GB1409717A - Method of mounting electric wiring arrangements - Google Patents
Method of mounting electric wiring arrangementsInfo
- Publication number
- GB1409717A GB1409717A GB5427071A GB5427071A GB1409717A GB 1409717 A GB1409717 A GB 1409717A GB 5427071 A GB5427071 A GB 5427071A GB 5427071 A GB5427071 A GB 5427071A GB 1409717 A GB1409717 A GB 1409717A
- Authority
- GB
- United Kingdom
- Prior art keywords
- support
- layer
- nov
- electric wiring
- mounting electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Combinations Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Details Of Indoor Wiring (AREA)
Abstract
1409717 Mountings for printed circuits LUCAS INDUSTRIES Ltd 15 Nov 1972 [23 Nov 1971] 54270/71 Heading H1R A ceramic substrate 11, bearing a thick film fired metallic ink circuit, is mounted on a thermally conductive support 12 via an interposed layer 18 of viscoelastic material such as nitrile rubber, which is adhesively secured to the substrate and the support, preferably with an epoxy adhesive. As shown, the support comprises two dished aluminium plates 13, 14 secured together by a layer 15 of viscoelastic adhesive. The support is riveted at one end to an associated structure 17. The layer 18 protects the circuit from shock and the effects of differential thermal expansion.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5427071A GB1409717A (en) | 1971-11-23 | 1971-11-23 | Method of mounting electric wiring arrangements |
IT3198272A IT971125B (en) | 1971-11-23 | 1972-11-22 | METHOD FOR ASSEMBLING ELECTRICAL CONNECTIONS |
JP47116732A JPS4860290A (en) | 1971-11-23 | 1972-11-22 | |
DE19722257232 DE2257232A1 (en) | 1971-11-23 | 1972-11-22 | ELECTRICAL COMPONENT AND METHOD FOR INSTALLING AN ELECTRICAL WIRING ARRANGEMENT |
FR7242326A FR2161121B1 (en) | 1971-11-23 | 1972-11-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB5427071A GB1409717A (en) | 1971-11-23 | 1971-11-23 | Method of mounting electric wiring arrangements |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1409717A true GB1409717A (en) | 1975-10-15 |
Family
ID=10470459
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5427071A Expired GB1409717A (en) | 1971-11-23 | 1971-11-23 | Method of mounting electric wiring arrangements |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS4860290A (en) |
DE (1) | DE2257232A1 (en) |
FR (1) | FR2161121B1 (en) |
GB (1) | GB1409717A (en) |
IT (1) | IT971125B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2186431A (en) * | 1986-02-07 | 1987-08-12 | Sperry Sun Inc | Assemblies for supporting electrical circuit boards within tubes |
GB2197755A (en) * | 1986-08-20 | 1988-05-25 | Plessey Co Plc | Electronic circuit housing for damping vibrations |
GB2209877A (en) * | 1986-02-07 | 1989-05-24 | Sperry Sun Inc | Assemblies for supporting electrical circuit boards within tubes |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59175785A (en) * | 1983-03-26 | 1984-10-04 | ソニー株式会社 | Circuit board |
DE19855076A1 (en) * | 1998-11-28 | 2000-06-08 | Daimler Chrysler Ag | DC/DC voltage converter e.g. for switching network, solar energy plant or electric vehicle drive, has metallic carrier supporting respective circuit boards for primary and secondary circuits and coupling transformer |
JP3526291B2 (en) * | 2001-04-25 | 2004-05-10 | 三菱電機株式会社 | Capacitor module and semiconductor device using the same |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3141998A (en) * | 1960-02-24 | 1964-07-21 | Harry G Silkman | Cooled modular electronic package |
-
1971
- 1971-11-23 GB GB5427071A patent/GB1409717A/en not_active Expired
-
1972
- 1972-11-22 IT IT3198272A patent/IT971125B/en active
- 1972-11-22 DE DE19722257232 patent/DE2257232A1/en active Pending
- 1972-11-22 JP JP47116732A patent/JPS4860290A/ja active Pending
- 1972-11-23 FR FR7242326A patent/FR2161121B1/fr not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2186431A (en) * | 1986-02-07 | 1987-08-12 | Sperry Sun Inc | Assemblies for supporting electrical circuit boards within tubes |
US4694555A (en) * | 1986-02-07 | 1987-09-22 | Nl Industries, Inc. | Assemblies for supporting electrical circuit boards within tubes and method of using same |
GB2209877A (en) * | 1986-02-07 | 1989-05-24 | Sperry Sun Inc | Assemblies for supporting electrical circuit boards within tubes |
US4855870A (en) * | 1986-02-07 | 1989-08-08 | Nl Industries, Inc. | Assemblies for supporting electrical circuit boards within tubes |
GB2209877B (en) * | 1986-02-07 | 1989-11-01 | Sperry Sun Inc | Assemblies for supporting electrical circuit boards within tubes |
GB2186431B (en) * | 1986-02-07 | 1989-11-01 | Sperry Sun Inc | Assemblies for supporting electrical circuit boards within tubes |
GB2197755A (en) * | 1986-08-20 | 1988-05-25 | Plessey Co Plc | Electronic circuit housing for damping vibrations |
GB2197755B (en) * | 1986-08-20 | 1990-05-09 | Plessey Co Plc | Electronic circuit housing |
Also Published As
Publication number | Publication date |
---|---|
JPS4860290A (en) | 1973-08-23 |
DE2257232A1 (en) | 1973-05-30 |
FR2161121A1 (en) | 1973-07-06 |
IT971125B (en) | 1974-04-30 |
FR2161121B1 (en) | 1975-03-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |