ATA363484A - Stapelbare anordnung einer gehaeuselosen, in eine siedekuehlfluessigkeit getauchten leistungshalbleiterscheibe - Google Patents

Stapelbare anordnung einer gehaeuselosen, in eine siedekuehlfluessigkeit getauchten leistungshalbleiterscheibe

Info

Publication number
ATA363484A
ATA363484A AT363484A AT363484A ATA363484A AT A363484 A ATA363484 A AT A363484A AT 363484 A AT363484 A AT 363484A AT 363484 A AT363484 A AT 363484A AT A363484 A ATA363484 A AT A363484A
Authority
AT
Austria
Prior art keywords
houseless
submersed
power semiconductor
cooling liquid
semiconductor disc
Prior art date
Application number
AT363484A
Other languages
English (en)
Other versions
AT391775B (de
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of ATA363484A publication Critical patent/ATA363484A/de
Application granted granted Critical
Publication of AT391775B publication Critical patent/AT391775B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
AT0363484A 1983-11-18 1984-11-16 Stapelbare anordnung einer gehaeuselosen, in eine siedekuehlfluessigkeit getauchten leistungshalbleiterscheibe AT391775B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3342102A DE3342102C2 (de) 1983-11-18 1983-11-18 Aufbau stapelbarer, gehäuseloser Leistungshalbleiter zur Siedekühlung

Publications (2)

Publication Number Publication Date
ATA363484A true ATA363484A (de) 1990-05-15
AT391775B AT391775B (de) 1990-11-26

Family

ID=6214908

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0363484A AT391775B (de) 1983-11-18 1984-11-16 Stapelbare anordnung einer gehaeuselosen, in eine siedekuehlfluessigkeit getauchten leistungshalbleiterscheibe

Country Status (4)

Country Link
AT (1) AT391775B (de)
CH (1) CH665730A5 (de)
DE (1) DE3342102C2 (de)
ES (1) ES8600570A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2907780A1 (de) * 1979-02-28 1980-09-11 Alsthom Atlantique Halter fuer eine leistungshalbleiterscheibe, die zur kuehlung in fluessigen fluorierten kohlenwasserstoff eingetaucht wird

Also Published As

Publication number Publication date
AT391775B (de) 1990-11-26
ES537385A0 (es) 1985-10-16
DE3342102C2 (de) 1986-06-19
DE3342102A1 (de) 1985-05-30
CH665730A5 (de) 1988-05-31
ES8600570A1 (es) 1985-10-16

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee