FI20030816A0 - Förfarande för framställning av metalledningar på substrat - Google Patents

Förfarande för framställning av metalledningar på substrat

Info

Publication number
FI20030816A0
FI20030816A0 FI20030816A FI20030816A FI20030816A0 FI 20030816 A0 FI20030816 A0 FI 20030816A0 FI 20030816 A FI20030816 A FI 20030816A FI 20030816 A FI20030816 A FI 20030816A FI 20030816 A0 FI20030816 A0 FI 20030816A0
Authority
FI
Finland
Prior art keywords
substrate
metal wires
making metal
making
wires
Prior art date
Application number
FI20030816A
Other languages
English (en)
Finnish (fi)
Other versions
FI20030816A (sv
Inventor
Markku Leskelae
Mikko Ritala
Seppo Lindroos
Hanna Uusikartano
Pekka Koivukunnas
Original Assignee
Metso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metso Corp filed Critical Metso Corp
Priority to FI20030816A priority Critical patent/FI20030816A/sv
Publication of FI20030816A0 publication Critical patent/FI20030816A0/sv
Priority to EP04735248A priority patent/EP1629137A1/en
Priority to CA002526068A priority patent/CA2526068A1/en
Priority to BRPI0410874-4A priority patent/BRPI0410874A/pt
Priority to US10/557,174 priority patent/US20060286304A1/en
Priority to JP2006508329A priority patent/JP2006526074A/ja
Priority to CN200480015141.5A priority patent/CN1798869A/zh
Priority to PCT/FI2004/000327 priority patent/WO2004106585A1/en
Priority to RU2005141557/02A priority patent/RU2005141557A/ru
Publication of FI20030816A publication Critical patent/FI20030816A/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/161—Process or apparatus coating on selected surface areas by direct patterning from plating step, e.g. inkjet
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
FI20030816A 2003-05-30 2003-05-30 Förfarande för framställning av metalledningar på substrat FI20030816A (sv)

Priority Applications (9)

Application Number Priority Date Filing Date Title
FI20030816A FI20030816A (sv) 2003-05-30 2003-05-30 Förfarande för framställning av metalledningar på substrat
EP04735248A EP1629137A1 (en) 2003-05-30 2004-05-28 Method for producing metal conductors on a substrate
CA002526068A CA2526068A1 (en) 2003-05-30 2004-05-28 Method for producing metal conductors on a substrate
BRPI0410874-4A BRPI0410874A (pt) 2003-05-30 2004-05-28 processo para produzir condutores metálicos em um substrato
US10/557,174 US20060286304A1 (en) 2003-05-30 2004-05-28 Methttod for producing metal conductors on a substrate
JP2006508329A JP2006526074A (ja) 2003-05-30 2004-05-28 基体に金属の導電体を生産するための方法
CN200480015141.5A CN1798869A (zh) 2003-05-30 2004-05-28 在衬底上制备金属导体的方法
PCT/FI2004/000327 WO2004106585A1 (en) 2003-05-30 2004-05-28 Method for producing metal conductors on a substrate
RU2005141557/02A RU2005141557A (ru) 2003-05-30 2004-05-28 Способ производства металлических проводников на подложке

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20030816A FI20030816A (sv) 2003-05-30 2003-05-30 Förfarande för framställning av metalledningar på substrat

Publications (2)

Publication Number Publication Date
FI20030816A0 true FI20030816A0 (sv) 2003-05-30
FI20030816A FI20030816A (sv) 2004-12-01

Family

ID=8566186

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20030816A FI20030816A (sv) 2003-05-30 2003-05-30 Förfarande för framställning av metalledningar på substrat

Country Status (9)

Country Link
US (1) US20060286304A1 (sv)
EP (1) EP1629137A1 (sv)
JP (1) JP2006526074A (sv)
CN (1) CN1798869A (sv)
BR (1) BRPI0410874A (sv)
CA (1) CA2526068A1 (sv)
FI (1) FI20030816A (sv)
RU (1) RU2005141557A (sv)
WO (1) WO2004106585A1 (sv)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060130700A1 (en) * 2004-12-16 2006-06-22 Reinartz Nicole M Silver-containing inkjet ink
DE102007055053A1 (de) * 2007-11-16 2009-05-20 Hueck Engraving Gmbh & Co. Kg Verfahren zur Bearbeitung einer strukturierten Oberfläche
US7682431B1 (en) * 2008-11-12 2010-03-23 Lam Research Corporation Plating solutions for electroless deposition of ruthenium
CA2918939C (en) 2013-07-24 2021-10-26 National Research Council Of Canada Process for depositing metal on a substrate
CN109706439B (zh) * 2019-01-02 2020-10-30 济南大学 一种组合喷镀镀银还原液及其制备方法
CN116288295B (zh) * 2023-03-23 2024-06-25 河南科技大学 一种长度和表面粗糙度可调节的Au钉子及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB191120012A (en) * 1911-09-08 1912-01-11 Pascal Marino A Process of Superficially Metallizing the Surface of Cast Iron, Wood, Gypsum, Paper and other Porous Substances or Articles for the purpose of Electrolytically Depositing Metals or Alloys thereof.
US3058845A (en) * 1959-06-23 1962-10-16 Du Pont Process for metallizing polyacrylonitrile shaped article by treating with a water soluble metal salt and reducing the salt to the free metal
US4150171A (en) * 1976-03-30 1979-04-17 Surface Technology, Inc. Electroless plating
JPH0826462B2 (ja) * 1987-11-30 1996-03-13 龍徳 四十宮 表面金属化重合体成形物の製造方法
US5132248A (en) * 1988-05-31 1992-07-21 The United States Of America As Represented By The United States Department Of Energy Direct write with microelectronic circuit fabrication
US5158604A (en) * 1991-07-01 1992-10-27 Monsanto Company Viscous electroless plating solutions
EP0811083B1 (en) * 1995-12-19 2000-05-31 FSI International Electroless deposition of metal films with spray processor
US5989653A (en) * 1997-12-08 1999-11-23 Sandia Corporation Process for metallization of a substrate by irradiative curing of a catalyst applied thereto
US6328078B1 (en) * 1998-03-13 2001-12-11 Tietex International, Ltd. System and process for forming a fabric having digitally printed warp yarns
DE10050862C2 (de) * 2000-10-06 2002-08-01 Atotech Deutschland Gmbh Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen
WO2002063067A1 (fr) * 2001-02-07 2002-08-15 Tokyo Electron Limited Procede et appareil de depot autocatalytique

Also Published As

Publication number Publication date
CN1798869A (zh) 2006-07-05
WO2004106585A1 (en) 2004-12-09
FI20030816A (sv) 2004-12-01
JP2006526074A (ja) 2006-11-16
BRPI0410874A (pt) 2006-07-04
US20060286304A1 (en) 2006-12-21
CA2526068A1 (en) 2004-12-09
EP1629137A1 (en) 2006-03-01
RU2005141557A (ru) 2006-05-10

Similar Documents

Publication Publication Date Title
DE602004004832D1 (de) Beschichtung für siliziumhaltiges Substrat
GB2402941B (en) Method for manufacturing substrate
FR2838735B1 (fr) Substrat a revetement auto-nettoyant
DE60327015D1 (de) Substrat für transparente Elektroden
DE602004027517D1 (de) Musterbeschichtungsverfahren
DE602004011458D1 (de) Substratverarbeitungsverfahren
EP1788618A4 (en) SUBSTRATE PROCESSING
TWI367571B (en) Method for maunfacturing an element mounting substrate
EP1595004A4 (en) METHOD FOR DEPOSITING CDA ON A SUBSTRATE
DE60220736D1 (de) Herstellungsverfahren für gebondetes Substrat
EP1496354A4 (en) METHOD FOR DETERMINING SUBSTRATE
DE10352144B8 (de) Vakuumbeschichtungsanlage zum Beschichten von längserstreckten Substraten
GB2422489B (en) Method for manufacturing compound semiconductor substrate
DE60301923D1 (de) Geschlitzes Substrat
FI20020835A (sv) Förfarande för förädling av ädelmetallsslig
DE602004003621D1 (de) Beschichtung für siliziumhaltiges Substrat
IL178084A0 (en) Process for producing semi-conductor coated substrate
EP1598859A4 (en) SUBSTRATE PROCESSING
DE602004021074D1 (de) Platinbeschichtungsverfahren
FI20030816A (sv) Förfarande för framställning av metalledningar på substrat
FI20012375A0 (sv) Förfarande för framställning av pressade skiktstrukturer
IL163572A0 (en) Method for manufacturing flat paneldisplay substrates orbotech ltd.
NO20026107D0 (no) Fremgangsmåte for dannelse av en sjiktstruktur på et substrat
FI20022034A (sv) Förfarande för bestrykning
FI116686B (sv) Förfarande för smältning av kopparsliger

Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: AVANTONE OY