ATA363484A - Stapelbare anordnung einer gehaeuselosen, in eine siedekuehlfluessigkeit getauchten leistungshalbleiterscheibe - Google Patents
Stapelbare anordnung einer gehaeuselosen, in eine siedekuehlfluessigkeit getauchten leistungshalbleiterscheibeInfo
- Publication number
- ATA363484A ATA363484A AT363484A AT363484A ATA363484A AT A363484 A ATA363484 A AT A363484A AT 363484 A AT363484 A AT 363484A AT 363484 A AT363484 A AT 363484A AT A363484 A ATA363484 A AT A363484A
- Authority
- AT
- Austria
- Prior art keywords
- houseless
- submersed
- power semiconductor
- cooling liquid
- semiconductor disc
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
- H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3342102A DE3342102C2 (de) | 1983-11-18 | 1983-11-18 | Aufbau stapelbarer, gehäuseloser Leistungshalbleiter zur Siedekühlung |
Publications (2)
Publication Number | Publication Date |
---|---|
ATA363484A true ATA363484A (de) | 1990-05-15 |
AT391775B AT391775B (de) | 1990-11-26 |
Family
ID=6214908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT0363484A AT391775B (de) | 1983-11-18 | 1984-11-16 | Stapelbare anordnung einer gehaeuselosen, in eine siedekuehlfluessigkeit getauchten leistungshalbleiterscheibe |
Country Status (4)
Country | Link |
---|---|
AT (1) | AT391775B (de) |
CH (1) | CH665730A5 (de) |
DE (1) | DE3342102C2 (de) |
ES (1) | ES8600570A1 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5040051A (en) * | 1988-12-05 | 1991-08-13 | Sundstrand Corporation | Hydrostatic clamp and method for compression type power semiconductors |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2907780A1 (de) * | 1979-02-28 | 1980-09-11 | Alsthom Atlantique | Halter fuer eine leistungshalbleiterscheibe, die zur kuehlung in fluessigen fluorierten kohlenwasserstoff eingetaucht wird |
-
1983
- 1983-11-18 DE DE3342102A patent/DE3342102C2/de not_active Expired
-
1984
- 1984-11-05 ES ES537385A patent/ES8600570A1/es not_active Expired
- 1984-11-16 CH CH5493/84A patent/CH665730A5/de not_active IP Right Cessation
- 1984-11-16 AT AT0363484A patent/AT391775B/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AT391775B (de) | 1990-11-26 |
ES537385A0 (es) | 1985-10-16 |
DE3342102C2 (de) | 1986-06-19 |
DE3342102A1 (de) | 1985-05-30 |
CH665730A5 (de) | 1988-05-31 |
ES8600570A1 (es) | 1985-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |