FI944972A0 - Levymäinen lämmönsiirtolaite - Google Patents

Levymäinen lämmönsiirtolaite

Info

Publication number
FI944972A0
FI944972A0 FI944972A FI944972A FI944972A0 FI 944972 A0 FI944972 A0 FI 944972A0 FI 944972 A FI944972 A FI 944972A FI 944972 A FI944972 A FI 944972A FI 944972 A0 FI944972 A0 FI 944972A0
Authority
FI
Finland
Prior art keywords
disc
heat transfer
transfer device
shaped heat
shaped
Prior art date
Application number
FI944972A
Other languages
English (en)
Swedish (sv)
Other versions
FI944972A (fi
Inventor
Yung Lee
Hern Jin Park
Original Assignee
Sunkyong Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sunkyong Ind Ltd filed Critical Sunkyong Ind Ltd
Publication of FI944972A0 publication Critical patent/FI944972A0/fi
Publication of FI944972A publication Critical patent/FI944972A/fi

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00—Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Building Environments (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Separation By Low-Temperature Treatments (AREA)
  • Road Paving Structures (AREA)
FI944972A 1992-04-22 1994-10-21 Levymäinen lämmönsiirtolaite FI944972A (fi)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019920006789A KR100204304B1 (ko) 1992-04-22 1992-04-22 판상형 열전달장치
PCT/KR1993/000029 WO1993021490A1 (en) 1992-04-22 1993-04-21 Plate type heat transfer device

Publications (2)

Publication Number Publication Date
FI944972A0 true FI944972A0 (fi) 1994-10-21
FI944972A FI944972A (fi) 1994-12-21

Family

ID=19332150

Family Applications (1)

Application Number Title Priority Date Filing Date
FI944972A FI944972A (fi) 1992-04-22 1994-10-21 Levymäinen lämmönsiirtolaite

Country Status (10)

Country Link
US (1) US5660229A (fi)
EP (1) EP0636238B1 (fi)
JP (1) JPH07505703A (fi)
KR (1) KR100204304B1 (fi)
CA (1) CA2134086C (fi)
DE (1) DE69312925T2 (fi)
FI (1) FI944972A (fi)
NO (1) NO300242B1 (fi)
RU (1) RU2101646C1 (fi)
WO (1) WO1993021490A1 (fi)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0914875A (ja) * 1995-06-29 1997-01-17 Akutoronikusu Kk 多孔扁平金属管ヒートパイプ式熱交換器
US6745825B1 (en) 1997-03-13 2004-06-08 Fujitsu Limited Plate type heat pipe
US5848637A (en) * 1997-04-29 1998-12-15 Lee; Richard Quick defrosting pad
SG64996A1 (en) * 1997-07-08 1999-05-25 Dso National Laborataries A heat sink
US6062302A (en) * 1997-09-30 2000-05-16 Lucent Technologies Inc. Composite heat sink
US6935409B1 (en) 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US7305843B2 (en) * 1999-06-08 2007-12-11 Thermotek, Inc. Heat pipe connection system and method
TW452642B (en) * 1999-09-07 2001-09-01 Furukawa Electric Co Ltd Wick, plate type heat pipe and container
US6530420B1 (en) * 1999-09-17 2003-03-11 Sanyo Electric Co., Ltd. Heat carrier
JP2002016204A (ja) * 2000-06-28 2002-01-18 Ts Heatronics Co Ltd 受放熱構造体
JP2002016203A (ja) * 2000-06-28 2002-01-18 Ts Heatronics Co Ltd 低温用蛇行細管ヒートパイプ
US6679316B1 (en) * 2000-10-02 2004-01-20 The United States Of America As Represented By The Secretary Of The Air Force Passive thermal spreader and method
KR100406921B1 (ko) * 2001-06-15 2003-12-03 주식회사 엘지화학 온돌 패널을 이용한 조립식 난방 시스템
SG120884A1 (en) * 2001-08-28 2006-04-26 Advanced Materials Tech Advanced microelectronic heat dissipation package and method for its manufacture
US7198096B2 (en) * 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US7857037B2 (en) * 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
WO2003046463A2 (en) * 2001-11-27 2003-06-05 Parish Overton L Stacked low profile cooling system and method for making same
TW530935U (en) * 2002-07-26 2003-05-01 Tai Sol Electronics Co Ltd Heat dissipation apparatus for lower-connect type integrated circuit
US20060278370A1 (en) * 2005-06-08 2006-12-14 Uwe Rockenfeller Heat spreader for cooling electronic components
US20080251065A1 (en) * 2005-09-11 2008-10-16 Gurin Michael H Supercritical Flat Panel Collector and Methods of Use
US7770632B2 (en) * 2007-09-26 2010-08-10 Coolit Systems, Inc. Thermosiphon for laptop computers comprising a boiling chamber with a square wave partition
NL2005208A (en) * 2009-09-28 2011-03-29 Asml Netherlands Bv Heat pipe, lithographic apparatus and device manufacturing method.
US20130039819A1 (en) * 2011-08-09 2013-02-14 Asia Vital Components Co., Ltd. Vapor chamber and method of manufacturing same
US10694641B2 (en) 2016-04-29 2020-06-23 Intel Corporation Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms
WO2019039445A1 (ja) * 2017-08-23 2019-02-28 古河電気工業株式会社 ヒートパイプ及びヒートパイプの製造方法
CN109307305A (zh) * 2018-08-01 2019-02-05 赵耀华 一种干式接触式平板热管地板辐射采暖方法及采暖系统
JP2020128838A (ja) * 2019-02-08 2020-08-27 株式会社デンソー 熱輸送システム

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2350348A (en) * 1942-12-21 1944-06-06 Gen Motors Corp Heat transfer device
US3572426A (en) * 1967-10-05 1971-03-23 Gen Electric Underwater heat exchange system
GB1425472A (en) * 1972-01-27 1976-02-18 Applegate G Thermal conductive or heat transfer elements
NL7206063A (nl) * 1972-05-04 1973-11-06 N.V. Philips Gloeilampenfabrieken Verwarmingsinrichting
JPS5948480B2 (ja) * 1976-11-12 1984-11-27 日本電信電話株式会社 電荷転送素子の多重化方式
US4377198A (en) * 1980-10-14 1983-03-22 Motorola Inc. Passive, recyclable cooling system for missile electronics
JPS5795413A (en) * 1980-12-05 1982-06-14 Meidensha Electric Mfg Co Ltd Heat panel
JPS63220090A (ja) * 1987-03-06 1988-09-13 Hisaka Works Ltd 作動流体を封入した板状伝熱エレメントおよびこれを用いた熱交換器
US4770238A (en) * 1987-06-30 1988-09-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Capillary heat transport and fluid management device
AU628369B2 (en) * 1988-08-22 1992-09-17 Robert Kenneth Prudhoe Passive heat transfer building panel

Also Published As

Publication number Publication date
RU2101646C1 (ru) 1998-01-10
EP0636238A1 (en) 1995-02-01
JPH07505703A (ja) 1995-06-22
FI944972A (fi) 1994-12-21
NO300242B1 (no) 1997-04-28
NO944002L (no) 1994-12-21
US5660229A (en) 1997-08-26
DE69312925D1 (de) 1997-09-11
WO1993021490A1 (en) 1993-10-28
EP0636238B1 (en) 1997-08-06
KR930022046A (ko) 1993-11-23
CA2134086C (en) 1999-03-09
CA2134086A1 (en) 1993-10-28
RU94045843A (ru) 1996-09-10
NO944002D0 (no) 1994-10-21
KR100204304B1 (ko) 1999-06-15
DE69312925T2 (de) 1998-03-12

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