ES554048A0 - Procedimiento para la produccion de estructuras metalicas sobre superficies no conductoras, inorganicas - Google Patents
Procedimiento para la produccion de estructuras metalicas sobre superficies no conductoras, inorganicasInfo
- Publication number
- ES554048A0 ES554048A0 ES554048A ES554048A ES554048A0 ES 554048 A0 ES554048 A0 ES 554048A0 ES 554048 A ES554048 A ES 554048A ES 554048 A ES554048 A ES 554048A ES 554048 A0 ES554048 A0 ES 554048A0
- Authority
- ES
- Spain
- Prior art keywords
- conductive
- procedure
- production
- metallic structures
- inorganic surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Chemical Vapour Deposition (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Chemical Treatment Of Metals (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19853514094 DE3514094A1 (de) | 1985-04-16 | 1985-04-16 | Herstellung metallischer strukturen auf anorganischen nichtleitern |
Publications (2)
Publication Number | Publication Date |
---|---|
ES8707774A1 ES8707774A1 (es) | 1987-09-01 |
ES554048A0 true ES554048A0 (es) | 1987-09-01 |
Family
ID=6268528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES554048A Expired ES8707774A1 (es) | 1985-04-16 | 1986-04-16 | Procedimiento para la produccion de estructuras metalicas sobre superficies no conductoras, inorganicas |
Country Status (8)
Country | Link |
---|---|
US (1) | US4980197A (es) |
EP (1) | EP0199114B1 (es) |
JP (1) | JPS61291963A (es) |
CN (1) | CN1015005B (es) |
AT (1) | AT392086B (es) |
CA (1) | CA1290720C (es) |
DE (2) | DE3514094A1 (es) |
ES (1) | ES8707774A1 (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2695410B1 (fr) * | 1992-09-04 | 1994-11-18 | France Telecom | Procédé de prétraitement d'un substrat pour le dépôt sélectif de tungstène. |
GB9317170D0 (en) * | 1993-08-18 | 1993-10-06 | Applied Vision Ltd | Improvements in physical vapour deposition apparatus |
WO1995027570A1 (en) * | 1994-04-08 | 1995-10-19 | Ray Mark A | Selective plasma deposition |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USB509825I5 (es) * | 1965-11-26 | |||
US3677799A (en) * | 1970-11-10 | 1972-07-18 | Celanese Corp | Vapor phase boron deposition by pulse discharge |
DE2139297A1 (de) * | 1971-08-05 | 1973-02-15 | Siemens Ag | Verfahren zur herstellung gitterfoermiger, elektrisch leitfaehiger belegungen |
US3776762A (en) * | 1971-10-18 | 1973-12-04 | Kote Corp Du | Dry lubrication |
GB1423952A (en) * | 1973-06-26 | 1976-02-04 | Oike & Co | Process for preparing a metallized resin film for condenser element |
US3978249A (en) * | 1974-04-29 | 1976-08-31 | Asg Industries, Inc. | Method for producing intricate metal designs on glass |
US4322457A (en) * | 1978-01-25 | 1982-03-30 | Western Electric Co., Inc. | Method of selectively depositing a metal on a surface |
DE2851101C2 (de) * | 1978-11-25 | 1980-09-18 | Ulrich 7110 Oehringen Wagner | Verfahren zum Gravieren von Werkstückflachen durch Ätzen |
JPS55157233A (en) * | 1979-05-28 | 1980-12-06 | Hitachi Ltd | Method and apparatus for monitoring etching |
EP0049400B1 (en) * | 1980-09-22 | 1984-07-11 | Kabushiki Kaisha Toshiba | Method of smoothing an insulating layer formed on a semiconductor body |
JPS5767938A (en) * | 1980-10-16 | 1982-04-24 | Canon Inc | Production of photoconductive member |
CH649099A5 (en) * | 1981-05-04 | 1985-04-30 | Euro Varnish B V | Process for obtaining metallised or highly reflective surfaces employing an aqueous varnish |
JPS57186321A (en) * | 1981-05-12 | 1982-11-16 | Fuji Electric Corp Res & Dev Ltd | Producing method for amorphous silicon film |
US4401687A (en) * | 1981-11-12 | 1983-08-30 | Advanced Semiconductor Materials America | Plasma deposition of silicon |
DE3204425A1 (de) * | 1982-02-09 | 1983-08-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung freitragender metallgitterstrukturen |
DE3204846A1 (de) * | 1982-02-11 | 1983-08-18 | Schott Glaswerke, 6500 Mainz | Plasmaverfahren zur innenbeschichtung von glasrohren |
DE3205345A1 (de) * | 1982-02-15 | 1983-09-01 | Philips Patentverwaltung Gmbh, 2000 Hamburg | "verfahren zur herstellung von fluordotierten lichtleitfasern" |
US4422897A (en) * | 1982-05-25 | 1983-12-27 | Massachusetts Institute Of Technology | Process for selectively etching silicon |
JPH0635323B2 (ja) * | 1982-06-25 | 1994-05-11 | 株式会社日立製作所 | 表面処理方法 |
US4450042A (en) * | 1982-07-06 | 1984-05-22 | Texas Instruments Incorporated | Plasma etch chemistry for anisotropic etching of silicon |
US4517223A (en) * | 1982-09-24 | 1985-05-14 | Sovonics Solar Systems | Method of making amorphous semiconductor alloys and devices using microwave energy |
JPS5978987A (ja) * | 1982-10-29 | 1984-05-08 | マルイ工業株式会社 | 金属被膜上へのパタ−ン形成方法 |
DE3334419A1 (de) * | 1983-09-23 | 1985-04-04 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zur verstaerkung von metallisierten flaechen auf halbleiterleistungsbauelementen oder keramiksubstraten |
JPS6077429A (ja) * | 1983-10-04 | 1985-05-02 | Asahi Glass Co Ltd | ドライエツチング方法 |
US4613400A (en) * | 1985-05-20 | 1986-09-23 | Applied Materials, Inc. | In-situ photoresist capping process for plasma etching |
-
1985
- 1985-04-16 DE DE19853514094 patent/DE3514094A1/de active Granted
-
1986
- 1986-03-22 EP EP86103975A patent/EP0199114B1/de not_active Expired - Lifetime
- 1986-03-22 DE DE8686103975T patent/DE3685050D1/de not_active Expired - Lifetime
- 1986-04-15 JP JP61085228A patent/JPS61291963A/ja active Granted
- 1986-04-15 CA CA000506656A patent/CA1290720C/en not_active Expired - Lifetime
- 1986-04-15 AT AT0098486A patent/AT392086B/de not_active IP Right Cessation
- 1986-04-16 CN CN86102468A patent/CN1015005B/zh not_active Expired
- 1986-04-16 US US06/853,338 patent/US4980197A/en not_active Expired - Fee Related
- 1986-04-16 ES ES554048A patent/ES8707774A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0199114A2 (de) | 1986-10-29 |
DE3514094A1 (de) | 1986-10-23 |
CN1015005B (zh) | 1991-12-04 |
US4980197A (en) | 1990-12-25 |
EP0199114A3 (en) | 1988-10-19 |
JPS61291963A (ja) | 1986-12-22 |
DE3685050D1 (de) | 1992-06-04 |
ES8707774A1 (es) | 1987-09-01 |
AT392086B (de) | 1991-01-25 |
DE3514094C2 (es) | 1991-10-17 |
EP0199114B1 (de) | 1992-04-29 |
CA1290720C (en) | 1991-10-15 |
JPH041067B2 (es) | 1992-01-09 |
CN86102468A (zh) | 1986-10-15 |
ATA98486A (de) | 1990-07-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FD1A | Patent lapsed |
Effective date: 20000601 |