ES462067A1 - Una capsula evacuadora de calor con componente electronico. - Google Patents
Una capsula evacuadora de calor con componente electronico.Info
- Publication number
- ES462067A1 ES462067A1 ES462067A ES462067A ES462067A1 ES 462067 A1 ES462067 A1 ES 462067A1 ES 462067 A ES462067 A ES 462067A ES 462067 A ES462067 A ES 462067A ES 462067 A1 ES462067 A1 ES 462067A1
- Authority
- ES
- Spain
- Prior art keywords
- cápsula
- translation
- machine
- electronic component
- legally binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04026—Bonding areas specifically adapted for layer connectors
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
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- H—ELECTRICITY
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Una cápsula evacuadora de calor con componente electrónico, en la que el calor del componente es transmitido a través de, al menos, un cojín metálico, a un elemento enfriador, caracterizado porque el cojín metálico está metálicamente unido por un lado, ya con el componente, ya con el elemento enfriador, mientras que su otro lado se apoya suelto sobre el elemento enfriador o, respectivamente, sobre el componente.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/720,471 US4034469A (en) | 1976-09-03 | 1976-09-03 | Method of making conduction-cooled circuit package |
US05/720,470 US4034468A (en) | 1976-09-03 | 1976-09-03 | Method for making conduction-cooled circuit package |
Publications (1)
Publication Number | Publication Date |
---|---|
ES462067A1 true ES462067A1 (es) | 1978-06-01 |
Family
ID=27110261
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES462067A Expired ES462067A1 (es) | 1976-09-03 | 1977-09-02 | Una capsula evacuadora de calor con componente electronico. |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH614810A5 (es) |
DE (1) | DE2729074C2 (es) |
ES (1) | ES462067A1 (es) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB8324839D0 (en) * | 1983-09-16 | 1983-10-19 | Lucas Ind Plc | Mounting carrier for microelectronic silicon chip |
KR920008251B1 (ko) * | 1988-09-26 | 1992-09-25 | 가부시기가이샤 히다찌세이사꾸쇼 | 전자디바이스의 냉각장치 |
US5396403A (en) * | 1993-07-06 | 1995-03-07 | Hewlett-Packard Company | Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate |
US6108208A (en) * | 1997-12-08 | 2000-08-22 | Unisys Corporation | Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1042762B (de) * | 1955-02-26 | 1958-11-06 | Siemens Ag | Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht |
US3429040A (en) * | 1965-06-18 | 1969-02-25 | Ibm | Method of joining a component to a substrate |
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1977
- 1977-06-28 DE DE2729074A patent/DE2729074C2/de not_active Expired
- 1977-07-05 CH CH823877A patent/CH614810A5/xx not_active IP Right Cessation
- 1977-09-02 ES ES462067A patent/ES462067A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE2729074A1 (de) | 1978-03-09 |
CH614810A5 (en) | 1979-12-14 |
DE2729074C2 (de) | 1982-08-26 |
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