IT971125B - METHOD FOR ASSEMBLING ELECTRICAL CONNECTIONS - Google Patents

METHOD FOR ASSEMBLING ELECTRICAL CONNECTIONS

Info

Publication number
IT971125B
IT971125B IT3198272A IT3198272A IT971125B IT 971125 B IT971125 B IT 971125B IT 3198272 A IT3198272 A IT 3198272A IT 3198272 A IT3198272 A IT 3198272A IT 971125 B IT971125 B IT 971125B
Authority
IT
Italy
Prior art keywords
electrical connections
assembling electrical
assembling
connections
electrical
Prior art date
Application number
IT3198272A
Other languages
Italian (it)
Original Assignee
Lucas Aerospace Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Aerospace Ltd filed Critical Lucas Aerospace Ltd
Application granted granted Critical
Publication of IT971125B publication Critical patent/IT971125B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Details Of Indoor Wiring (AREA)
IT3198272A 1971-11-23 1972-11-22 METHOD FOR ASSEMBLING ELECTRICAL CONNECTIONS IT971125B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5427071A GB1409717A (en) 1971-11-23 1971-11-23 Method of mounting electric wiring arrangements

Publications (1)

Publication Number Publication Date
IT971125B true IT971125B (en) 1974-04-30

Family

ID=10470459

Family Applications (1)

Application Number Title Priority Date Filing Date
IT3198272A IT971125B (en) 1971-11-23 1972-11-22 METHOD FOR ASSEMBLING ELECTRICAL CONNECTIONS

Country Status (5)

Country Link
JP (1) JPS4860290A (en)
DE (1) DE2257232A1 (en)
FR (1) FR2161121B1 (en)
GB (1) GB1409717A (en)
IT (1) IT971125B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175785A (en) * 1983-03-26 1984-10-04 ソニー株式会社 Circuit board
GB2186431B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
GB2209877B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
GB2197755B (en) * 1986-08-20 1990-05-09 Plessey Co Plc Electronic circuit housing
DE19855076A1 (en) * 1998-11-28 2000-06-08 Daimler Chrysler Ag DC/DC voltage converter e.g. for switching network, solar energy plant or electric vehicle drive, has metallic carrier supporting respective circuit boards for primary and secondary circuits and coupling transformer
JP3526291B2 (en) * 2001-04-25 2004-05-10 三菱電機株式会社 Capacitor module and semiconductor device using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3141998A (en) * 1960-02-24 1964-07-21 Harry G Silkman Cooled modular electronic package

Also Published As

Publication number Publication date
FR2161121B1 (en) 1975-03-28
DE2257232A1 (en) 1973-05-30
FR2161121A1 (en) 1973-07-06
JPS4860290A (en) 1973-08-23
GB1409717A (en) 1975-10-15

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