FI86943B - Push-fit assembly plate for installing electronic components and method for manufacture of the same - Google Patents
Push-fit assembly plate for installing electronic components and method for manufacture of the same Download PDFInfo
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- FI86943B FI86943B FI852798A FI852798A FI86943B FI 86943 B FI86943 B FI 86943B FI 852798 A FI852798 A FI 852798A FI 852798 A FI852798 A FI 852798A FI 86943 B FI86943 B FI 86943B
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- plate
- metal plate
- opening
- recess
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23—Sheet including cover or casing
- Y10T428/239—Complete cover or casing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
- Y10T428/24331—Composite web or sheet including nonapertured component
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Description
8694386943
PAINOKYTKENTÄLEVY ELEKTRONISTEN OSIEN ASENTAMISEKSI JA MENETELMIÄ SEN VALMISTAMISEKSI - TRYCKKOPPLINGSPLÄT FÖR MONTERING AV ELEKTRONISKA DELAR OOH FÖRFARANDEN FÖR TILL-VERKNING AV DENPRESSURE SWITCH PLATE FOR INSTALLATION OF ELECTRONIC COMPONENTS AND METHODS FOR ITS MANUFACTURE - TRYCKKOPPLINGSPLÄT FÖR MONTERING AV ELEKTRONISKA DELAR OOH FÖRFARANDEN FÖR TILL-VERKNING AV DEN
Tämän keksinnön kohteena on vaatimuksen 1 johdannon mukainen painokytkentälevy, jota käytetään elektronisten osien, kuten erilaisten lastujen ja puolijohdeosien, asentamiseksi ja menetelmiä tällaisen painokytkentälevyn valmistamiseksi.The present invention relates to a printed circuit board according to the preamble of claim 1, which is used for mounting electronic components such as various chips and semiconductor components, and to methods for manufacturing such a printed circuit board.
Keksinnön erityisenä tarkoituksena on aikaansaada painokytkentälevy, jolla on erittäin hyvät lämmön dispergointiomi-naisuudet, joka lämpö syntyy asennetuista elektronisista osista ja joka levy on huomattavan kosteusvarma sekä menetelmiä tällaisen painokytkentälevyn valmistamiseksi.It is a particular object of the invention to provide a printed circuit board which has very good thermal dispersion properties, which heat is generated from the installed electronic components and which board is remarkably moisture-proof, and methods for manufacturing such a printed circuit board.
Tavanomaisia painokytkentälevyjä, jotka on suunniteltu elektronisten osien asentamista varten, käytetään yleensä piirilevyinä kelloissa, kameroissa ja vastaavissa. Tällaisten levyjen käytöllä on se etu, että ne mahdollistavat koon ja paksuuden pienentämisen tuotteissa, jotka on valmistettu käyttämällä näitä levyjä.Conventional printed circuit boards designed for the installation of electronic components are generally used as circuit boards in watches, cameras, and the like. The use of such sheets has the advantage that they allow the size and thickness to be reduced in products made using these sheets.
Muovia ja keraamisia aineita käytetään materiaalina painokytkentä levyjen valmistuksessa, muovin ollessa yleisimmin käytetty. Yleensä muoviset painokytkentälevyt voidaan tehdä täsmälleen halutuilla mitoilla ja ne ovat vahvempia mekaanisia iskuja vastaan kuin keraamisesta materiaalista, kuten aluminiumoksidista valmistetut. Kuitenkin muovin lämmönjohtavuus on erittäin alhainen, vain n. 1/60 alumini-umoksidin lämmönjohtavuudesta. Tästä syystä konventionaaliset muovilevyt eivät edelleenkään ole tyydyttäviä käytettäessä niitä levyinä integroitujen piirien asentamista varten, joilla on suuri integraatioskaala tai elektronisten osien, jotka vaativat suuren tehon.Plastic and ceramic materials are used as the material for the production of printed circuit boards, with plastic being the most commonly used. In general, plastic printed circuit boards can be made to exactly the desired dimensions and are stronger against mechanical shocks than those made of ceramic material such as alumina. However, the thermal conductivity of plastic is very low, only about 1/60 of the thermal conductivity of alumina. For this reason, conventional plastic sheets are still unsatisfactory when used as sheets for the installation of integrated circuits with a large integration scale or electronic components that require high power.
2 86943 Tämän ongelman poistamiseksi on esitetty useita ehdotuksia, kuten jäljempänä tullaan selittämään, sellaisen painokyt-kentälevyn muodostamiseksi, jossa suuren lämmönjohtavuuden omaava metallilevy sovitetaan muovilevyyn ja elektroniset osat asennetaan suoraan metallilevyn päälle lämpödispersion parantamiseksi.2 86943 To overcome this problem, several proposals have been made, as will be explained below, for forming a printed circuit board in which a metal plate having high thermal conductivity is fitted to a plastic plate and electronic components are mounted directly on the metal plate to improve thermal dispersion.
Japanilaisessa hyödyllisyysmallissa 10060/79 on esitetty painokytkentälevy puolijohteiden ja mikropiirilastujen asentamista varten. Tässä painokytkentälevyssä on tietyn syvyinen syvennys aikaansaatu siihen osaan levyä, johon puolijohteet ja IC-lastut asennetaan ja mainittuun uraan on tehty erityisen konfiguraation omaava, läpi ulottuva reikä, jolloin reiän ympärillä oleva alue on suunniteltu tukialueeksi, johon on asetettu ohut metallilevy puolijohteita ja IC-lastuja varten. Tällaisessa painokytkentälevyssä on kuitenkin se epäkohta, että jos levyä valmistettaessa lisätään syvennyksen pinta-alaa horisontaalisessa suunnassa, vähenee puolestaan levyn pinnassa oleva tila, joka on tarkoitettu piireille. Niinpä on välttämätöntä suurentaa painokytkentä levy n pinta-alaa, jotta piirit sopisivat. Sen sijaan, jos mainitun syvennyksen horisontaalinen pinta-ala on pieni, pienenee tukialueen pinta-ala vastaavasti aiheuttaen vastakkaista adheesiota metallilevyn ja tukialueen välillä. Lisäksi tarvitaan erittäin suurta tarkkuutta työstettäessä syvennyksen sisäpintaa ja metallilevyä metallilevyn sovittamiseksi tiiviisti uraan. Tämä lisää valmistuskustannuksia ja vähentää tuottavuutta. Ongelmana on myös elektronisten osien lyhentynyt käyttöikä, koska ei voida estää ilman kosteuden tunkeutumista elektronisiin komponentteihin, jotka on asennettu syvennyksessä olevalle metallilevylle.The Japanese utility model 10060/79 discloses a printed circuit board for the installation of semiconductors and microcircuit chips. In this printed circuit board, a recess of a certain depth is provided in the part of the board in which the semiconductors and IC chips are mounted and in said groove a specially configured, through-extending hole is formed, the area around the hole being designed as a support area with a thin metal plate for. However, such a printed circuit board has the disadvantage that if the surface area of the recess is increased in the horizontal direction during the manufacture of the board, the space on the surface of the board intended for circuits is reduced. Thus, it is necessary to increase the area of the printed circuit board's to make the circuits fit. Instead, if the horizontal area of said recess is small, the area of the support area decreases correspondingly, causing opposite adhesion between the metal plate and the support area. In addition, very high precision is required when machining the inner surface of the recess and the metal plate to fit the metal plate tightly into the groove. This increases manufacturing costs and reduces productivity. A shortened service life of the electronic components is also a problem, as it is not possible to prevent the ingress of air moisture into the electronic components mounted on the metal plate in the recess.
Japanilainen hyödyllisyysmalli 172970/81 esittää piirilevyn kelloja varten, jossa levyssä on laminoitu vahvistava materiaali, kuten metalli tai keraaminen materiaali, johon on li 3 86943 muodostettu syvennys LSI:n asentamiseksi sen jälkeen kun mainittu vahviste on laminoitu piirilevyyn.Japanese Utility Model 172970/81 discloses a circuit board for watches having a laminated reinforcing material, such as a metal or ceramic material, in which a recess is formed to mount an LSI after said reinforcement is laminated to the circuit board.
Tällainen laite ei kuitenkaan estä kosteuden tunkeutumista levyä ja vahvistetta sitovan adhesiivisen kerroksen läpi uraan, johon LSI on asennettu, mikä lyhentää LSI:n kestoikää .However, such a device does not prevent moisture from penetrating through the adhesive layer binding the board and the reinforcement into the groove in which the LSI is mounted, which shortens the life of the LSI.
Japanilainen patenttijulkaisu 166056/82 esittää integroidun modulin, joka periaatteessa muodostuu painokytkentälevystä ja loogisista yksiköistä eli lastuista, jotka on siihen kiinnitetty, jossa modulissa on yksi- tai kaksikerroksinen aukolla varustettu tukipohja, jonka aukon läpi tukipohjaan liitetyn lämpödissipaattorin osa ulottuu ja modulin sille puolelle, joka on vastakkainen tukipohjalle, on suoraan kiinnitetty mainitut loogiset yksiköt lämpödissipaattorin mainittuun osaan väliaineella, jolla suuri lämmönjohtavuus.Japanese Patent Publication No. 166056/82 discloses an integrated module consisting essentially of a printed circuit board and logic units, i.e. chips attached thereto, the module having a single or double layer support base with an opening through which a portion of the thermal diffuser connected to the support base extends and opposite to the support base, said logical units are directly attached to said part of the heat dispenser by a medium having a high thermal conductivity.
Koska lämpödissipaattorin osa on liitetty painokytkentäle-vyssä olevaan aukkoon, pääsee tämän kaltaisessa integroidussa yksikössä ilmankosteus tunkeutumaan loogisiin yksiköihin mainitun liitoksen kautta, joten loogisten yksiköiden kestoikä on lyhyt.Since a part of the thermal diffuser is connected to an opening in the pressure circuit board, in such an integrated unit, air moisture can penetrate the logical units through said connection, so that the service life of the logical units is short.
Tämän keksinnön tarkoituksena on aikaansaada painokytkentä-levy elektronisten osien asentamiseksi, johon levyyn ei liity edelläesitettyjä epäkohtia, jolla on erittäin hyvät lämpödispersio-ominaisuudet, estää kosteuden tunkeutumisen sisään ja joka on luotettava ja voidaan helposti sovittaa erittäin tiiviiseen kytkentään sekä menetelmä tällaisen pa inokytkentälevyn tuottamiseks i.It is an object of the present invention to provide a printed circuit board for mounting electronic components which does not suffer from the above disadvantages, has very good thermal dispersion properties, prevents the ingress of moisture and is reliable and can be easily adapted to a very tight connection, and a method of producing such a printed circuit board.
Keksinnön mukaiselle painokytkentälevylle on tunnusomaista se, mitä on sanottu patenttivaatimuksen 1 tunnusmerkkiosas-sa. Keksintö käsittää painokytkentälevyn elektronisten osien asentamiseksi, johon muovimateriaalista valmistettuun levyyn on muodostettu sen lävistävä aukko siihen osaan 4 86943 levyä, johon elektroniset osat asennetaan ja metallilevy on liitetty adhesiivisen kerroksen avulla ainakin tälle alueelle levyn takapuolelle siten, että aukon toinen pää on metallilevyn peittämä. Muovimateriaali, joka muodostaa levyssä olevan aukon sisäseinän, adhesiivinen kerros ja aukon sulkevan metallilevyn sisäpinta on päällystetty in-tegraalisella kalvolla ja lisäksi levyn takapuolella ainakin se alue, joka ympäröi sitä aluetta, johon metallilevy on asennettu, adhesiivisen kerroksen ulompi perifeerinen puoli ja metallilevyn lateraalinen puoli ja metallilevyn alapuolinen pinta päällystetään myös integraalisella kalvolla. Mainittu kalvo pystyy estämään ympäröivää kosteutta tunkeutumasta muovimateriaalin ja adhesiivisen kerroksen läpi levyssä olevaan aukkoon.The printed circuit board according to the invention is characterized by what is stated in the characterizing part of claim 1. The invention comprises a printed circuit board for mounting electronic parts, in which a plate made of plastic material is formed with a piercing opening in the part 4 86943 of the plate in which the electronic parts are mounted and the metal plate is connected by an adhesive layer to at least this area on the back of the plate. The plastic material forming the inner wall of the opening in the sheet, the adhesive layer and the inner surface of the metal sheet closing the opening are covered with an integral film and further on the back side of the sheet at least the area surrounding the area where the sheet is mounted. the underside of the metal plate is also coated with an integral film. Said film is able to prevent the surrounding moisture from penetrating through the plastic material and the adhesive layer into the opening in the plate.
Keksintö kohdistuu myös menetelmiin painokytkentälevyn valmistamiseksi sen mukaisesti, mitä patenttivaatimuksissa on esitetty.The invention also relates to methods for manufacturing a printed circuit board according to the claims.
Seuraavassa keksintöä selitetään yksityiskohtaisesti viittaamalla oheisiin piirustuksiin, joissaIn the following, the invention will be explained in detail with reference to the accompanying drawings, in which
Kuv. 1-3 esittävät pystyleikkauksina keksinnön mukaisen painokytkentälevyn rakennetta.Figures 1-3 show in vertical sections the structure of a printed circuit board according to the invention.
Kuv. 4 (a-d) esittävät ylhäältä katsottuna niiden metalli-levyjen konfiguraatioita, jotka on erityisesti suunniteltu kiinnitettäviksi tukevasti keksinnön mukaiseen painokytken-tälevyyn ja niiden urien konfiguraatioita, jotka on muodostettu levyn takapuolelle.Fig. 4 (a-d) shows a top view of the configurations of the metal plates specially designed to be firmly attached to the printed circuit board according to the invention and the configurations of the grooves formed on the back of the plate.
Kuv. 5 ja 6 esittävät pystyleikkauksia peräkkäisistä vaiheista keksinnön mukaisen painokytkentälevyn eri sovellu-tusmuotojen valmistusmenetelmässä.Figures 5 and 6 show vertical sections of successive steps in a method of manufacturing various embodiments of a printed circuit board according to the invention.
5 869435,86943
Kuv. 7 esittää perspektiivisesti kappaletta, joka on valmistettu käyttämällä keksinnön mukaista levyä elektronisten osien asentamiseksi.Fig. 7 is a perspective view of a body made using a board according to the invention for mounting electronic components.
Kuv. 8 esittää pitkittäisleikkausta kuv. 7 viivaa A-A pitkin.Fig. 8 shows a longitudinal section of Figs. 7 along line A-A.
Kuviossa 1 on esitetty pystyleikkaus painokytkentälevystä, joka on muodostettu muovimateriaalista keksinnön mukaisesti, jossa kuviossa on tarkoitus esittää levyyn muodostettu aukko 3 elektronisten osien asentamiseksi sekä rakenne aukon ympärillä. Peruslevyn 1 sekä ylä- että alapinta on päällystetty metallilehdellä 2. Metallilevy 5 on adhesiivi-sen kerroksen 7 välityksellä liitetty aukon 3 alareunaa ympäröivään osaan levyn 1 takapuolelle. Metallilevyn 5 alapuoli ja peruslevyn takapuoli alueella, johon metallilevy 5 ei ulotu, on päällystetty integraalisella kalvolla 9, joka on muodostettu päällystämällä. Aukon 3 sivuseinämiin ja alaosaan, jonka muodostaa metallilevy 5, on päällystetty integraalinen päällystekalvo 11.Figure 1 shows a vertical section of a printed circuit board formed of a plastic material according to the invention, in which the figure is intended to show an opening 3 formed in the board for mounting electronic components and a structure around the opening. Both the upper and lower surfaces of the base plate 1 are covered with a metal sheet 2. The metal plate 5 is connected to the part surrounding the lower edge of the opening 3 on the back side of the plate 1 by means of an adhesive layer 7. The underside of the metal plate 5 and the rear side of the base plate in the area to which the metal plate 5 does not extend are coated with an integral film 9 formed by coating. An integral coating film 11 is coated on the side walls and the lower part of the opening 3 formed by the metal plate 5.
Kytkentälevynä käytetään yleensä laminoitua, muovimateriaalista ja lasikankaasta tai -paperista muodostettua levyä ja muovimateriaalina käytetään tavallisesti epoksi-, polyamidi-, triatsiini- ja fenolihartsia tai niiden sekoitusta. Tällaisia konventionaalisia levyjä, jotka sisältävät muovi-materiaalia, voidaan hyödyntää tässä keksinnössä. Kuitenkin mainitulla muovimateriaalilla 1 ja adhesiivisella kerroksella 7 on taipumuksena absorboida kosteutta ja päästää sitä läpi, niin että konventionaalisissa levyissä, joissa ei ole mitään integraalista peitekalvoa, ei voida estää ulkopuolisen kosteuden tunkeutumista aukkoon muovimateriaalin ja adhesiivisen kerroksen läpi, samalla kun elektronisten osien toiminnassa syntyvä lämpö dispergoituu helposti metallilevyn läpi, koska elektroniset osat on asennettu suoraan metallilevyn päälle aukon pohjaan.A laminated sheet made of a plastic material and a glass cloth or paper is generally used as the connecting sheet, and an epoxy, polyamide, triazine and phenolic resin or a mixture thereof is usually used as the plastic material. Such conventional sheets containing a plastic material can be utilized in the present invention. However, said plastic material 1 and the adhesive layer 7 tend to absorb and pass moisture, so that in conventional sheets without any integral cover film, the penetration of external moisture into the opening through the plastic material and the adhesive layer cannot be prevented from penetrating the opening. easily through the metal plate because the electronic components are mounted directly on the metal plate at the bottom of the opening.
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Kuten edellä selitettiin, on keksinnön mukaisessa painokyt-kentälevyssä adhesiivinen kerros 7 tiivistetty ympäröivästä ilmasta kalvolla 9 ja aukon sisäpuoli on eristetty muovimateriaalista 1 ja adhesiivisesta kerroksesta 7 kalvolla 11, niin että elektronisten osien ollessa kytkettynä ja toimiessa ei ympäröivä kosteus pääse aukkoon 3.As described above, in the printed circuit board according to the invention, the adhesive layer 7 is sealed from the ambient air by a film 9 and the inside of the opening is insulated from the plastic material 1 and the adhesive layer 7 by a film 11 so that ambient moisture does not enter the opening 3.
Kuviot 2 ja 3 esittävät pystyleikkauksia tämän keksinnön mukaisen painokytkentälevyn muiden sovellutusmuotojen rakenteesta. Näissä sovellutusmuodoissa, toisin kuin kuviossa I, levyn 1 takapuolelle on tehty syvennys ja syvennyksen sisäpintaan on adhesiivisen kerroksen 7 välityksellä liitetty metallilevy 5 porrasmaiseen osaan 13, jonka syvennys muodostaa.Figures 2 and 3 show vertical sections of the structure of other embodiments of a printed circuit board according to the present invention. In these embodiments, unlike in Fig. I, a recess is made in the rear side of the plate 1, and a metal plate 5 is connected to the inner surface of the recess by means of an adhesive layer 7 to the stepped part 13 formed by the recess.
Kuv. 2 esittämässä levyssä metallilevyn 5 ja uran sivusei-nämän välinen tila on pienempi kuin kuv. 3 esittämässä levyssä, niin että kalvo 9, joka on integraalisesti muodostettu levyn 1 ja metallilevyn 5 takapuolisiin pintoihin, on hieman sisennetty mainitun tilan kohdalla, kuten viitenumerolla 15 on merkitty. Koska metallilevyn 5 ja uran sivusei-nämän välinen tila kuv. 3 esittämässä levyssä on suuri, jää vielä tila 12 senkin jälkeen kun uran sivuseinämä, metalli-levy 5 ja tilan pohja on varustettu päällyskalvolla 9.In the plate shown in Fig. 2, the space between the metal plate 5 and the side wall of the groove is smaller than in Fig. 2. 3, so that the film 9 integrally formed on the rear surfaces of the plate 1 and the metal plate 5 is slightly indented at said space, as indicated by reference numeral 15. Since the space between the metal plate 5 and the side wall of the groove fig. 3 is large, there is still a space 12 even after the side wall of the groove, the metal plate 5 and the bottom of the space are provided with a cover film 9.
Näissä levyn sovellutusmuodoissa, joihin on muodostettu kuviossa 2 esitetty sisennys 15 tai kuviossa 3 esitetty tila 12, on levyssä, joka on esitetty kuviossa 3 jopa paremmat lämmön dispergointiominaisuudet, koska levyn takapuolella on isompi alue peitetty kalvolla. Niinpä painokytkentälevyn sovellutusmuodoissa, jotka on esitetty kuvioissa 2 ja 3 ja jotka on varustettu integraalisi11a kalvoilla 9, II, kuten kuvion 1 esittämä levy, on ympäröivän kosteuden pääsy aukkoon 3 täysin estetty elektronisten osien ollessa asennettuna siihen ja toiminnassa. Lisäksi niillä on erittäin hyvät lämmön dispergointiominaisuudet, kuten tavanomaisilla levyillä.In these embodiments of the plate, in which the indentation 15 shown in Fig. 2 or the space 12 shown in Fig. 3 is formed, the plate shown in Fig. 3 has even better heat dispersing properties because a larger area on the back of the plate is covered with a film. Thus, in the embodiments of the printed circuit board shown in Figs. 2 and 3 and provided with integral films 9, II, such as the board shown in Fig. 1, the entry of ambient moisture into the opening 3 is completely prevented when the electronic components are mounted and operating. In addition, they have very good heat dispersion properties, as in conventional sheets.
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Kuviot 4 (a), (b), (c) ja (d) esittävät ylhäältä katsottuna erilaisia sovellutusmuotoja metallilevyn järjestämiseksi kuv. 2 ja 3 mukaisiin painokytkentälevyrakenteisiin. Havaitaan, että metallilevyn 5 lateraaliselle puolelle ja/tai uran sisäpuolelle on muodostettu erityisellä tavalla muotoillut kohdat tai ulkonemat 14 metallilevyn asettamiseksi kunnolla uraan ja kiinnittämiseksi uran pohjaan ja sen estämiseksi, ettei metallilevy tärinän tai iskujen vaikutuksesta siirry paikaltaan sen ollessa asennettuna ja toiminnassa. Kuvioiden 4 (a) ja (b) esittämissä sovellutusmuo-doissa on metallilevy 5 varustettu neljässä kulmassa tai neljällä sivulla sijaitsevilla ulkonemilla 14, jolloin metallilevy 5 voidaan helposti ja varmasti sijoittaa ja kiinnittää uran pohjaan. Kuvioiden 4 (c) ja (d) esittämissä sovellutusmuodoissa on uran sisäseinämään muodostettu erityisellä tavalla muotoillut kohdat tai ulkonemat 14, jolloin saavutetaan sama vaikutus kuin kuvioiden 4 (a) ja (b) sovellutusmuodoissa.Figures 4 (a), (b), (c) and (d) show a top view of different embodiments for arranging the metal plate of FIG. 2 and 3. It is found that specially shaped points or protrusions 14 are formed on the lateral side of the metal plate 5 and / or inside the groove to properly insert the metal plate into the groove and secure it to the bottom of the groove and to prevent the metal plate from moving due to vibration or shock. In the embodiments shown in Figures 4 (a) and (b), the metal plate 5 is provided with protrusions 14 at four corners or on four sides, whereby the metal plate 5 can be easily and securely placed and fixed to the bottom of the groove. In the embodiments shown in Figures 4 (c) and (d), specially shaped points or protrusions 14 are formed in the inner wall of the groove, achieving the same effect as in the embodiments of Figures 4 (a) and (b).
Adhesiivisena tai sitovana aineena keksinnön mukaisessa levyssä käytetään epoksi-, polyamidi-, akryyli- ja triat-siinihartsia ja niistä yhdistettyjä hartseja. Näitä hartseja voidaan käyttää edullisesti tämän keksinnön tarkoitukseen niiden erinomaisen adhesiivisuuden, lämpövastuksen, kestävyyden ja sähköeristyskykynsä ansiosta. Metallilevyssä voidaan käyttää metallimateriaaleja, joilla on suhteellisen korkea lämmönjohtavuus, kuten kuparilla, kuparilejeeringil-lä, raudalla, rautalejeeringillä, alumiinilla ja alu-miinilejeeringillä. Kuparia, nikkeliä, kultaa, tinaa ja vastaavaa voidaan käyttää päällysteenä.Epoxy, polyamide, acrylic and triazine resins and their combined resins are used as the adhesive or binder in the sheet according to the invention. These resins can be advantageously used for the purpose of the present invention due to their excellent adhesiveness, thermal resistance, durability and electrical insulation. Metal materials with relatively high thermal conductivity, such as copper, copper alloy, iron, iron alloy, aluminum and aluminum alloy, can be used in the metal sheet. Copper, nickel, gold, tin and the like can be used as a coating.
Seuraavassa selitetään keksinnön mukaista menetelmää paino-kytkentälevyn valmistamiseksi.In the following, the method according to the invention for manufacturing a pressure switch plate will be described.
Kuviot 5 (a)-(d) esittävät vaiheittain keksinnön mukaisen levyn valmistusmenetelmää. Levyrakenne on esitetty pysty- 8 86943 leikkauksena. Kuten kuviossa 5 (a) on esitetty, kiinnitetään metallilehti 2 peruslevyn 1 ylä- ja alapintaan ja mainittuun peruslevyyn on muodostettu levyn läpi ulottuva aukko 3 meistämällä tai leikkaamalla. Metallilevy 5 kiinnitetään levyn takapuolelle aukon kohdalle ja sen ympärille metallilehdessä 2 olevan adhesiivisen väliainekerroksen avulla, kuten kuviossa 5 (b) on esitetty. Seuraavaksi aukon 3 sisäseinämä, aukkoa kohti osoittavan adhesiivisen kerroksen 7 lateraalinen puoli, metallilevyn 5 sisäpuoli aukon kohdalla ja peruslevyn 1 etupuolinen pinta päällystetään siten, että muodostuu integraalinen peitekalvo 11 kuvion 5 (c) osoittamalla tavalla. Samanlainen päällystys tehdään myös peruslevyn 1 takapintaan, metallilevyn 5 ulkopintaan ja adhesiivisen kerroksen 7 ulospäin osoittavaan osaan, jolloin muodostuu integraalinen kalvo 9. Näin muodostuu keksinnön mukainen levy. Kuviossa 5 (d) on esitetty paino-kytkentälevyn sovellutusmuoto, joka on aikaansaatu muilla menetelmillä levyyn, joka on esitetty kuviossa 5 (c). Esimerkiksi kuviossa 5 (c) esitetyn levyn pinta päällystetään valoherkällä hartsikalvolla ja sen jälkeen muodostetaan konduktiivinen piiri tavanomaisella tavalla etsaamalla halutun piirikaavan muodostuttua valoherkästä kalvosta. Viimeistelyn jälkeen elektroniset osat, kuten puolijohde-elementit asennetaan aukkoon 3 ja kiinnitetään paikalleen hopealiisterillä tai muulla tavalla.Figures 5 (a) to (d) show step by step a method of manufacturing a sheet according to the invention. The plate structure is shown in vertical section 8 86943. As shown in Fig. 5 (a), a metal sheet 2 is fixed to the upper and lower surface of the base plate 1, and an opening 3 extending through the plate is formed on said base plate by stamping or cutting. The metal plate 5 is attached to the back of the plate at the opening and around it by means of an adhesive medium layer in the metal sheet 2, as shown in Fig. 5 (b). Next, the inner wall of the opening 3, the lateral side of the adhesive layer 7 facing the opening, the inside of the metal plate 5 at the opening, and the front surface of the base plate 1 are coated to form an integral cover film 11 as shown in Fig. 5 (c). A similar coating is also applied to the back surface of the base plate 1, to the outer surface of the metal plate 5 and to the outwardly facing part of the adhesive layer 7, whereby an integral film 9 is formed. Fig. 5 (d) shows an embodiment of a weight-coupling plate provided by other methods for the plate shown in Fig. 5 (c). For example, the surface of the board shown in Fig. 5 (c) is coated with a photosensitive resin film, and then a conductive circuit is formed in a conventional manner by etching the desired circuit pattern formed from the photosensitive film. After finishing, the electronic components, such as the semiconductor elements, are mounted in the opening 3 and secured in place with a silver paste or otherwise.
Kuviot 6 (a)-(e) esittävät keksinnön erään toisen sovellu-tusmuodon mukaisen painokytkentälevyn valmistuksen peräkkäisiä vaiheita. Kuviossa 6 (a) on esitetty pystyleikkauksena peruslevy 1, johon on kiinnitetty metallilehti 2 sekä ylä- että alapintaan ja johon on takapuolelle muodostettu syvennys 17 käyttämällä otsajyrsintä. Sen jälkeen, vaiheessa (b), metallilevy 5 on kiinnitetty syvennyksen 17 pohjaan adhesiivisen kerroksen 7 avulla. Levyn 1 etupuoli koneistetaan otsajyrsimellä, jolloin muodostuu ainakin metallilevyyn 5 ulottuva aukko 3, kuten on esitetty vaiheessa (c).Figures 6 (a) to (e) show successive steps in the manufacture of a printed circuit board according to another embodiment of the invention. Figure 6 (a) shows a vertical section of a base plate 1 to which a metal sheet 2 is attached to both the upper and lower surfaces and to which a recess 17 is formed on the rear side using a face mill. Then, in step (b), the metal plate 5 is fixed to the bottom of the recess 17 by means of an adhesive layer 7. The front side of the plate 1 is machined with a face mill to form an opening 3 extending at least into the metal plate 5, as shown in step (c).
9 869439,86943
Sen jälkeen, kuten kuviosta 6 (d) havaitaan, muodostetaan aukon 3 sivuseinämään, metallilevyyn sille puolelle, joka muodostaa aukon 3 pohjan ja metallilehdelle 2 integraalinen päällyskalvo samalla kun muodostetaan samanlainen kalvo 9 levyn takapintaan, levyn ja metallilevyn välisen tilan pohjaan ja metallilevyn alapintaan. Kuviossa 6 (e) on esitetty erään sovellutusmuodon mukainen valmis levyrakenne, joka on aikaansaatu lisäämällä valoherkkä hartsikalvo kuviossa 6 (d) esitetyn levyn pintaan, jolloin muodostuu haluttu piirikaava, joka etsataan ja johon muodostetaan johdinpiiri tunnetulla tavalla. Kun tämä viimeistely on tehty, asennetaan elektroniset osat, kuten puolijohde-elementit aukkoon 3 ja kiinnitetään hopealiisterillä tai muulla tavalla.Thereafter, as shown in Fig. 6 (d), an opening film is formed on the side wall of the opening 3, the metal plate on the side forming the bottom of the opening 3 and the metal sheet 2 while forming a similar film 9 on the back surface, the bottom of the space between the plate and the metal plate. Fig. 6 (e) shows a finished plate structure according to an embodiment obtained by adding a photosensitive resin film to the surface of the plate shown in Fig. 6 (d) to form a desired circuit pattern which is etched and formed with a conductor circuit in a known manner. Once this finishing is done, the electronic components, such as the semiconductor elements, are mounted in the hole 3 and secured with silver glue or otherwise.
Kuv. 7 esittää perspektiivisesti pistikekappaletta, joka on valmistettu käyttämällä keksinnön mukaista levyä elektronisten osien asentamiseksi ja kuv. 8 esittää pystyleik-kausta kuv. 7 viivaa A-A pitkin. Tässä kappaleessa on LSI-lastu 19 asennettu keksinnön mukaisen painokytkentälevyn 1 aukkoon 3 ja LSI-lastun ympärillä oleva alue on päällystetty epoksihartsilla 22. Muihin yksikköihin liittämistä varten on järjestetty ulkonevat johdinpistikkeet 21, jotka on kiinnitetty läpi levyn ulottuviin reikiin 23, jotka ovat piirin kanssa sähköisesti konduktiivisia.Fig. 7 is a perspective view of a plug piece made using a plate according to the invention for mounting electronic components, and Figs. 8 shows a vertical section of FIG. 7 along line A-A. In this piece, the LSI chip 19 is mounted in the opening 3 of the printing circuit board 1 according to the invention and the area around the LSI chip is coated with epoxy resin 22. For connection to other units, protruding conductor terminals 21 are provided. conductive.
Kuten edellä on selitetty, tämän keksinnön mukaisessa pai-nokytkentälevyssä elektronisten osien asentamiseksi kiinnitetään elektronisia osia, kuten puolijohde-elementtejä, metallilevyyn, jolla on hyvä lämmönjohtavuus, niin että asennetuissa elektronisissa osissa syntyvä lämpö absorboituu ja dispergoituu nopeasti ja varmasti. Koska lisäksi levyn aukon sisäpuoli ja metallilevy ja joissain tapauksissa myös uran ja metallilevyn välinen tila on päällystetty integraalisella kalvolla, on mahdollista täysin estää ympäristön kosteuden pääsy aukkoon muovimateriaalin ja adhesii- 10 86943 visen kerroksen läpi. Lisäksi levyssä, jolle metallilevy on sovitettu uraan, joka sijaitsee levyn takapuolella, voidaan metallilevy asettaa siten, että sen alapuoli ei juuri ulko-ne levyn takaosan tasosta tai on samassa tasossa, jolloin voidaan aikaansaada ohuempi levy.As described above, in the pressure circuit board of the present invention for mounting electronic components, electronic components such as semiconductor elements are attached to a metal plate having good thermal conductivity so that the heat generated in the installed electronic components is quickly and safely absorbed and dispersed. In addition, since the inside of the plate opening and the metal plate and in some cases also the space between the groove and the metal plate are covered with an integral film, it is possible to completely prevent ambient moisture from entering the opening through the plastic material and the adhesive layer. In addition, in a plate on which a metal plate is fitted in a groove located on the back of the plate, the metal plate can be positioned so that its underside does not just protrude from or is flush with the plane of the back of the plate, providing a thinner plate.
Keksinnön mukaista levyä elektronisten osien asentamiseksi voidaan hyödyntää esimerkiksi sisäänrakennettuna painokyt-kentälevynä kameroihin, kelloihin jne. ja levynä puolijohde-elementtien, kuten palakoteloiden, pistikekappaleiden, hybridipiirilevyjen ja vastaavien asentamiseksi.The board according to the invention for mounting electronic components can be utilized, for example, as a built-in printed circuit board for cameras, clocks, etc. and as a board for mounting semiconductor elements such as block housings, plug pieces, hybrid circuit boards and the like.
Alan ammattimiehelle on selvää, että keksintö ei ole rajoittunut edelläesitettyihin sovellutusmuotoesimerkkeihin, vaan sitä voidaan vaihdella oheisten patenttivaatimusten puitteissa.It will be clear to a person skilled in the art that the invention is not limited to the above-mentioned exemplary embodiments, but can be varied within the scope of the appended claims.
i,i
Claims (7)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP22523783 | 1983-11-29 | ||
JP58225237A JPS60116191A (en) | 1983-11-29 | 1983-11-29 | Board for placing electronic parts and method of producing same |
PCT/JP1984/000565 WO1985002515A1 (en) | 1983-11-29 | 1984-11-27 | Printed-circuit board for mounting electronic element and method of manufacture thereof |
JP8400565 | 1984-11-27 |
Publications (4)
Publication Number | Publication Date |
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FI852798L FI852798L (en) | 1985-07-17 |
FI852798A0 FI852798A0 (en) | 1985-07-17 |
FI86943B true FI86943B (en) | 1992-07-15 |
FI86943C FI86943C (en) | 1992-10-26 |
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ID=16826139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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FI852798A FI86943C (en) | 1983-11-29 | 1985-07-17 | Pressure connector plate for mounting electronic parts and processes for manufacturing it |
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US (2) | US4737395A (en) |
EP (1) | EP0197148B1 (en) |
JP (1) | JPS60116191A (en) |
DE (1) | DE3482545D1 (en) |
FI (1) | FI86943C (en) |
SG (1) | SG4191G (en) |
WO (1) | WO1985002515A1 (en) |
Families Citing this family (58)
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DE3766324D1 (en) * | 1986-09-12 | 1991-01-03 | Siemens Ag | PCB. |
US4993148A (en) * | 1987-05-19 | 1991-02-19 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a circuit board |
JPH0263141A (en) * | 1989-04-05 | 1990-03-02 | Ibiden Co Ltd | Manufacture of substrate for electronic component loading use |
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-
1983
- 1983-11-29 JP JP58225237A patent/JPS60116191A/en active Granted
-
1984
- 1984-11-27 EP EP84904181A patent/EP0197148B1/en not_active Expired - Lifetime
- 1984-11-27 DE DE8484904181T patent/DE3482545D1/en not_active Expired - Lifetime
- 1984-11-27 WO PCT/JP1984/000565 patent/WO1985002515A1/en active IP Right Grant
- 1984-11-27 US US06/756,990 patent/US4737395A/en not_active Expired - Lifetime
-
1985
- 1985-07-17 FI FI852798A patent/FI86943C/en not_active IP Right Cessation
-
1987
- 1987-05-14 US US07/054,122 patent/US4773955A/en not_active Expired - Lifetime
-
1991
- 1991-01-28 SG SG41/91A patent/SG4191G/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPH0378795B2 (en) | 1991-12-16 |
FI86943C (en) | 1992-10-26 |
DE3482545D1 (en) | 1990-07-19 |
WO1985002515A1 (en) | 1985-06-06 |
US4773955A (en) | 1988-09-27 |
JPS60116191A (en) | 1985-06-22 |
FI852798L (en) | 1985-07-17 |
EP0197148A1 (en) | 1986-10-15 |
US4737395A (en) | 1988-04-12 |
EP0197148A4 (en) | 1987-06-29 |
EP0197148B1 (en) | 1990-06-13 |
SG4191G (en) | 1991-04-05 |
FI852798A0 (en) | 1985-07-17 |
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Legal Events
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MM | Patent lapsed | ||
MM | Patent lapsed |
Owner name: IBIDEN CO., LTD. |