FI112585B - Kylelement - Google Patents

Kylelement Download PDF

Info

Publication number
FI112585B
FI112585B FI961181A FI961181A FI112585B FI 112585 B FI112585 B FI 112585B FI 961181 A FI961181 A FI 961181A FI 961181 A FI961181 A FI 961181A FI 112585 B FI112585 B FI 112585B
Authority
FI
Finland
Prior art keywords
profiles
copper
cooling
profile
wedge surfaces
Prior art date
Application number
FI961181A
Other languages
English (en)
Finnish (fi)
Other versions
FI961181A (sv
FI961181A0 (sv
Inventor
Markku Puska
Original Assignee
Nokia Alumiini Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Alumiini Oy filed Critical Nokia Alumiini Oy
Priority to FI961181A priority Critical patent/FI112585B/sv
Publication of FI961181A0 publication Critical patent/FI961181A0/sv
Priority to FR9702924A priority patent/FR2746251B1/fr
Priority to SE9700880A priority patent/SE520269C2/sv
Priority to DE1997110225 priority patent/DE19710225A1/de
Publication of FI961181A publication Critical patent/FI961181A/sv
Application granted granted Critical
Publication of FI112585B publication Critical patent/FI112585B/sv

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Claims (3)

1. Kylelement speciellt för kylning av kraftelektronikkomponenter el-ler/och -komponentkombinationer, i vilket kylelement atminstone kylribbor (4) är 5 utformade av väsentligen platta plana aluminiumprofiler (1, 2), som är fästa i varandra, kännetecknat avatt atminstone en del av kylelementets mas-siva bottendel (3) är utformad av langsträckta kopparprofiler (5), vilkas langsträckta kanter är försedda med kilytor (6, 7), som bildar en med en angrän-sande profil sammanpassande konvex och konkav fogdel och som later profi-10 lerna (5) fastna i varandra, och att de plana aluminiumprofilerna (1, 2) är försedda med kilytor (8, 9, 10) som passar samman med kilytorna (6, 7) pa kopparpro-filerna (5), för att de plana aluminiumprofilerna (1, 2) skall kunna fästas i kop-parprofilerna (5).
2. Kylelement enligt patentkrav 1, kännetecknat avatt kop-15 parprofilerna (5) är anordnade endast pa det ställe hos den massiva bottendelen (3) som blir hetast.
3. Kylelement enligt patentkrav 1, kännetecknat avatt kop-parprofilerna (5) är anordnade att bilda hela den massiva bottendelen (3) hos kylelementet. 20
FI961181A 1996-03-13 1996-03-13 Kylelement FI112585B (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI961181A FI112585B (sv) 1996-03-13 1996-03-13 Kylelement
FR9702924A FR2746251B1 (fr) 1996-03-13 1997-03-12 Element de refroidissement, notamment pour composants electroniques de puissance
SE9700880A SE520269C2 (sv) 1996-03-13 1997-03-12 Kylelement
DE1997110225 DE19710225A1 (de) 1996-03-13 1997-03-12 Kühlelement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI961181A FI112585B (sv) 1996-03-13 1996-03-13 Kylelement
FI961181 1996-03-13

Publications (3)

Publication Number Publication Date
FI961181A0 FI961181A0 (sv) 1996-03-13
FI961181A FI961181A (sv) 1997-09-14
FI112585B true FI112585B (sv) 2003-12-15

Family

ID=8545651

Family Applications (1)

Application Number Title Priority Date Filing Date
FI961181A FI112585B (sv) 1996-03-13 1996-03-13 Kylelement

Country Status (4)

Country Link
DE (1) DE19710225A1 (sv)
FI (1) FI112585B (sv)
FR (1) FR2746251B1 (sv)
SE (1) SE520269C2 (sv)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6691768B2 (en) * 2001-06-25 2004-02-17 Sun Microsystems, Inc. Heatsink design for uniform heat dissipation
DE102006019376A1 (de) * 2006-04-24 2007-10-25 Bombardier Transportation Gmbh Leistungskühler für Stromrichterbaugruppen und Stromrichter, insbesondere für Schienen- und Hybridfahrzeuge

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312277A (en) * 1965-03-22 1967-04-04 Astrodyne Inc Heat sink
DE3415554A1 (de) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Kuehlkoerper fuer leistungselektronische bauelemente
DE8429523U1 (de) * 1984-10-08 1984-11-29 Nixdorf Computer Ag, 4790 Paderborn Kühlkörper für elektronische Bauelemente und/oder Geräte

Also Published As

Publication number Publication date
SE9700880L (sv) 1997-09-14
FR2746251A1 (fr) 1997-09-19
DE19710225A1 (de) 1997-10-30
FR2746251B1 (fr) 2002-12-06
SE9700880D0 (sv) 1997-03-12
FI961181A (sv) 1997-09-14
FI961181A0 (sv) 1996-03-13
SE520269C2 (sv) 2003-06-17

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Legal Events

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MA Patent expired