ES8600570A1 - Disposicion de una pastilla de semiconductores de potencia exenta de carcasa y sumergida en un liquido de refrigeracion por ebullicion - Google Patents

Disposicion de una pastilla de semiconductores de potencia exenta de carcasa y sumergida en un liquido de refrigeracion por ebullicion

Info

Publication number
ES8600570A1
ES8600570A1 ES537385A ES537385A ES8600570A1 ES 8600570 A1 ES8600570 A1 ES 8600570A1 ES 537385 A ES537385 A ES 537385A ES 537385 A ES537385 A ES 537385A ES 8600570 A1 ES8600570 A1 ES 8600570A1
Authority
ES
Spain
Prior art keywords
semiconductor wafer
power semiconductor
evaporative cooling
heat dissipaters
stackable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES537385A
Other languages
English (en)
Other versions
ES537385A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of ES537385A0 publication Critical patent/ES537385A0/es
Publication of ES8600570A1 publication Critical patent/ES8600570A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

DISPOSICION DE PASTILLA DE SEMICONDUCTORES DE POTENCIA, EXENTA DE CARCASA Y SUMERGIDA EN UN LIQUIDO DE REFRIGERACION POR EBULLICION.LOS DISISPADORES DE CALOR ESTAN PROVISTOS DE BOTONES DISTANCIADORES (8) EN EL LADO ALEJADO DE LA PASTILLA DE SEMICONDUCTOR DE POTENCIA (1), A TRAVES DE LOS CUALES SE TRANSMITE LA FUERZA DE SUJECION DE LOS PERNOS DE TRACCION (7) A LA PASTILLA. LOS SUJETADORES DE MATERIAL SINTETICO ESTAN CONFIGURADOS EN FORMA DE ESPIGAS AISLANTES (9) EMBUTIDAS EN UNO DE LOS DISISPADORES DE CALOR Y QUE FORMAN UNA RETENCION DE ACCION ELASTICA PARA LA PASTILLA.
ES537385A 1983-11-18 1984-11-05 Disposicion de una pastilla de semiconductores de potencia exenta de carcasa y sumergida en un liquido de refrigeracion por ebullicion Expired ES8600570A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3342102A DE3342102C2 (de) 1983-11-18 1983-11-18 Aufbau stapelbarer, gehäuseloser Leistungshalbleiter zur Siedekühlung

Publications (2)

Publication Number Publication Date
ES537385A0 ES537385A0 (es) 1985-10-16
ES8600570A1 true ES8600570A1 (es) 1985-10-16

Family

ID=6214908

Family Applications (1)

Application Number Title Priority Date Filing Date
ES537385A Expired ES8600570A1 (es) 1983-11-18 1984-11-05 Disposicion de una pastilla de semiconductores de potencia exenta de carcasa y sumergida en un liquido de refrigeracion por ebullicion

Country Status (4)

Country Link
AT (1) AT391775B (es)
CH (1) CH665730A5 (es)
DE (1) DE3342102C2 (es)
ES (1) ES8600570A1 (es)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2907780A1 (de) * 1979-02-28 1980-09-11 Alsthom Atlantique Halter fuer eine leistungshalbleiterscheibe, die zur kuehlung in fluessigen fluorierten kohlenwasserstoff eingetaucht wird

Also Published As

Publication number Publication date
ES537385A0 (es) 1985-10-16
DE3342102A1 (de) 1985-05-30
ATA363484A (de) 1990-05-15
DE3342102C2 (de) 1986-06-19
AT391775B (de) 1990-11-26
CH665730A5 (de) 1988-05-31

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970303