DE69321446T2 - Kühlungseinrichtung - Google Patents

Kühlungseinrichtung

Info

Publication number
DE69321446T2
DE69321446T2 DE69321446T DE69321446T DE69321446T2 DE 69321446 T2 DE69321446 T2 DE 69321446T2 DE 69321446 T DE69321446 T DE 69321446T DE 69321446 T DE69321446 T DE 69321446T DE 69321446 T2 DE69321446 T2 DE 69321446T2
Authority
DE
Germany
Prior art keywords
cooling device
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69321446T
Other languages
English (en)
Other versions
DE69321446D1 (de
Inventor
Kazuo Sato
Mitsuhiro Shikida
Shigeo Ohashi
Toshio Hatada
Noriyuki Ashiwake
Shinji Tanaka
Takeshi Harada
Yukio Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP32642292A external-priority patent/JP3182941B2/ja
Priority claimed from JP5027763A external-priority patent/JPH06244332A/ja
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE69321446D1 publication Critical patent/DE69321446D1/de
Application granted granted Critical
Publication of DE69321446T2 publication Critical patent/DE69321446T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
    • F04B43/04—Pumps having electric drive
    • F04B43/043—Micropumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B45/00—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
    • F04B45/04—Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having plate-like flexible members, e.g. diaphragms
    • F04B45/047—Pumps having electric drive
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K99/00—Subject matter not provided for in other groups of this subclass
    • H02K99/20—Motors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
    • H02N1/002—Electrostatic motors
    • H02N1/006—Electrostatic motors of the gap-closing type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69321446T 1992-12-07 1993-12-06 Kühlungseinrichtung Expired - Fee Related DE69321446T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32642292A JP3182941B2 (ja) 1992-12-07 1992-12-07 冷却デバイス
JP5027763A JPH06244332A (ja) 1993-02-17 1993-02-17 電磁駆動型冷却デバイス

Publications (2)

Publication Number Publication Date
DE69321446D1 DE69321446D1 (de) 1998-11-12
DE69321446T2 true DE69321446T2 (de) 1999-04-01

Family

ID=26365735

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69321446T Expired - Fee Related DE69321446T2 (de) 1992-12-07 1993-12-06 Kühlungseinrichtung

Country Status (4)

Country Link
US (1) US5488255A (de)
EP (1) EP0601516B1 (de)
KR (1) KR970011621B1 (de)
DE (1) DE69321446T2 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5705018A (en) * 1995-12-13 1998-01-06 Hartley; Frank T. Micromachined peristaltic pump
CA2267086A1 (en) * 1996-10-03 1998-04-09 Didier Maillefer Micro-machined device for fluids and method of manufacture
FR2760076B1 (fr) * 1997-02-21 1999-05-07 Cryotechnologies Dispositif de refroidissement cryogenique a oscillateur de pression a double effet
FR2760075B1 (fr) * 1997-02-21 1999-05-28 Cryotechnologies Systeme de conditionnement de composants fonctionnant a temperature cryogenique
IT1303597B1 (it) * 1998-12-09 2000-11-14 Fiat Ricerche Dispositivo ottico e stato di funzionamento variabile, in particolareotturatore o specchio, a controllo elettrostatico.
SE514735C2 (sv) * 1998-12-11 2001-04-09 Ericsson Telefon Ab L M Anordning för ökande av värmeavgivning
JP3831159B2 (ja) * 1999-10-18 2006-10-11 日本圧着端子製造株式会社 コネクタ付電子モジュール
IT1319911B1 (it) * 2000-02-24 2003-11-12 Fiat Ricerche Motore elettrostatico comprendente uno statore ed un rotore aventisuperfici fra loro cooperanti con diversa curvatura.
JPWO2004004000A1 (ja) * 2002-06-26 2005-11-04 富士通株式会社 半導体装置への電源接続構造
US6988706B2 (en) * 2003-12-17 2006-01-24 General Electric Company Piezoelectric microvalve
US20060284313A1 (en) * 2005-06-15 2006-12-21 Yongqian Wang Low stress chip attachment with shape memory materials
US7427566B2 (en) * 2005-12-09 2008-09-23 General Electric Company Method of making an electronic device cooling system
US20090200007A1 (en) * 2008-02-13 2009-08-13 Lockheed Martin Corporation Heat exchanger having temperature-actuated valves
US7619894B2 (en) * 2008-02-22 2009-11-17 Inventec Corporation Heat dissipation device
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US8681495B2 (en) 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
US9249962B2 (en) 2011-06-20 2016-02-02 Koninklijke Philips N.V. Active cooling device with electro-statically moving electrode and method of active cooling with electro-statically moving electrode
US8681496B2 (en) 2012-01-25 2014-03-25 Toyota Motor Engineering & Manufacturing North America, Inc. Cooling apparatuses, electronic device assemblies, and cooling assemblies using magnetic shape memory members
US10018429B2 (en) * 2014-08-13 2018-07-10 Asia Vital Components Co., Ltd. Apparatus body heat dissipation device
US10744295B2 (en) 2015-01-13 2020-08-18 ResMed Pty Ltd Respiratory therapy apparatus
CN110113900B (zh) * 2019-05-22 2020-11-10 温州乐控节能科技有限公司 一种超伺服控制器
CN216407869U (zh) * 2021-06-22 2022-04-29 科际精密股份有限公司 气压调节装置
EP4155540A1 (de) * 2021-09-28 2023-03-29 Laclaree Elektrostatisch betätigte vorrichtung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5008582A (en) * 1988-01-29 1991-04-16 Kabushiki Kaisha Toshiba Electronic device having a cooling element
US5132873A (en) * 1988-09-30 1992-07-21 Microelectronics And Computer Technology Corporation Diaphragm sealing apparatus
US4935864A (en) * 1989-06-20 1990-06-19 Digital Equipment Corporation Localized cooling apparatus for cooling integrated circuit devices

Also Published As

Publication number Publication date
EP0601516A1 (de) 1994-06-15
KR940016715A (ko) 1994-07-23
EP0601516B1 (de) 1998-10-07
DE69321446D1 (de) 1998-11-12
KR970011621B1 (ko) 1997-07-12
US5488255A (en) 1996-01-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee