ES8301254A1 - "un procedimiento para aumentar la resistencia al desprendimiento de un polimero revestido con metal". - Google Patents
"un procedimiento para aumentar la resistencia al desprendimiento de un polimero revestido con metal".Info
- Publication number
- ES8301254A1 ES8301254A1 ES508979A ES508979A ES8301254A1 ES 8301254 A1 ES8301254 A1 ES 8301254A1 ES 508979 A ES508979 A ES 508979A ES 508979 A ES508979 A ES 508979A ES 8301254 A1 ES8301254 A1 ES 8301254A1
- Authority
- ES
- Spain
- Prior art keywords
- metal
- peel strength
- increasing
- polymer
- clad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920000642 polymer Polymers 0.000 title abstract 5
- 239000007789 gas Substances 0.000 abstract 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 abstract 2
- 229910052786 argon Inorganic materials 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000005684 electric field Effects 0.000 abstract 1
- 239000001307 helium Substances 0.000 abstract 1
- 229910052734 helium Inorganic materials 0.000 abstract 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229920002492 poly(sulfone) Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/123—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0333—Organic insulating material consisting of one material containing S
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemically Coating (AREA)
- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
PROCEDIMIENTO PARA ASEGURAR LA ADHERENCIA DE UN MATERIAL POLIMERO REVESTIDO CON METAL. SE SOMETE EL POLIMERO A UN PLASMA GASEOSO EN EL QUE EL GAS QUE ESTA PRESENTE COMPRENDE HELIO, A UNA TEMPERATURA COMPRENDIDA ENTRE LA TEMPERATURA DE AMBIENTE Y LA TEMPERATURA DE TRANSICION VITREA DE DICHO POLIMERO, A UNA PRESION COMPRENDIDA ENTRE 5 ATMOSFERAS Y 10<006> TORR Y CON UNA DENSIDAD DE ENERGIA ELECTRICA COMPRENDIDA ENTRE 3,8 10<006> Y 1,2 10<006> VATIOS/CM , DEPOSITANDO DESPUES UN METAL SOBRE EL POLIMERO TRATADO RESULTANTE Y RECOGIENDO EL POLIMERO REVESTIDO CON METAL. >LOS POLIMEROS RECUBIERTOS CON METAL TIENEN APLICACION EN EL CAMPO D LA ELECTRONICA.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/228,019 US4337279A (en) | 1981-01-23 | 1981-01-23 | Method for increasing the peel strength of metal-clad polymers |
Publications (2)
Publication Number | Publication Date |
---|---|
ES508979A0 ES508979A0 (es) | 1982-11-16 |
ES8301254A1 true ES8301254A1 (es) | 1982-11-16 |
Family
ID=22855418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES508979A Expired ES8301254A1 (es) | 1981-01-23 | 1982-01-22 | "un procedimiento para aumentar la resistencia al desprendimiento de un polimero revestido con metal". |
Country Status (6)
Country | Link |
---|---|
US (1) | US4337279A (es) |
EP (1) | EP0057374B1 (es) |
JP (1) | JPS57164132A (es) |
CA (1) | CA1178240A (es) |
DE (1) | DE3272651D1 (es) |
ES (1) | ES8301254A1 (es) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4422907A (en) * | 1981-12-30 | 1983-12-27 | Allied Corporation | Pretreatment of plastic materials for metal plating |
NL8300422A (nl) * | 1983-02-04 | 1984-09-03 | Philips Nv | Methode voor de vervaardiging van een optisch uitleesbare informatieschijf. |
US4575475A (en) * | 1983-07-12 | 1986-03-11 | Tdk Corporation | Magnetic recording medium |
NL8304443A (nl) * | 1983-12-27 | 1985-07-16 | Philips Nv | Methode voor het aanbrengen van een metaalspiegel. |
GB2155024A (en) * | 1984-03-03 | 1985-09-18 | Standard Telephones Cables Ltd | Surface treatment of plastics materials |
DE3577989D1 (de) * | 1984-03-15 | 1990-07-05 | Denki Kagaku Kogyo Kk | Harzzusammensetzung und daraus hergestellter metallisierter gegenstand. |
JPH0610856B2 (ja) * | 1984-08-04 | 1994-02-09 | ティーディーケイ株式会社 | 磁気記録媒体 |
US4615907A (en) * | 1984-11-23 | 1986-10-07 | Phillips Petroleum Company | Plating poly(arylene sulfide) surfaces |
US4908094A (en) * | 1986-04-14 | 1990-03-13 | International Business Machines Corporation | Method for laminating organic materials via surface modification |
US4897305A (en) * | 1987-03-12 | 1990-01-30 | Hercules Incorporated | Plasma treatment with organic vapors to promote a meal adhesion of polypropylene film |
US4857978A (en) * | 1987-08-11 | 1989-08-15 | North American Philips Corporation | Solid state light modulator incorporating metallized gel and method of metallization |
US5280727A (en) * | 1987-09-11 | 1994-01-25 | Endress+Hauser Flowtec Ag | Electromagnetic flow measuring tube and method of making same |
JPH01138242A (ja) * | 1987-11-24 | 1989-05-31 | Toray Ind Inc | 高分子樹脂フィルムの表面改質方法 |
KR900014625A (ko) * | 1989-03-20 | 1990-10-24 | 미다 가쓰시게 | 금속/유기 고분자 합성수지 복합체 및 이의 제조방법 |
US5019210A (en) * | 1989-04-03 | 1991-05-28 | International Business Machines Corporation | Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment |
JPH07100042B2 (ja) * | 1989-04-07 | 1995-11-01 | ワイケイケイ株式会社 | スライドファスナー用エレメント列の表面処理方法 |
FR2648827B1 (fr) * | 1989-06-21 | 1993-12-03 | Electricite De France | Procede de metallisation de pellicules de polymeres avec pretraitement par decharge in situ et son application notamment pour la fabrication de films metallises a usage electrique |
US5340451A (en) * | 1990-10-04 | 1994-08-23 | International Business Machines Corporation | Process for producing a metal organic polymer combination |
US5425832A (en) * | 1990-10-05 | 1995-06-20 | Bridgestone Corporation | Surface treatment of fluoropolymer members and preparation of composite products therefrom |
DE69110823T2 (de) * | 1990-10-05 | 1995-12-21 | Bridgestone Corp | Oberflächenbehandlung von fluorchemischen Elementen und Herstellung von Verbundmaterialien daraus. |
CH682821A5 (de) * | 1991-10-01 | 1993-11-30 | Alusuisse Lonza Services Ag | Vorbehandelte Substratfläche einer Permeationssperre. |
WO1993019218A1 (de) * | 1992-03-26 | 1993-09-30 | Bayer Aktiengesellschaft | Verfahren zur vorbehandlung der oberflächen von kunststoffteilen |
US5324414A (en) * | 1992-06-01 | 1994-06-28 | Eastman Kodak Company | Ion selective electrode |
US5328557A (en) * | 1993-01-07 | 1994-07-12 | Micron Semiconductor, Inc. | Plasma treatment of O-rings |
DE59405514D1 (de) * | 1993-09-30 | 1998-04-30 | Siemens Ag | Verfahren zur Herstellung von dreidimensionalen Kunststoffteilen mit integrierten Leiterzügen |
US6171714B1 (en) * | 1996-04-18 | 2001-01-09 | Gould Electronics Inc. | Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
US6042929A (en) * | 1998-03-26 | 2000-03-28 | Alchemia, Inc. | Multilayer metalized composite on polymer film product and process |
US6146480A (en) * | 1999-03-12 | 2000-11-14 | Ga-Tek Inc. | Flexible laminate for flexible circuit |
US7014887B1 (en) * | 1999-09-02 | 2006-03-21 | Applied Materials, Inc. | Sequential sputter and reactive precleans of vias and contacts |
US6296949B1 (en) | 1999-09-16 | 2001-10-02 | Ga-Tek Inc. | Copper coated polyimide with metallic protective layer |
KR100445489B1 (ko) * | 1999-11-15 | 2004-08-21 | 마츠시타 덴끼 산교 가부시키가이샤 | 바이오 센서, 박막 전극 형성 방법, 정량 장치, 및 정량방법 |
EP1364984A4 (en) * | 2000-12-05 | 2004-09-08 | Shipley Co Llc | RESIN COMPOSITE MATERIAL AND MOLDING METHOD THEREOF |
JP2002192648A (ja) * | 2000-12-27 | 2002-07-10 | Learonal Japan Inc | 接合強度が向上された複合材料およびその形成方法 |
US6916527B2 (en) * | 2001-01-18 | 2005-07-12 | Matsushita Electric Works, Ltd. | Resin moldings |
EP1411002B1 (en) * | 2002-03-14 | 2008-12-10 | Daviplast - Servicos de Consultoria, Sociedade Unipessoal LDA. | Method for metallization of a plastic tank and method for metallization of a plastic pallet |
KR100449156B1 (ko) * | 2002-05-09 | 2004-09-18 | 엘지전선 주식회사 | 솔더 범프용 동박의 제조방법 |
WO2004064147A2 (en) * | 2003-01-07 | 2004-07-29 | Applied Materials, Inc. | Integration of ald/cvd barriers with porous low k materials |
US20060141244A1 (en) * | 2004-12-29 | 2006-06-29 | Toray Industries, Inc. | Multilayer film and process for producing the same |
US9452564B2 (en) | 2011-02-07 | 2016-09-27 | The Regents Of The University Of California | Multi-scale wrinkles for functional alignment of stem cells and cardiac derivatives |
US9145073B2 (en) | 2011-03-15 | 2015-09-29 | Lear Corporation | Collapsible bolster cushion |
US9625819B2 (en) | 2011-05-27 | 2017-04-18 | The Regents Of The University Of California | Photolithography on shrink film |
US20130309450A1 (en) * | 2012-05-11 | 2013-11-21 | Michelle Khine | Superhydrophobic surfaces |
CN106350843B (zh) * | 2016-10-11 | 2018-07-10 | 上海瑞尔实业有限公司 | 一种用于塑料电镀的前处理方法 |
DE102018118225A1 (de) | 2018-07-27 | 2020-01-30 | Schott Ag | Optisch-elektrische Leiteranordnung mit Lichtwellenleiter und elektrischer Leitschicht |
TWI823035B (zh) * | 2020-06-27 | 2023-11-21 | 日商普羅瑪帝克股份有限公司 | 層壓體的製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3560241A (en) * | 1968-03-06 | 1971-02-02 | Ibm | Method of metallizing a polysulfone body |
US3686018A (en) * | 1970-11-02 | 1972-08-22 | Dow Chemical Co | Method of metallizing an organic substrate |
US3801368A (en) * | 1970-11-25 | 1974-04-02 | Toray Industries | Process of electroless plating and article made thereby |
JPS5650340B2 (es) * | 1973-07-25 | 1981-11-28 | ||
US3914521A (en) * | 1974-04-01 | 1975-10-21 | Union Carbide Corp | Heat-treated, corona-treated polymer bodies and a process for producing them |
JPS50154375A (es) * | 1974-06-04 | 1975-12-12 | ||
JPS5134270A (en) * | 1974-09-18 | 1976-03-23 | Kogyo Gijutsuin | Jushi no hyomenshorihoho |
JPS5149704A (en) * | 1974-10-28 | 1976-04-30 | Fuji Photo Film Co Ltd | Jikikirokubaitaino seiho |
US4199623A (en) * | 1974-11-01 | 1980-04-22 | Kollmorgen Technologies Corporation | Process for sensitizing articles for metallization and resulting articles |
CH610596A5 (es) * | 1977-02-16 | 1979-04-30 | Ebauches Sa | |
JPS54141340A (en) * | 1978-04-27 | 1979-11-02 | Nippon Koushiyuuha Kk | Pretretment of plastic in plastic plating |
US4247600A (en) * | 1978-07-28 | 1981-01-27 | Minolta Camera Kabushiki Kaisha | Metallized plastic camera housing and method |
EP0017360B1 (en) * | 1979-03-19 | 1984-12-19 | Xerox Corporation | Method and apparatus for pretreating a substrate, method and apparatus for pretreating a substrate and depositing a thin metallic film thereon |
-
1981
- 1981-01-23 US US06/228,019 patent/US4337279A/en not_active Expired - Fee Related
-
1982
- 1982-01-13 CA CA000394021A patent/CA1178240A/en not_active Expired
- 1982-01-20 EP EP19820100366 patent/EP0057374B1/en not_active Expired
- 1982-01-20 DE DE8282100366T patent/DE3272651D1/de not_active Expired
- 1982-01-22 ES ES508979A patent/ES8301254A1/es not_active Expired
- 1982-01-23 JP JP941982A patent/JPS57164132A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57164132A (en) | 1982-10-08 |
JPS6134513B2 (es) | 1986-08-08 |
EP0057374A3 (en) | 1982-09-01 |
ES508979A0 (es) | 1982-11-16 |
CA1178240A (en) | 1984-11-20 |
EP0057374B1 (en) | 1986-08-20 |
US4337279A (en) | 1982-06-29 |
DE3272651D1 (en) | 1986-09-25 |
EP0057374A2 (en) | 1982-08-11 |
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