ES450784A1 - Perfeccionamientos introducidos en un componente electroni- co. - Google Patents

Perfeccionamientos introducidos en un componente electroni- co.

Info

Publication number
ES450784A1
ES450784A1 ES450784A ES450784A ES450784A1 ES 450784 A1 ES450784 A1 ES 450784A1 ES 450784 A ES450784 A ES 450784A ES 450784 A ES450784 A ES 450784A ES 450784 A1 ES450784 A1 ES 450784A1
Authority
ES
Spain
Prior art keywords
substrates
electronic component
heat
heat cooled
cooled substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES450784A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES450784A1 publication Critical patent/ES450784A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
ES450784A 1975-08-20 1976-08-18 Perfeccionamientos introducidos en un componente electroni- co. Expired ES450784A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2536957A DE2536957C2 (de) 1975-08-20 1975-08-20 Elektronisches Bauelement

Publications (1)

Publication Number Publication Date
ES450784A1 true ES450784A1 (es) 1977-08-16

Family

ID=5954339

Family Applications (1)

Application Number Title Priority Date Filing Date
ES450784A Expired ES450784A1 (es) 1975-08-20 1976-08-18 Perfeccionamientos introducidos en un componente electroni- co.

Country Status (7)

Country Link
US (1) US4120020A (es)
JP (1) JPS5225257A (es)
DE (1) DE2536957C2 (es)
ES (1) ES450784A1 (es)
FR (1) FR2321818A1 (es)
GB (1) GB1508096A (es)
IT (1) IT1071406B (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6039970U (ja) * 1983-08-26 1985-03-20 株式会社学習研究社 風力計
US4612512A (en) * 1984-06-15 1986-09-16 Trw Inc. Amplifier circuit packaging construction
JPS6427790U (es) * 1987-08-10 1989-02-17
DE3833146A1 (de) * 1988-09-29 1989-03-02 Siemens Ag Verfahren zur herstellung eines steuergeraetes
DE3837974A1 (de) * 1988-11-09 1990-05-10 Telefunken Electronic Gmbh Elektronisches steuergeraet
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5210683A (en) * 1991-08-22 1993-05-11 Lsi Logic Corporation Recessed chip capacitor wells with cleaning channels on integrated circuit packages
US5249098A (en) * 1991-08-22 1993-09-28 Lsi Logic Corporation Semiconductor device package with solder bump electrical connections on an external surface of the package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
DE102022214325A1 (de) * 2022-12-22 2024-06-27 Magna powertrain gmbh & co kg Stromrichter mit einer Kühlanordnung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3147402A (en) * 1960-11-10 1964-09-01 Honeywell Regulator Co Printed circuit module with hinged circuit panel
US3290756A (en) * 1962-08-15 1966-12-13 Hughes Aircraft Co Method of assembling and interconnecting electrical components
US3348101A (en) * 1964-05-27 1967-10-17 Itt Cordwood module with heat sink fence
US3395318A (en) * 1967-02-13 1968-07-30 Gen Precision Inc Circuit board card arrangement for the interconnection of electronic components
DE1930657A1 (de) * 1969-06-18 1971-01-07 Siemens Ag Leiterplatte
DE1937644A1 (de) * 1969-07-24 1971-01-28 Reisner Manfred Scheibenwaschanlage fuer Gebaeudefenster
US3648113A (en) * 1970-10-22 1972-03-07 Singer Co Electronic assembly having cooling means for stacked modules
US3710193A (en) * 1971-03-04 1973-01-09 Lambda Electronics Corp Hybrid regulated power supply having individual heat sinks for heat generative and heat sensitive components
NL165906C (nl) * 1971-04-09 1981-05-15 Philips Nv Werkwijze voor het monteren van een aantal elektrische onderdelen op een montagepaneel, alsmede elektrisch on- derdeel geschikt voor het uitvoeren van de werkwijze.
GB1365877A (en) * 1971-10-19 1974-09-04 Sperry Rand Ltd Electronic circuit assemblies
US3735206A (en) * 1971-10-28 1973-05-22 Nasa Circuit board package with wedge shaped covers
US3766440A (en) * 1972-08-11 1973-10-16 Gen Motors Corp Ceramic integrated circuit convector assembly
DE2334570B1 (de) * 1973-07-07 1975-03-06 Philips Patentverwaltung Abstimmbare Hochfrequenz-Eingangsschaltungsanordnung fuer einen Fernsehempfaenger

Also Published As

Publication number Publication date
FR2321818A1 (fr) 1977-03-18
FR2321818B1 (es) 1979-06-29
GB1508096A (en) 1978-04-19
US4120020A (en) 1978-10-10
JPS5619760B2 (es) 1981-05-09
DE2536957C2 (de) 1983-05-11
JPS5225257A (en) 1977-02-25
IT1071406B (it) 1985-04-10
DE2536957A1 (de) 1977-02-24

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Legal Events

Date Code Title Description
FD1A Patent lapsed

Effective date: 19980302