FI86943B - Push-fit assembly plate for installing electronic components and method for manufacture of the same - Google Patents

Push-fit assembly plate for installing electronic components and method for manufacture of the same Download PDF

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Publication number
FI86943B
FI86943B FI852798A FI852798A FI86943B FI 86943 B FI86943 B FI 86943B FI 852798 A FI852798 A FI 852798A FI 852798 A FI852798 A FI 852798A FI 86943 B FI86943 B FI 86943B
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FI
Finland
Prior art keywords
plate
metal plate
opening
recess
formed
Prior art date
Application number
FI852798A
Other languages
Finnish (fi)
Swedish (sv)
Other versions
FI852798L (en
FI852798A0 (en
FI86943C (en
Inventor
Mabuchi Katsumi
Komura Toshimi
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP22523783 priority Critical
Priority to JP58225237A priority patent/JPH0378795B2/ja
Priority to PCT/JP1984/000565 priority patent/WO1985002515A1/en
Priority to JP8400565 priority
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Publication of FI852798A0 publication Critical patent/FI852798A0/en
Publication of FI852798L publication Critical patent/FI852798L/en
Publication of FI86943B publication Critical patent/FI86943B/en
Application granted granted Critical
Publication of FI86943C publication Critical patent/FI86943C/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/12Mountings, e.g. non-detachable insulating substrates
    • H01L23/13Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1532Connection portion the connection portion being formed on the die mounting surface of the substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09845Stepped hole, via, edge, bump or conductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09981Metallised walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10416Metallic blocks or heatsinks completely inserted in a PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/049Wire bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10Methods of surface bonding and/or assembly therefor
    • Y10T156/1052Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062Prior to assembly
    • Y10T156/1064Partial cutting [e.g., grooving or incising]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/23Sheet including cover or casing
    • Y10T428/239Complete cover or casing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322Composite web or sheet
    • Y10T428/24331Composite web or sheet including nonapertured component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Description

86943

PRESSURE SWITCH PLATE FOR INSTALLATION OF ELECTRONIC COMPONENTS AND METHODS FOR ITS MANUFACTURE - TRYCKKOPPLINGSPLÄT FÖR MONTERING AV ELEKTRONISKA DELAR OOH FÖRFARANDEN FÖR TILL-VERKNING AV DEN

The present invention relates to a printed circuit board according to the preamble of claim 1, which is used for mounting electronic components such as various chips and semiconductor components, and to methods for manufacturing such a printed circuit board.

It is a particular object of the invention to provide a printed circuit board which has very good thermal dispersion properties, which heat is generated from the installed electronic components and which board is remarkably moisture-proof, and methods for manufacturing such a printed circuit board.

Conventional printed circuit boards designed for the installation of electronic components are generally used as circuit boards in watches, cameras, and the like. The use of such sheets has the advantage that they allow the size and thickness to be reduced in products made using these sheets.

Plastic and ceramic materials are used as the material for the production of printed circuit boards, with plastic being the most commonly used. In general, plastic printed circuit boards can be made to exactly the desired dimensions and are stronger against mechanical shocks than those made of ceramic material such as alumina. However, the thermal conductivity of plastic is very low, only about 1/60 of the thermal conductivity of alumina. For this reason, conventional plastic sheets are still unsatisfactory when used as sheets for the installation of integrated circuits with a large integration scale or electronic components that require high power.

2 86943 To overcome this problem, several proposals have been made, as will be explained below, for forming a printed circuit board in which a metal plate having high thermal conductivity is fitted to a plastic plate and electronic components are mounted directly on the metal plate to improve thermal dispersion.

The Japanese utility model 10060/79 discloses a printed circuit board for the installation of semiconductors and microcircuit chips. In this printed circuit board, a recess of a certain depth is provided in the part of the board in which the semiconductors and IC chips are mounted and in said groove a specially configured, through-extending hole is formed, the area around the hole being designed as a support area with a thin metal plate for. However, such a printed circuit board has the disadvantage that if the surface area of the recess is increased in the horizontal direction during the manufacture of the board, the space on the surface of the board intended for circuits is reduced. Thus, it is necessary to increase the area of the printed circuit board's to make the circuits fit. Instead, if the horizontal area of said recess is small, the area of the support area decreases correspondingly, causing opposite adhesion between the metal plate and the support area. In addition, very high precision is required when machining the inner surface of the recess and the metal plate to fit the metal plate tightly into the groove. This increases manufacturing costs and reduces productivity. A shortened service life of the electronic components is also a problem, as it is not possible to prevent the ingress of air moisture into the electronic components mounted on the metal plate in the recess.

Japanese Utility Model 172970/81 discloses a circuit board for watches having a laminated reinforcing material, such as a metal or ceramic material, in which a recess is formed to mount an LSI after said reinforcement is laminated to the circuit board.

However, such a device does not prevent moisture from penetrating through the adhesive layer binding the board and the reinforcement into the groove in which the LSI is mounted, which shortens the life of the LSI.

Japanese Patent Publication No. 166056/82 discloses an integrated module consisting essentially of a printed circuit board and logic units, i.e. chips attached thereto, the module having a single or double layer support base with an opening through which a portion of the thermal diffuser connected to the support base extends and opposite to the support base, said logical units are directly attached to said part of the heat dispenser by a medium having a high thermal conductivity.

Since a part of the thermal diffuser is connected to an opening in the pressure circuit board, in such an integrated unit, air moisture can penetrate the logical units through said connection, so that the service life of the logical units is short.

It is an object of the present invention to provide a printed circuit board for mounting electronic components which does not suffer from the above disadvantages, has very good thermal dispersion properties, prevents the ingress of moisture and is reliable and can be easily adapted to a very tight connection, and a method of producing such a printed circuit board.

The printed circuit board according to the invention is characterized by what is stated in the characterizing part of claim 1. The invention comprises a printed circuit board for mounting electronic parts, in which a plate made of plastic material is formed with a piercing opening in the part 4 86943 of the plate in which the electronic parts are mounted and the metal plate is connected by an adhesive layer to at least this area on the back of the plate. The plastic material forming the inner wall of the opening in the sheet, the adhesive layer and the inner surface of the metal sheet closing the opening are covered with an integral film and further on the back side of the sheet at least the area surrounding the area where the sheet is mounted. the underside of the metal plate is also coated with an integral film. Said film is able to prevent the surrounding moisture from penetrating through the plastic material and the adhesive layer into the opening in the plate.

The invention also relates to methods for manufacturing a printed circuit board according to the claims.

In the following, the invention will be explained in detail with reference to the accompanying drawings, in which

Figures 1-3 show in vertical sections the structure of a printed circuit board according to the invention.

Fig. 4 (a-d) shows a top view of the configurations of the metal plates specially designed to be firmly attached to the printed circuit board according to the invention and the configurations of the grooves formed on the back of the plate.

Figures 5 and 6 show vertical sections of successive steps in a method of manufacturing various embodiments of a printed circuit board according to the invention.

5,86943

Fig. 7 is a perspective view of a body made using a board according to the invention for mounting electronic components.

Fig. 8 shows a longitudinal section of Figs. 7 along line A-A.

Figure 1 shows a vertical section of a printed circuit board formed of a plastic material according to the invention, in which the figure is intended to show an opening 3 formed in the board for mounting electronic components and a structure around the opening. Both the upper and lower surfaces of the base plate 1 are covered with a metal sheet 2. The metal plate 5 is connected to the part surrounding the lower edge of the opening 3 on the back side of the plate 1 by means of an adhesive layer 7. The underside of the metal plate 5 and the rear side of the base plate in the area to which the metal plate 5 does not extend are coated with an integral film 9 formed by coating. An integral coating film 11 is coated on the side walls and the lower part of the opening 3 formed by the metal plate 5.

A laminated sheet made of a plastic material and a glass cloth or paper is generally used as the connecting sheet, and an epoxy, polyamide, triazine and phenolic resin or a mixture thereof is usually used as the plastic material. Such conventional sheets containing a plastic material can be utilized in the present invention. However, said plastic material 1 and the adhesive layer 7 tend to absorb and pass moisture, so that in conventional sheets without any integral cover film, the penetration of external moisture into the opening through the plastic material and the adhesive layer cannot be prevented from penetrating the opening. easily through the metal plate because the electronic components are mounted directly on the metal plate at the bottom of the opening.

6 86943

As described above, in the printed circuit board according to the invention, the adhesive layer 7 is sealed from the ambient air by a film 9 and the inside of the opening is insulated from the plastic material 1 and the adhesive layer 7 by a film 11 so that ambient moisture does not enter the opening 3.

Figures 2 and 3 show vertical sections of the structure of other embodiments of a printed circuit board according to the present invention. In these embodiments, unlike in Fig. I, a recess is made in the rear side of the plate 1, and a metal plate 5 is connected to the inner surface of the recess by means of an adhesive layer 7 to the stepped part 13 formed by the recess.

In the plate shown in Fig. 2, the space between the metal plate 5 and the side wall of the groove is smaller than in Fig. 2. 3, so that the film 9 integrally formed on the rear surfaces of the plate 1 and the metal plate 5 is slightly indented at said space, as indicated by reference numeral 15. Since the space between the metal plate 5 and the side wall of the groove fig. 3 is large, there is still a space 12 even after the side wall of the groove, the metal plate 5 and the bottom of the space are provided with a cover film 9.

In these embodiments of the plate, in which the indentation 15 shown in Fig. 2 or the space 12 shown in Fig. 3 is formed, the plate shown in Fig. 3 has even better heat dispersing properties because a larger area on the back of the plate is covered with a film. Thus, in the embodiments of the printed circuit board shown in Figs. 2 and 3 and provided with integral films 9, II, such as the board shown in Fig. 1, the entry of ambient moisture into the opening 3 is completely prevented when the electronic components are mounted and operating. In addition, they have very good heat dispersion properties, as in conventional sheets.

7 86943

Figures 4 (a), (b), (c) and (d) show a top view of different embodiments for arranging the metal plate of FIG. 2 and 3. It is found that specially shaped points or protrusions 14 are formed on the lateral side of the metal plate 5 and / or inside the groove to properly insert the metal plate into the groove and secure it to the bottom of the groove and to prevent the metal plate from moving due to vibration or shock. In the embodiments shown in Figures 4 (a) and (b), the metal plate 5 is provided with protrusions 14 at four corners or on four sides, whereby the metal plate 5 can be easily and securely placed and fixed to the bottom of the groove. In the embodiments shown in Figures 4 (c) and (d), specially shaped points or protrusions 14 are formed in the inner wall of the groove, achieving the same effect as in the embodiments of Figures 4 (a) and (b).

Epoxy, polyamide, acrylic and triazine resins and their combined resins are used as the adhesive or binder in the sheet according to the invention. These resins can be advantageously used for the purpose of the present invention due to their excellent adhesiveness, thermal resistance, durability and electrical insulation. Metal materials with relatively high thermal conductivity, such as copper, copper alloy, iron, iron alloy, aluminum and aluminum alloy, can be used in the metal sheet. Copper, nickel, gold, tin and the like can be used as a coating.

In the following, the method according to the invention for manufacturing a pressure switch plate will be described.

Figures 5 (a) to (d) show step by step a method of manufacturing a sheet according to the invention. The plate structure is shown in vertical section 8 86943. As shown in Fig. 5 (a), a metal sheet 2 is fixed to the upper and lower surface of the base plate 1, and an opening 3 extending through the plate is formed on said base plate by stamping or cutting. The metal plate 5 is attached to the back of the plate at the opening and around it by means of an adhesive medium layer in the metal sheet 2, as shown in Fig. 5 (b). Next, the inner wall of the opening 3, the lateral side of the adhesive layer 7 facing the opening, the inside of the metal plate 5 at the opening, and the front surface of the base plate 1 are coated to form an integral cover film 11 as shown in Fig. 5 (c). A similar coating is also applied to the back surface of the base plate 1, to the outer surface of the metal plate 5 and to the outwardly facing part of the adhesive layer 7, whereby an integral film 9 is formed. Fig. 5 (d) shows an embodiment of a weight-coupling plate provided by other methods for the plate shown in Fig. 5 (c). For example, the surface of the board shown in Fig. 5 (c) is coated with a photosensitive resin film, and then a conductive circuit is formed in a conventional manner by etching the desired circuit pattern formed from the photosensitive film. After finishing, the electronic components, such as the semiconductor elements, are mounted in the opening 3 and secured in place with a silver paste or otherwise.

Figures 6 (a) to (e) show successive steps in the manufacture of a printed circuit board according to another embodiment of the invention. Figure 6 (a) shows a vertical section of a base plate 1 to which a metal sheet 2 is attached to both the upper and lower surfaces and to which a recess 17 is formed on the rear side using a face mill. Then, in step (b), the metal plate 5 is fixed to the bottom of the recess 17 by means of an adhesive layer 7. The front side of the plate 1 is machined with a face mill to form an opening 3 extending at least into the metal plate 5, as shown in step (c).

9,86943

Thereafter, as shown in Fig. 6 (d), an opening film is formed on the side wall of the opening 3, the metal plate on the side forming the bottom of the opening 3 and the metal sheet 2 while forming a similar film 9 on the back surface, the bottom of the space between the plate and the metal plate. Fig. 6 (e) shows a finished plate structure according to an embodiment obtained by adding a photosensitive resin film to the surface of the plate shown in Fig. 6 (d) to form a desired circuit pattern which is etched and formed with a conductor circuit in a known manner. Once this finishing is done, the electronic components, such as the semiconductor elements, are mounted in the hole 3 and secured with silver glue or otherwise.

Fig. 7 is a perspective view of a plug piece made using a plate according to the invention for mounting electronic components, and Figs. 8 shows a vertical section of FIG. 7 along line A-A. In this piece, the LSI chip 19 is mounted in the opening 3 of the printing circuit board 1 according to the invention and the area around the LSI chip is coated with epoxy resin 22. For connection to other units, protruding conductor terminals 21 are provided. conductive.

As described above, in the pressure circuit board of the present invention for mounting electronic components, electronic components such as semiconductor elements are attached to a metal plate having good thermal conductivity so that the heat generated in the installed electronic components is quickly and safely absorbed and dispersed. In addition, since the inside of the plate opening and the metal plate and in some cases also the space between the groove and the metal plate are covered with an integral film, it is possible to completely prevent ambient moisture from entering the opening through the plastic material and the adhesive layer. In addition, in a plate on which a metal plate is fitted in a groove located on the back of the plate, the metal plate can be positioned so that its underside does not just protrude from or is flush with the plane of the back of the plate, providing a thinner plate.

The board according to the invention for mounting electronic components can be utilized, for example, as a built-in printed circuit board for cameras, clocks, etc. and as a board for mounting semiconductor elements such as block housings, plug pieces, hybrid circuit boards and the like.

It will be clear to a person skilled in the art that the invention is not limited to the above-mentioned exemplary embodiments, but can be varied within the scope of the appended claims.

i

Claims (7)

  1. A printed circuit board for mounting electronic parts, in which a plate (3) extending through the plate is formed in a plate comprising plastic material (1) in the area where the electronic parts are mounted and a metal plate (5) is fastened to the back of the plate at least around the opening. the other end of the opening (3), characterized in that the integral cover film (11) is formed by coating the inner wall of the opening, the end surface of the adhesive layer (7) bounding said opening (3) and the side forming the bottom of the metal plate (5) closes the opening at the back of the plate and that the integral cover film (9) is further formed by coating at least on the back of the plate in the area surrounding the area to which the metal plate is attached, the outer circumferential surface of the adhesive layer (7) and the lateral side and bottom of the metal plate (5).
  2. A plate according to claim 1, characterized in that a recess is formed in the region around the end of the plate opening, forming a stepped portion (13) forming a base in said opening, the metal plate (5) being fixed to the stepped part formed by the adhesive layer (7). (13).
  3. A plate according to claim 2, characterized in that a grooved space (12) is formed between the inner circumference of the recess and the opposite outer circumference of the metal plate (5).
  4. A plate according to claim 3, characterized in that the metal plate (5) is arranged in a stepped part (13) in the recess so that the outer circumferential side of the metal plate and the inner circumferential side of the recess contact each other at several points, said grooved space retaining:. a certain width. 12 86943
  5. 5. A method of manufacturing a printed circuit board in which electronic components are mounted on a printed circuit board, characterized in that an opening extending through the plate is formed in the area of the printed circuit board containing the plastic material a metal plate, an inner wall of said opening, an end surface adjoining said opening of the adhesive layer and an outer circumferential surface of the adhesive layer, and forming a circuit in a conventional manner on a plate manufactured in said manner.
  6. A method of manufacturing a printed circuit board, characterized in that a recess is formed on the back of a printed circuit board comprising plastic material in a certain area where the electronic parts are mounted, a metal plate is attached to the bottom of said recess an outer surface, including a metal plate, an inner wall of said opening, an end surface adjoining said opening of the adhesive layer, and an outer circumferential surface of the adhesive layer, and forming a circuit in a conventional manner on a plate manufactured in said manner.
  7. A method according to claim 6, characterized in that the metal plate is fixed to the bottom of said recess so that a grooved groove having a certain width is formed between the outer circumference of the metal plate and the inner circumference of the recess. A method according to claim 7, characterized in that the metal plate is fixed by placing it in a stepped part of said recess so that the inner circumferential side of the recess and the opposite outer circumferential side of the metal plate are in contact at several points, said grooved trough retaining a certain width. 13 86943
FI852798A 1983-11-29 1985-07-17 Pressure connector plate for mounting electronic parts and processes for manufacturing it FI86943C (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP22523783 1983-11-29
JP58225237A JPH0378795B2 (en) 1983-11-29 1983-11-29
PCT/JP1984/000565 WO1985002515A1 (en) 1983-11-29 1984-11-27 Printed-circuit board for mounting electronic element and method of manufacture thereof
JP8400565 1984-11-27

Publications (4)

Publication Number Publication Date
FI852798L FI852798L (en) 1985-07-17
FI852798A0 FI852798A0 (en) 1985-07-17
FI86943B true FI86943B (en) 1992-07-15
FI86943C FI86943C (en) 1992-10-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
FI852798A FI86943C (en) 1983-11-29 1985-07-17 Pressure connector plate for mounting electronic parts and processes for manufacturing it

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US (2) US4737395A (en)
EP (1) EP0197148B1 (en)
JP (1) JPH0378795B2 (en)
DE (1) DE3482545D1 (en)
FI (1) FI86943C (en)
SG (1) SG4191G (en)
WO (1) WO1985002515A1 (en)

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Also Published As

Publication number Publication date
DE3482545D1 (en) 1990-07-19
JPS60116191A (en) 1985-06-22
FI86943C (en) 1992-10-26
SG4191G (en) 1991-04-05
FI852798L (en) 1985-07-17
EP0197148A1 (en) 1986-10-15
WO1985002515A1 (en) 1985-06-06
FI852798A (en)
JPH0378795B2 (en) 1991-12-16
US4773955A (en) 1988-09-27
EP0197148B1 (en) 1990-06-13
FI852798A0 (en) 1985-07-17
US4737395A (en) 1988-04-12
EP0197148A4 (en) 1987-06-29
FI852798D0 (en)

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