FI85783B - Kylningskonstruktion foer transistor. - Google Patents
Kylningskonstruktion foer transistor. Download PDFInfo
- Publication number
- FI85783B FI85783B FI890791A FI890791A FI85783B FI 85783 B FI85783 B FI 85783B FI 890791 A FI890791 A FI 890791A FI 890791 A FI890791 A FI 890791A FI 85783 B FI85783 B FI 85783B
- Authority
- FI
- Finland
- Prior art keywords
- transistor
- circuit board
- conductor
- heat
- metal body
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Amplifiers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Bipolar Transistors (AREA)
Claims (5)
1. Kylningskonstruktion för en sädan högfrekvenseffekt-transistor, i vilken värme ur förlusteffekten ledes bort frän halvledarbrickan ätminstone huvudeak1igen via kollektorledaren, kännetecknad av ait i kontakt med eller eom en förlängning för kollektorledaren (C) med ungefär en atorlek som förutsätts för elektriek anslutning är ett metallstycke (9), som är väsentligen etörre an denna och som är efter installation fastkopplad med anpassningebandet (7) av traneietorne (8) anpaseningskrets for avledning av värme tili mönsterkortet. (5) eller därigenom eller för avgivning av värme direkt ur metallstycket.
2. Konstruktion enligt patentkravet 1, kännetecknad av att metallstycket (9) är en kopparledning eller liknande, som har lötts eller genom nägot motsvarande sätt anslutits med det pä mönsterkortet (5) liggande, av dees metallytbeläggning bestäende anpassningebandet (7).
3. Konstruktion enligt patentkravet 1, kännetecknad av att metallstycket (9) är en integrerad del av koilektorledningen (C), varvid det antingen är s&mma kropp med koilektorledningen eller är en före montering därvid permanent fastgjord del eller ledning.
4. Konstruktion enligt patentkravet 1, 2 eller 3, kännetecknad av att den ytterligare innefattar elementer (11) pä jordningssidän av mönsterkortet (5), vilka gör kylningen effekti-vare .
5. Konstruktion enligt nägot av de föregäende patentkraven, kännetecknad av att tvärytan av metallstycket (9) i riktning av • mönsterkortets (5) yta har dimensionerats att överföra tillräcklig värmemängd antingen enbart frän denna tväryta tili mönsterkortet och därigenom eller ocksä tili kylningselementerna (11) för kyl-ning av transistorn.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI890791A FI85783C (sv) | 1989-02-17 | 1989-02-17 | Kylningskonstruktion för transistor |
US07/473,920 US5214309A (en) | 1989-02-17 | 1990-01-31 | Thermally conductive bar cooling arrangement for a transistor |
AT90102984T ATE137065T1 (de) | 1989-02-17 | 1990-02-15 | Kühlungsanordnung für einen transistor |
EP90102984A EP0384301B1 (en) | 1989-02-17 | 1990-02-15 | Cooling arrangement for a transistor |
DE69026523T DE69026523T2 (de) | 1989-02-17 | 1990-02-15 | Kühlungsanordnung für einen Transistor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI890791 | 1989-02-17 | ||
FI890791A FI85783C (sv) | 1989-02-17 | 1989-02-17 | Kylningskonstruktion för transistor |
Publications (4)
Publication Number | Publication Date |
---|---|
FI890791A0 FI890791A0 (fi) | 1989-02-17 |
FI890791A FI890791A (fi) | 1990-08-18 |
FI85783B true FI85783B (fi) | 1992-02-14 |
FI85783C FI85783C (sv) | 1992-05-25 |
Family
ID=8527924
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FI890791A FI85783C (sv) | 1989-02-17 | 1989-02-17 | Kylningskonstruktion för transistor |
Country Status (5)
Country | Link |
---|---|
US (1) | US5214309A (sv) |
EP (1) | EP0384301B1 (sv) |
AT (1) | ATE137065T1 (sv) |
DE (1) | DE69026523T2 (sv) |
FI (1) | FI85783C (sv) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI88452C (sv) * | 1990-03-29 | 1993-05-10 | Nokia Mobile Phones Ltd | Konstruktion för att förbättra avkylning av en effekttransistor |
GB2297436B (en) * | 1995-01-28 | 1999-06-09 | Nokia Mobile Phones Ltd | Mobile telephone apparatus |
FI107850B (sv) * | 1995-06-30 | 2001-10-15 | Nokia Mobile Phones Ltd | Bärmedel för fästanordning av mobilteleanordning |
FI953249A (sv) | 1995-06-30 | 1996-12-31 | Nokia Mobile Phones Ltd | Telefon och ställning för den |
FI107849B (sv) * | 1995-06-30 | 2001-10-15 | Nokia Mobile Phones Ltd | Sätesdel i mobilteleanordning för dess fästanordning |
US6798882B2 (en) | 1995-09-28 | 2004-09-28 | Nokia Mobile Phones Limited | Mobile station |
DE19620834C1 (de) * | 1996-05-23 | 1997-06-19 | Nokia Mobile Phones Ltd | Einrichtung für Schnurlostelefone |
GB2317300B (en) | 1996-09-12 | 2000-08-16 | Nokia Mobile Phones Ltd | A handset |
ES2123435B1 (es) * | 1996-10-29 | 1999-09-16 | Mecanismos Aux Ind | Sistema de disipacion termica en circuito impreso de 800 micras. |
FI104927B (sv) | 1997-10-02 | 2000-04-28 | Nokia Mobile Phones Ltd | Mobil station |
GB2331866B (en) | 1997-11-28 | 2001-08-29 | Nokia Mobile Phones Ltd | Radiotelephone |
FI980303A (sv) * | 1998-02-10 | 1999-08-11 | Nokia Mobile Phones Ltd | Förpackning |
GB9811381D0 (en) | 1998-05-27 | 1998-07-22 | Nokia Mobile Phones Ltd | Predistortion control for power reduction |
GB9811382D0 (en) | 1998-05-27 | 1998-07-22 | Nokia Mobile Phones Ltd | A transmitter |
GB2339113B (en) | 1998-06-30 | 2003-05-21 | Nokia Mobile Phones Ltd | Data transmission in tdma system |
EP2276329A1 (en) | 2009-07-16 | 2011-01-19 | ABB Research Ltd. | Electronic circuit board with a thermal capacitor |
US8383946B2 (en) * | 2010-05-18 | 2013-02-26 | Joinset, Co., Ltd. | Heat sink |
WO2014000800A1 (en) * | 2012-06-28 | 2014-01-03 | Aktiebolaget Electrolux | Printed circuit board and electric filter |
DE102018109920A1 (de) | 2018-04-25 | 2019-10-31 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Kühlung von leistungselektronischen Schaltungen |
IT202100003965A1 (it) | 2021-02-22 | 2022-08-22 | Riccardo Carotenuto | “circuito per ridurre il riscaldamento e aumentare l’efficienza di rettificatori a semiconduttore” |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3192307A (en) * | 1964-05-29 | 1965-06-29 | Burndy Corp | Connector for component and printed circuit board |
US3479570A (en) * | 1966-06-14 | 1969-11-18 | Rca Corp | Encapsulation and connection structure for high power and high frequency semiconductor devices |
US3517272A (en) * | 1968-12-24 | 1970-06-23 | Rca Corp | Microwave circuit with coaxial package semiconductor device |
US3962719A (en) * | 1974-12-05 | 1976-06-08 | Plastronics, Inc. | Mounting pad and semiconductor encapsulation device combination |
US3982271A (en) * | 1975-02-07 | 1976-09-21 | Rca Corporation | Heat spreader and low parasitic transistor mounting |
US4030001A (en) * | 1975-11-19 | 1977-06-14 | E-Systems, Inc. | Co-planar lead connections to microstrip switching devices |
DE2801875A1 (de) * | 1978-01-17 | 1979-07-19 | Siemens Ag | Kuehlkoerper fuer hochfrequenz-bauelemente |
JPS56105668A (en) * | 1980-01-28 | 1981-08-22 | Hitachi Ltd | Thick film hybrid ic |
JPH0135482Y2 (sv) * | 1985-03-26 | 1989-10-30 | ||
JPS6276657A (ja) * | 1985-07-05 | 1987-04-08 | アクリアン インコ−ポレ−テツド | 高周波トランジスタ装置用パツケ−ジ |
JPS63104360A (ja) * | 1986-10-20 | 1988-05-09 | Mitsubishi Electric Corp | 半導体装置 |
US5012322A (en) * | 1987-05-18 | 1991-04-30 | Allegro Microsystems, Inc. | Semiconductor die and mounting assembly |
JPH0750753B2 (ja) * | 1987-08-21 | 1995-05-31 | 株式会社東芝 | トランジスタ装置 |
-
1989
- 1989-02-17 FI FI890791A patent/FI85783C/sv not_active IP Right Cessation
-
1990
- 1990-01-31 US US07/473,920 patent/US5214309A/en not_active Expired - Lifetime
- 1990-02-15 DE DE69026523T patent/DE69026523T2/de not_active Expired - Fee Related
- 1990-02-15 AT AT90102984T patent/ATE137065T1/de not_active IP Right Cessation
- 1990-02-15 EP EP90102984A patent/EP0384301B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE137065T1 (de) | 1996-05-15 |
FI890791A (fi) | 1990-08-18 |
EP0384301B1 (en) | 1996-04-17 |
DE69026523T2 (de) | 1996-09-12 |
US5214309A (en) | 1993-05-25 |
EP0384301A2 (en) | 1990-08-29 |
FI85783C (sv) | 1992-05-25 |
FI890791A0 (fi) | 1989-02-17 |
DE69026523D1 (de) | 1996-05-23 |
EP0384301A3 (en) | 1993-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM | Patent lapsed |
Owner name: NOKIA-MOBIRA OY |