ES8600791A1 - Procedimiento para depositar aleaciones de oro-cobre-cinc de pocos quilates - Google Patents

Procedimiento para depositar aleaciones de oro-cobre-cinc de pocos quilates

Info

Publication number
ES8600791A1
ES8600791A1 ES538681A ES538681A ES8600791A1 ES 8600791 A1 ES8600791 A1 ES 8600791A1 ES 538681 A ES538681 A ES 538681A ES 538681 A ES538681 A ES 538681A ES 8600791 A1 ES8600791 A1 ES 8600791A1
Authority
ES
Spain
Prior art keywords
zinc
copper
gold
deposition
concentration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES538681A
Other languages
English (en)
Spanish (es)
Other versions
ES538681A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPW Chemie GmbH
Original Assignee
LPW Chemie GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPW Chemie GmbH filed Critical LPW Chemie GmbH
Publication of ES8600791A1 publication Critical patent/ES8600791A1/es
Publication of ES538681A0 publication Critical patent/ES538681A0/es
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/62Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
ES538681A 1983-12-17 1984-12-17 Procedimiento para depositar aleaciones de oro-cobre-cinc de pocos quilates Granted ES538681A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833345795 DE3345795A1 (de) 1983-12-17 1983-12-17 Elektrolyt zur galvanischen abscheidung niedrigkaraetiger gold-kupfer-zink-legierungen

Publications (2)

Publication Number Publication Date
ES8600791A1 true ES8600791A1 (es) 1985-11-01
ES538681A0 ES538681A0 (es) 1985-11-01

Family

ID=6217308

Family Applications (1)

Application Number Title Priority Date Filing Date
ES538681A Granted ES538681A0 (es) 1983-12-17 1984-12-17 Procedimiento para depositar aleaciones de oro-cobre-cinc de pocos quilates

Country Status (7)

Country Link
JP (1) JPS60141891A (de)
DE (1) DE3345795A1 (de)
ES (1) ES538681A0 (de)
FR (1) FR2556745A1 (de)
GB (1) GB2151661A (de)
IE (1) IE56138B1 (de)
IT (1) IT1177440B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3601559A1 (de) * 1986-01-21 1987-07-23 Lpw Chemie Gmbh Verfahren zur einstellung der "goldfarbe" bei der galvanischen abscheidung niedrigkaraetiger gold-kupfer-zink-legierungen
DE3633529A1 (de) * 1986-10-02 1988-05-19 Lpw Chemie Gmbh Verfahren zum galvanischen abscheiden niedrigkaraetiger gold/kupfer/zink-legierungen
ATE86313T1 (de) * 1987-08-21 1993-03-15 Engelhard Ltd Bad fuer das elektroplattieren einer gold-kupfer- zink-legierung.
CH680927A5 (de) * 1990-10-08 1992-12-15 Metaux Precieux Sa
US5085744A (en) * 1990-11-06 1992-02-04 Learonal, Inc. Electroplated gold-copper-zinc alloys
ES2179952T3 (es) 1995-11-03 2003-02-01 Enthone Omi Inc Composiciones y depositos de procedimientos de electrodeposicion.
JP7352515B2 (ja) * 2020-05-19 2023-09-28 Eeja株式会社 電解金合金めっき浴及び電解金合金めっき方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH595463A5 (en) * 1974-11-29 1978-02-15 Heinz Emmenegger Electroplating of gold and its alloys
DE3020765A1 (de) * 1980-05-31 1981-12-10 Degussa Ag, 6000 Frankfurt Alkalisches bad zum galvanischen abscheiden niederkaraetiger rosa- bis gelbfarbener goldlegierungsschichten

Also Published As

Publication number Publication date
IT8424102A1 (it) 1986-06-17
GB2151661A (en) 1985-07-24
JPS60141891A (ja) 1985-07-26
GB8431765D0 (en) 1985-01-30
IE843234L (en) 1985-06-17
DE3345795A1 (de) 1985-07-04
IT1177440B (it) 1987-08-26
FR2556745A1 (fr) 1985-06-21
IE56138B1 (en) 1991-04-24
ES538681A0 (es) 1985-11-01
IT8424102A0 (it) 1984-12-17

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