FR2161121B1 - - Google Patents

Info

Publication number
FR2161121B1
FR2161121B1 FR7242326A FR7242326A FR2161121B1 FR 2161121 B1 FR2161121 B1 FR 2161121B1 FR 7242326 A FR7242326 A FR 7242326A FR 7242326 A FR7242326 A FR 7242326A FR 2161121 B1 FR2161121 B1 FR 2161121B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7242326A
Other languages
French (fr)
Other versions
FR2161121A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northrop Grumman Properties Ltd
Original Assignee
Lucas Aerospace Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lucas Aerospace Ltd filed Critical Lucas Aerospace Ltd
Publication of FR2161121A1 publication Critical patent/FR2161121A1/fr
Application granted granted Critical
Publication of FR2161121B1 publication Critical patent/FR2161121B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Details Of Indoor Wiring (AREA)
FR7242326A 1971-11-23 1972-11-23 Expired FR2161121B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5427071A GB1409717A (en) 1971-11-23 1971-11-23 Method of mounting electric wiring arrangements

Publications (2)

Publication Number Publication Date
FR2161121A1 FR2161121A1 (en) 1973-07-06
FR2161121B1 true FR2161121B1 (en) 1975-03-28

Family

ID=10470459

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7242326A Expired FR2161121B1 (en) 1971-11-23 1972-11-23

Country Status (5)

Country Link
JP (1) JPS4860290A (en)
DE (1) DE2257232A1 (en)
FR (1) FR2161121B1 (en)
GB (1) GB1409717A (en)
IT (1) IT971125B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59175785A (en) * 1983-03-26 1984-10-04 ソニー株式会社 Circuit board
GB2186431B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
GB2209877B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
GB2197755B (en) * 1986-08-20 1990-05-09 Plessey Co Plc Electronic circuit housing
DE19855076A1 (en) * 1998-11-28 2000-06-08 Daimler Chrysler Ag DC/DC voltage converter e.g. for switching network, solar energy plant or electric vehicle drive, has metallic carrier supporting respective circuit boards for primary and secondary circuits and coupling transformer
JP3526291B2 (en) * 2001-04-25 2004-05-10 三菱電機株式会社 Capacitor module and semiconductor device using the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3141998A (en) * 1960-02-24 1964-07-21 Harry G Silkman Cooled modular electronic package

Also Published As

Publication number Publication date
DE2257232A1 (en) 1973-05-30
FR2161121A1 (en) 1973-07-06
JPS4860290A (en) 1973-08-23
IT971125B (en) 1974-04-30
GB1409717A (en) 1975-10-15

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Legal Events

Date Code Title Description
TP Transmission of property
CD Change of name or company name
ST Notification of lapse