FI20085790A - Sähköisen komponentin sisältävä paketoitu piirilevyrakenne ja menetelmä sähköisen komponentin sisältävän paketoidun piirilevyrakenteen valmistamiseksi - Google Patents

Sähköisen komponentin sisältävä paketoitu piirilevyrakenne ja menetelmä sähköisen komponentin sisältävän paketoidun piirilevyrakenteen valmistamiseksi Download PDF

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Publication number
FI20085790A
FI20085790A FI20085790A FI20085790A FI20085790A FI 20085790 A FI20085790 A FI 20085790A FI 20085790 A FI20085790 A FI 20085790A FI 20085790 A FI20085790 A FI 20085790A FI 20085790 A FI20085790 A FI 20085790A
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Finland
Prior art keywords
electrical component
circuit board
board assembly
plane
layer
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FI20085790A
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English (en)
Swedish (sv)
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FI20085790A0 (fi
FI125526B (fi
Inventor
Petteri Palm
Tuomas Waris
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Imbera Electronics Oy
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Priority to FI20085790A priority Critical patent/FI125526B/fi
Publication of FI20085790A0 publication Critical patent/FI20085790A0/fi
Priority to US12/546,454 priority patent/US8631566B2/en
Publication of FI20085790A publication Critical patent/FI20085790A/fi
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Publication of FI125526B publication Critical patent/FI125526B/fi

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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
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    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
FI20085790A 2008-08-25 2008-08-25 Sähköisiä komponentteja sisältävä paketoitu piirilevyrakenne ja menetelmä sähköisiä komponentteja sisältävän paketoidun piirilevyrakenteen valmistamiseksi FI125526B (fi)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FI20085790A FI125526B (fi) 2008-08-25 2008-08-25 Sähköisiä komponentteja sisältävä paketoitu piirilevyrakenne ja menetelmä sähköisiä komponentteja sisältävän paketoidun piirilevyrakenteen valmistamiseksi
US12/546,454 US8631566B2 (en) 2008-08-25 2009-08-24 Circuit board structure comprising an electrical component and a method for manufacturing a circuit board structure comprising an electrical component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20085790A FI125526B (fi) 2008-08-25 2008-08-25 Sähköisiä komponentteja sisältävä paketoitu piirilevyrakenne ja menetelmä sähköisiä komponentteja sisältävän paketoidun piirilevyrakenteen valmistamiseksi
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US8735735B2 (en) 2010-07-23 2014-05-27 Ge Embedded Electronics Oy Electronic module with embedded jumper conductor
US20130288425A1 (en) * 2011-08-05 2013-10-31 Solexel, Inc. End point detection for back contact solar cell laser via drilling
TWI502733B (zh) * 2012-11-02 2015-10-01 環旭電子股份有限公司 電子封裝模組及其製造方法
DE102013207611A1 (de) * 2013-04-25 2014-10-30 Osram Gmbh Beleuchtungsvorrichtung mit optoelektronischem Bauelement
DE102019132852B4 (de) * 2019-12-03 2021-12-30 Schweizer Electronic Ag Verfahren zum Herstellen eines Leiterstrukturelements und Leiterstrukturelement

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US3739438A (en) * 1970-02-25 1973-06-19 Union Carbide Corp System for molding electronic components
US3650648A (en) * 1970-02-25 1972-03-21 Union Carbide Corp System for molding electronic components
JP2874279B2 (ja) * 1990-05-10 1999-03-24 三菱電機株式会社 薄型半導体装置の製造方法
US5353498A (en) * 1993-02-08 1994-10-11 General Electric Company Method for fabricating an integrated circuit module
JP2595909B2 (ja) * 1994-09-14 1997-04-02 日本電気株式会社 半導体装置
JPH08288424A (ja) * 1995-04-18 1996-11-01 Nec Corp 半導体装置
US5617297A (en) * 1995-09-25 1997-04-01 National Semiconductor Corporation Encapsulation filler technology for molding active electronics components such as IC cards or PCMCIA cards
US5866952A (en) * 1995-11-30 1999-02-02 Lockheed Martin Corporation High density interconnected circuit module with a compliant layer as part of a stress-reducing molded substrate
JP3793628B2 (ja) * 1997-01-20 2006-07-05 沖電気工業株式会社 樹脂封止型半導体装置
JPH10242333A (ja) * 1997-03-01 1998-09-11 Nitto Denko Corp 半導体装置及び半導体装置の製造方法
JPH11260863A (ja) * 1998-03-09 1999-09-24 Sumitomo Electric Ind Ltd 半導体装置用接続端子とその製造方法
US20020149027A1 (en) * 1998-03-19 2002-10-17 Noriyuki Takahashi Semiconductor device and its manufacture, and semiconductor device packaging structure
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JP2001339011A (ja) * 2000-03-24 2001-12-07 Shinko Electric Ind Co Ltd 半導体装置およびその製造方法
FR2822338B1 (fr) 2001-03-14 2003-06-27 Sagem Procede pour connecter electriquement des plots de contact d'un composant microelectronique directement a des pistes de circuits imprimes, et plaque a circuits imprimes ainsi constituee
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FI20085790A0 (fi) 2008-08-25
FI125526B (fi) 2015-11-13
US8631566B2 (en) 2014-01-21
US20100046186A1 (en) 2010-02-25

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