ES8507310A1 - Metodo para recubrir parcial o completamente un articulo o substrato ceramico con una capa metalica - Google Patents

Metodo para recubrir parcial o completamente un articulo o substrato ceramico con una capa metalica

Info

Publication number
ES8507310A1
ES8507310A1 ES533258A ES533258A ES8507310A1 ES 8507310 A1 ES8507310 A1 ES 8507310A1 ES 533258 A ES533258 A ES 533258A ES 533258 A ES533258 A ES 533258A ES 8507310 A1 ES8507310 A1 ES 8507310A1
Authority
ES
Spain
Prior art keywords
compounds
adsorption
species
metal
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES533258A
Other languages
English (en)
Spanish (es)
Other versions
ES533258A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of ES533258A0 publication Critical patent/ES533258A0/es
Publication of ES8507310A1 publication Critical patent/ES8507310A1/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C04B41/5338—Etching
    • C04B41/5361—Etching with molten material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/91—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics involving the removal of part of the materials of the treated articles, e.g. etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Ceramic Products (AREA)
ES533258A 1983-06-09 1984-06-08 Metodo para recubrir parcial o completamente un articulo o substrato ceramico con una capa metalica Expired ES8507310A1 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50274883A 1983-06-09 1983-06-09
US06/611,193 US4574094A (en) 1983-06-09 1984-05-21 Metallization of ceramics

Publications (2)

Publication Number Publication Date
ES533258A0 ES533258A0 (es) 1985-09-01
ES8507310A1 true ES8507310A1 (es) 1985-09-01

Family

ID=27054268

Family Applications (1)

Application Number Title Priority Date Filing Date
ES533258A Expired ES8507310A1 (es) 1983-06-09 1984-06-08 Metodo para recubrir parcial o completamente un articulo o substrato ceramico con una capa metalica

Country Status (12)

Country Link
US (1) US4574094A (https=)
EP (1) EP0133201B1 (https=)
KR (1) KR870001780B1 (https=)
AU (1) AU567169B2 (https=)
BR (1) BR8402804A (https=)
CA (1) CA1226847A (https=)
DE (2) DE3476872D1 (https=)
DK (1) DK282684A (https=)
ES (1) ES8507310A1 (https=)
GB (1) GB2141740B (https=)
IN (1) IN165122B (https=)
PH (1) PH20685A (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4647477A (en) * 1984-12-07 1987-03-03 Kollmorgen Technologies Corporation Surface preparation of ceramic substrates for metallization
EP0185967A3 (en) * 1984-12-10 1988-08-03 Kollmorgen Corporation Process for avoiding blister formation in electroless metallization of ceramic substrates
US4696851A (en) * 1985-03-25 1987-09-29 Olin Corporation Hybrid and multi-layer circuitry
DE3523958A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur chemischen behandlung von keramikkoerpern mit nachfolgender metallisierung
DE3523956A1 (de) * 1985-07-04 1987-01-08 Licentia Gmbh Verfahren zur chemischen metallisierung eines elektrisch schlecht leitenden traegerkoerpers aus einem anorganischen material
JPH0632355B2 (ja) * 1986-01-27 1994-04-27 株式会社日立製作所 セラミツク配線基板とその製造方法
US5119272A (en) * 1986-07-21 1992-06-02 Mitsumi Electric Co., Ltd. Circuit board and method of producing circuit board
US4888208A (en) * 1986-10-16 1989-12-19 Toyo Boseki Kabushiki Kaisha Ceramic substrate for printed circuits and production thereof
DE3744747C3 (de) * 1986-11-08 1997-07-17 Matsushita Electric Works Ltd Verfahren zur Herstellung einer keramischen Leiterplatte sowie Anwendung des Verfahrens
JPH0653253B2 (ja) * 1986-11-08 1994-07-20 松下電工株式会社 セラミツク基板の粗化法
US5162191A (en) * 1988-01-05 1992-11-10 Max Levy Autograph, Inc. High-density circuit and method of its manufacture
US4897676A (en) * 1988-01-05 1990-01-30 Max Levy Autograph, Inc. High-density circuit and method of its manufacture
US5488394A (en) * 1988-01-05 1996-01-30 Max Levy Autograph, Inc. Print head and method of making same
DE3833441A1 (de) * 1988-10-01 1990-04-05 Hoechst Ag Verfahren zum metallisieren von aluminiumoxid-substraten
DE4138214A1 (de) * 1991-11-21 1993-05-27 Daimler Benz Ag Verfahren zur metallisierung von aluminiumnitridkeramik
DE4342258A1 (de) * 1993-12-10 1995-06-14 Resma Gmbh Verfahren zur Erzeugung elektrisch leitender Bereiche an keramischen Werkstücken
US5849170A (en) * 1995-06-19 1998-12-15 Djokic; Stojan Electroless/electrolytic methods for the preparation of metallized ceramic substrates
US5683758A (en) * 1995-12-18 1997-11-04 Lucent Technologies Inc. Method of forming vias
US6086946A (en) * 1996-08-08 2000-07-11 International Business Machines Corporation Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby
KR20000060651A (ko) * 1999-03-18 2000-10-16 한숙자 세라믹 조리용기 및 그 제조방법
EP1138804A3 (de) * 2000-03-27 2003-06-25 Infineon Technologies AG Bauelement mit zumindest zwei aneinander grenzenden Isolierschichten und Herstellungsverfahren dazu
US6977224B2 (en) 2000-12-28 2005-12-20 Intel Corporation Method of electroless introduction of interconnect structures
US7008872B2 (en) 2002-05-03 2006-03-07 Intel Corporation Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures
US7087104B2 (en) * 2003-06-26 2006-08-08 Intel Corporation Preparation of electroless deposition solutions
JP2005022956A (ja) * 2003-07-02 2005-01-27 Rohm & Haas Electronic Materials Llc セラミックの金属化
JP2005060822A (ja) * 2003-08-08 2005-03-10 Rohm & Haas Electronic Materials Llc 複合基体の電気メッキ
US10034707B2 (en) 2014-12-30 2018-07-31 Biosense Webster (Israel) Ltd. Catheter with irrigated tip electrode with porous substrate and high density surface micro-electrodes

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2004113A (en) * 1933-10-05 1935-06-11 George T Horton Tank
US2453277A (en) * 1942-01-08 1948-11-09 Borden Co Vacuum treatment of milk powder
US2453192A (en) * 1944-09-08 1948-11-09 Bell Telephone Labor Inc Moisture impervious vent
US2533524A (en) * 1945-12-20 1950-12-12 Snider Arthur Melville Waste disposal unit
US3296012A (en) * 1965-04-30 1967-01-03 Corning Glass Works Electroless copper plating on ceramic material
US3671291A (en) * 1969-06-02 1972-06-20 Ppg Industries Inc Electroless process for forming thin metal films
US3672986A (en) * 1969-12-19 1972-06-27 Day Co Nv Metallization of insulating substrates
CA956850A (en) * 1970-03-16 1974-10-29 Frederick W. Schneble (Jr.) Direct bonding of electroless metals to substrates
US3690921A (en) * 1970-12-07 1972-09-12 Ibm Method for strongly adhering a metal film on ceramic substrates
US3993802A (en) * 1971-07-29 1976-11-23 Photocircuits Division Of Kollmorgen Corporation Processes and products for making articles for electroless plating
US3772078A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Process for the formation of real images and products produced thereby
US3930963A (en) * 1971-07-29 1976-01-06 Photocircuits Division Of Kollmorgen Corporation Method for the production of radiant energy imaged printed circuit boards
US3772056A (en) * 1971-07-29 1973-11-13 Kollmorgen Photocircuits Sensitized substrates for chemical metallization
US3994727A (en) * 1971-07-29 1976-11-30 Photocircuits Divison Of Kollmorgen Corporation Formation of metal images using reducible non-noble metal salts and light sensitive reducing agents
US3959547A (en) * 1971-07-29 1976-05-25 Photocircuits Division Of Kollmorgen Corporation Process for the formation of real images and products produced thereby
US3907621A (en) * 1971-07-29 1975-09-23 Photocircuits Corp Method of sensitizing substrates for chemical metallization
US3925578A (en) * 1971-07-29 1975-12-09 Kollmorgen Photocircuits Sensitized substrates for chemical metallization
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3744120A (en) * 1972-04-20 1973-07-10 Gen Electric Direct bonding of metals with a metal-gas eutectic
DE2531163C2 (de) * 1975-07-11 1985-05-15 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Verbesserung der Lötbarkeit elektrischer Leiterplatten
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4428986A (en) * 1982-11-18 1984-01-31 Eaton Corporation Method of preparing a beryllia substrate for subsequent autocatalytic deposition of a metallized film directly thereon

Also Published As

Publication number Publication date
AU2922184A (en) 1984-12-13
GB2141740B (en) 1987-01-21
ES533258A0 (es) 1985-09-01
IN165122B (https=) 1989-08-19
DK282684A (da) 1984-12-10
DE3421988C2 (https=) 1988-09-22
GB8414303D0 (en) 1984-07-11
EP0133201A2 (en) 1985-02-20
AU567169B2 (en) 1987-11-12
GB2141740A (en) 1985-01-03
KR850000377A (ko) 1985-02-27
PH20685A (en) 1987-03-24
CA1226847A (en) 1987-09-15
DE3421988A1 (de) 1984-12-13
EP0133201A3 (en) 1987-03-18
DE3476872D1 (en) 1989-04-06
BR8402804A (pt) 1985-05-21
US4574094A (en) 1986-03-04
DK282684D0 (da) 1984-06-08
KR870001780B1 (ko) 1987-10-10
EP0133201B1 (en) 1989-03-01

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19970203