331 patent/WO1997045871A1/en not_active Application Discontinuation
- 1997-05-30 EP EP97924046A patent/EP0958606A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
AU2964297A (en) | 1998-01-05 |
EP0958606A1 (en) | 1999-11-24 |
WO1997045871A1 (en) | 1997-12-04 |
JP2000511001A (en) | 2000-08-22 |
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