ES2123435B1 - Sistema de disipacion termica en circuito impreso de 800 micras. - Google Patents
Sistema de disipacion termica en circuito impreso de 800 micras.Info
- Publication number
- ES2123435B1 ES2123435B1 ES09602287A ES9602287A ES2123435B1 ES 2123435 B1 ES2123435 B1 ES 2123435B1 ES 09602287 A ES09602287 A ES 09602287A ES 9602287 A ES9602287 A ES 9602287A ES 2123435 B1 ES2123435 B1 ES 2123435B1
- Authority
- ES
- Spain
- Prior art keywords
- printed circuit
- microns
- dissipation system
- thermal dissipation
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
SISTEMA DE DISIPACION TERMICA EN CIRCUITO IMPRESO DE 800 MICRAS. TAL Y COMO PUEDE VERSE EN LA FIGURA UNICA QUE SE ACOMPAÑA, SE HA PRESCINDIDO TOTALMENTE DE LOS RADIADORES ANTERIORMENTE CITADOS, A BASE DE HACER SERVIR EL MISMO CIRCUITO IMPRESO DE POTENCIA (11) COMO ELEMENTO SOPORTE Y CONEXION ELECTRICA, NO SOLO DE LOS COMPONENTES ELECTRICOS Y ELECTRONICOS (14), SINO A LA VEZ, Y DE UNA FORMA CALCULADA, COMO ELEMENTO DISIPADOR DEL CALOR, VALIENDOSE PARA ELLO DE LA CAPACIDAD DE TRANSMISION DE LA PARTE CONDUCTORA DE DICHO CIRCUITO (11).
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES09602287A ES2123435B1 (es) | 1996-10-29 | 1996-10-29 | Sistema de disipacion termica en circuito impreso de 800 micras. |
EP97500170A EP0840372A3 (en) | 1996-10-29 | 1997-10-09 | Thermal dissipation system in 800 micrometer printed circuit |
KR1019970053992A KR19980033018A (ko) | 1996-10-29 | 1997-10-21 | 800 마이크론 인쇄회로의 열 방산 시스템 |
JP9292860A JPH10135673A (ja) | 1996-10-29 | 1997-10-24 | 800ミクロン膜のプリント回路基板の放熱システム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ES09602287A ES2123435B1 (es) | 1996-10-29 | 1996-10-29 | Sistema de disipacion termica en circuito impreso de 800 micras. |
Publications (2)
Publication Number | Publication Date |
---|---|
ES2123435A1 ES2123435A1 (es) | 1999-01-01 |
ES2123435B1 true ES2123435B1 (es) | 1999-09-16 |
Family
ID=8296524
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES09602287A Expired - Lifetime ES2123435B1 (es) | 1996-10-29 | 1996-10-29 | Sistema de disipacion termica en circuito impreso de 800 micras. |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0840372A3 (es) |
JP (1) | JPH10135673A (es) |
KR (1) | KR19980033018A (es) |
ES (1) | ES2123435B1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110290630B (zh) * | 2018-03-19 | 2021-07-27 | 正芯科技有限公司 | 功率模块组装结构 |
KR102169904B1 (ko) * | 2018-09-07 | 2020-10-26 | 유정년 | 제어 장치 및 이를 포함하는 제어 시스템 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5753947A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Transistor and electronic device containing it |
FI85783C (fi) * | 1989-02-17 | 1992-05-25 | Nokia Mobira Oy | Kylningskonstruktion foer transistor. |
FI88452C (fi) * | 1990-03-29 | 1993-05-10 | Nokia Mobile Phones Ltd | Konstruktion foer att foerbaettra avkylning av en effekttransistor |
JPH04233258A (ja) * | 1990-07-23 | 1992-08-21 | Internatl Business Mach Corp <Ibm> | 超小型電子回路パッケージ |
EP0489958B1 (de) * | 1990-12-12 | 1994-03-16 | Siemens Aktiengesellschaft | Leiterplatte für elektronische Steuergeräte und Verfahren zum Herstellen einer solchen Leiterplatte |
US5310351A (en) * | 1992-10-29 | 1994-05-10 | Mcadow Theodore | Relay support circuit board unit |
GB9225260D0 (en) * | 1992-12-03 | 1993-01-27 | Int Computers Ltd | Cooling electronic circuit assemblies |
JP3155885B2 (ja) * | 1994-06-08 | 2001-04-16 | 電気化学工業株式会社 | 回路基板 |
JPH08279664A (ja) * | 1995-04-04 | 1996-10-22 | Unisia Jecs Corp | 電子部品実装基板 |
-
1996
- 1996-10-29 ES ES09602287A patent/ES2123435B1/es not_active Expired - Lifetime
-
1997
- 1997-10-09 EP EP97500170A patent/EP0840372A3/en not_active Ceased
- 1997-10-21 KR KR1019970053992A patent/KR19980033018A/ko not_active Application Discontinuation
- 1997-10-24 JP JP9292860A patent/JPH10135673A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
KR19980033018A (ko) | 1998-07-25 |
EP0840372A3 (en) | 1999-02-17 |
EP0840372A2 (en) | 1998-05-06 |
JPH10135673A (ja) | 1998-05-22 |
ES2123435A1 (es) | 1999-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EC2A | Search report published |
Date of ref document: 19990101 Kind code of ref document: A1 Effective date: 19990101 |
|
PC2A | Transfer of patent |