ES508979A0 - "un procedimiento para aumentar la resistencia al desprendimiento de un polimero revestido con metal". - Google Patents

"un procedimiento para aumentar la resistencia al desprendimiento de un polimero revestido con metal".

Info

Publication number
ES508979A0
ES508979A0 ES508979A ES508979A ES508979A0 ES 508979 A0 ES508979 A0 ES 508979A0 ES 508979 A ES508979 A ES 508979A ES 508979 A ES508979 A ES 508979A ES 508979 A0 ES508979 A0 ES 508979A0
Authority
ES
Spain
Prior art keywords
procedure
metal
increase
stress resistance
coated polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES508979A
Other languages
English (en)
Other versions
ES8301254A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell UOP LLC
Original Assignee
UOP LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UOP LLC filed Critical UOP LLC
Publication of ES8301254A1 publication Critical patent/ES8301254A1/es
Publication of ES508979A0 publication Critical patent/ES508979A0/es
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
    • C23C18/2066—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Chemically Coating (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
ES508979A 1981-01-23 1982-01-22 "un procedimiento para aumentar la resistencia al desprendimiento de un polimero revestido con metal". Granted ES508979A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/228,019 US4337279A (en) 1981-01-23 1981-01-23 Method for increasing the peel strength of metal-clad polymers

Publications (2)

Publication Number Publication Date
ES8301254A1 ES8301254A1 (es) 1982-11-16
ES508979A0 true ES508979A0 (es) 1982-11-16

Family

ID=22855418

Family Applications (1)

Application Number Title Priority Date Filing Date
ES508979A Granted ES508979A0 (es) 1981-01-23 1982-01-22 "un procedimiento para aumentar la resistencia al desprendimiento de un polimero revestido con metal".

Country Status (6)

Country Link
US (1) US4337279A (es)
EP (1) EP0057374B1 (es)
JP (1) JPS57164132A (es)
CA (1) CA1178240A (es)
DE (1) DE3272651D1 (es)
ES (1) ES508979A0 (es)

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US4422907A (en) * 1981-12-30 1983-12-27 Allied Corporation Pretreatment of plastic materials for metal plating
NL8300422A (nl) * 1983-02-04 1984-09-03 Philips Nv Methode voor de vervaardiging van een optisch uitleesbare informatieschijf.
US4575475A (en) * 1983-07-12 1986-03-11 Tdk Corporation Magnetic recording medium
NL8304443A (nl) * 1983-12-27 1985-07-16 Philips Nv Methode voor het aanbrengen van een metaalspiegel.
GB2155024A (en) * 1984-03-03 1985-09-18 Standard Telephones Cables Ltd Surface treatment of plastics materials
EP0155604B1 (en) * 1984-03-15 1990-05-30 Denki Kagaku Kogyo Kabushiki Kaisha Resin composition and plated article thereof
JPH0610856B2 (ja) * 1984-08-04 1994-02-09 ティーディーケイ株式会社 磁気記録媒体
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
US4908094A (en) * 1986-04-14 1990-03-13 International Business Machines Corporation Method for laminating organic materials via surface modification
US4897305A (en) * 1987-03-12 1990-01-30 Hercules Incorporated Plasma treatment with organic vapors to promote a meal adhesion of polypropylene film
US4857978A (en) * 1987-08-11 1989-08-15 North American Philips Corporation Solid state light modulator incorporating metallized gel and method of metallization
US5280727A (en) * 1987-09-11 1994-01-25 Endress+Hauser Flowtec Ag Electromagnetic flow measuring tube and method of making same
JPH01138242A (ja) * 1987-11-24 1989-05-31 Toray Ind Inc 高分子樹脂フィルムの表面改質方法
KR900014625A (ko) * 1989-03-20 1990-10-24 미다 가쓰시게 금속/유기 고분자 합성수지 복합체 및 이의 제조방법
US5019210A (en) * 1989-04-03 1991-05-28 International Business Machines Corporation Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment
JPH07100042B2 (ja) * 1989-04-07 1995-11-01 ワイケイケイ株式会社 スライドファスナー用エレメント列の表面処理方法
FR2648827B1 (fr) * 1989-06-21 1993-12-03 Electricite De France Procede de metallisation de pellicules de polymeres avec pretraitement par decharge in situ et son application notamment pour la fabrication de films metallises a usage electrique
US5340451A (en) * 1990-10-04 1994-08-23 International Business Machines Corporation Process for producing a metal organic polymer combination
US5425832A (en) * 1990-10-05 1995-06-20 Bridgestone Corporation Surface treatment of fluoropolymer members and preparation of composite products therefrom
EP0479592B1 (en) * 1990-10-05 1995-06-28 Bridgestone Corporation Surface treatment of fluorochemical members and preparation of composite products therefrom
CH682821A5 (de) * 1991-10-01 1993-11-30 Alusuisse Lonza Services Ag Vorbehandelte Substratfläche einer Permeationssperre.
JP3404742B2 (ja) * 1992-03-26 2003-05-12 バイエル・アクチエンゲゼルシヤフト プラスチック品の表面の予備処理法
US5324414A (en) * 1992-06-01 1994-06-28 Eastman Kodak Company Ion selective electrode
US5328557A (en) * 1993-01-07 1994-07-12 Micron Semiconductor, Inc. Plasma treatment of O-rings
EP0647089B1 (de) * 1993-09-30 1998-03-25 Siemens Aktiengesellschaft Verfahren zur Herstellung von dreidimensionalen Kunststoffteilen mit integrierten Leiterzügen
US6171714B1 (en) 1996-04-18 2001-01-09 Gould Electronics Inc. Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
US6042929A (en) * 1998-03-26 2000-03-28 Alchemia, Inc. Multilayer metalized composite on polymer film product and process
US6146480A (en) 1999-03-12 2000-11-14 Ga-Tek Inc. Flexible laminate for flexible circuit
US7014887B1 (en) * 1999-09-02 2006-03-21 Applied Materials, Inc. Sequential sputter and reactive precleans of vias and contacts
US6296949B1 (en) 1999-09-16 2001-10-02 Ga-Tek Inc. Copper coated polyimide with metallic protective layer
WO2001036953A1 (en) 1999-11-15 2001-05-25 Matsushita Electric Industrial Co., Ltd. Biosensor, method of forming thin-film electrode, and method and apparatus for quantitative determination
US20040170846A1 (en) * 2000-12-05 2004-09-02 Masaru Seita Resin composite material and method of forming the same
JP2002192648A (ja) * 2000-12-27 2002-07-10 Learonal Japan Inc 接合強度が向上された複合材料およびその形成方法
US6916527B2 (en) * 2001-01-18 2005-07-12 Matsushita Electric Works, Ltd. Resin moldings
EP1354815B1 (en) * 2002-03-14 2004-09-01 FUSTIPLAST S.p.A. Electrostatic charge-free container
KR100449156B1 (ko) * 2002-05-09 2004-09-18 엘지전선 주식회사 솔더 범프용 동박의 제조방법
US7244683B2 (en) * 2003-01-07 2007-07-17 Applied Materials, Inc. Integration of ALD/CVD barriers with porous low k materials
US20060141244A1 (en) * 2004-12-29 2006-06-29 Toray Industries, Inc. Multilayer film and process for producing the same
US9452564B2 (en) 2011-02-07 2016-09-27 The Regents Of The University Of California Multi-scale wrinkles for functional alignment of stem cells and cardiac derivatives
US9145073B2 (en) 2011-03-15 2015-09-29 Lear Corporation Collapsible bolster cushion
US9625819B2 (en) 2011-05-27 2017-04-18 The Regents Of The University Of California Photolithography on shrink film
US20130309450A1 (en) * 2012-05-11 2013-11-21 Michelle Khine Superhydrophobic surfaces
CN106350843B (zh) * 2016-10-11 2018-07-10 上海瑞尔实业有限公司 一种用于塑料电镀的前处理方法
DE102018118225A1 (de) * 2018-07-27 2020-01-30 Schott Ag Optisch-elektrische Leiteranordnung mit Lichtwellenleiter und elektrischer Leitschicht
TWI823035B (zh) * 2020-06-27 2023-11-21 日商普羅瑪帝克股份有限公司 層壓體的製造方法

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US3560241A (en) * 1968-03-06 1971-02-02 Ibm Method of metallizing a polysulfone body
US3686018A (en) * 1970-11-02 1972-08-22 Dow Chemical Co Method of metallizing an organic substrate
US3801368A (en) * 1970-11-25 1974-04-02 Toray Industries Process of electroless plating and article made thereby
JPS5650340B2 (es) * 1973-07-25 1981-11-28
US3914521A (en) * 1974-04-01 1975-10-21 Union Carbide Corp Heat-treated, corona-treated polymer bodies and a process for producing them
JPS50154375A (es) * 1974-06-04 1975-12-12
JPS5134270A (en) * 1974-09-18 1976-03-23 Kogyo Gijutsuin Jushi no hyomenshorihoho
JPS5149704A (en) * 1974-10-28 1976-04-30 Fuji Photo Film Co Ltd Jikikirokubaitaino seiho
US4199623A (en) * 1974-11-01 1980-04-22 Kollmorgen Technologies Corporation Process for sensitizing articles for metallization and resulting articles
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JPS54141340A (en) * 1978-04-27 1979-11-02 Nippon Koushiyuuha Kk Pretretment of plastic in plastic plating
US4247600A (en) * 1978-07-28 1981-01-27 Minolta Camera Kabushiki Kaisha Metallized plastic camera housing and method
EP0017360B1 (en) * 1979-03-19 1984-12-19 Xerox Corporation Method and apparatus for pretreating a substrate, method and apparatus for pretreating a substrate and depositing a thin metallic film thereon

Also Published As

Publication number Publication date
ES8301254A1 (es) 1982-11-16
JPS6134513B2 (es) 1986-08-08
EP0057374A3 (en) 1982-09-01
EP0057374A2 (en) 1982-08-11
DE3272651D1 (en) 1986-09-25
CA1178240A (en) 1984-11-20
EP0057374B1 (en) 1986-08-20
US4337279A (en) 1982-06-29
JPS57164132A (en) 1982-10-08

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