ES435343A1 - Procedimiento para obtener una capa protectora de laca parasemiconductores. - Google Patents
Procedimiento para obtener una capa protectora de laca parasemiconductores.Info
- Publication number
- ES435343A1 ES435343A1 ES435343A ES435343A ES435343A1 ES 435343 A1 ES435343 A1 ES 435343A1 ES 435343 A ES435343 A ES 435343A ES 435343 A ES435343 A ES 435343A ES 435343 A1 ES435343 A1 ES 435343A1
- Authority
- ES
- Spain
- Prior art keywords
- support
- semiconductor wafers
- protective lacquer
- layer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/976—Temporary protective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Local Oxidation Of Silicon (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2436600A DE2436600A1 (de) | 1974-07-30 | 1974-07-30 | Verfahren zur erzielung einer oberflaechenstabilisierenden schutzschicht bei halbleiterbauelementen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES435343A1 true ES435343A1 (es) | 1976-12-16 |
Family
ID=5921905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES435343A Expired ES435343A1 (es) | 1974-07-30 | 1975-03-06 | Procedimiento para obtener una capa protectora de laca parasemiconductores. |
Country Status (11)
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56138914A (en) * | 1980-03-31 | 1981-10-29 | Nichicon Capacitor Ltd | Electrolytic condenser |
| US4624724A (en) * | 1985-01-17 | 1986-11-25 | General Electric Company | Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base |
| US4680072A (en) * | 1985-04-30 | 1987-07-14 | Wedco Inc. | Method and apparatus for producing multilayered plastic containing sheets |
| DE10029035C1 (de) * | 2000-06-13 | 2002-02-28 | Infineon Technologies Ag | Verfahren zur Bearbeitung eines Wafers |
| US8026565B2 (en) * | 2003-01-30 | 2011-09-27 | University Of Cape Town | Thin film semiconductor device comprising nanocrystalline silicon powder |
| US7400037B2 (en) | 2004-12-30 | 2008-07-15 | Advanced Chip Engineering Tachnology Inc. | Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3690984A (en) * | 1967-10-09 | 1972-09-12 | Western Electric Co | Releasable mounting method of placing an oriented array of semiconductor devices on the mounting |
| US3706409A (en) * | 1970-02-26 | 1972-12-19 | Gen Electric | Semiconductor lead attachment system including a semiconductor pellet orientation plate |
| US3766638A (en) * | 1970-08-31 | 1973-10-23 | Hugle Ind Inc | Wafer spreader |
| US3739463A (en) * | 1971-10-18 | 1973-06-19 | Gen Electric | Method for lead attachment to pellets mounted in wafer alignment |
| US3888053A (en) * | 1973-05-29 | 1975-06-10 | Rca Corp | Method of shaping semiconductor workpiece |
-
1974
- 1974-07-30 DE DE2436600A patent/DE2436600A1/de active Pending
-
1975
- 1975-02-04 CH CH135075A patent/CH590557A5/xx not_active IP Right Cessation
- 1975-02-21 SE SE7501979A patent/SE397902B/xx unknown
- 1975-02-24 AR AR257737A patent/AR202062A1/es active
- 1975-03-06 ES ES435343A patent/ES435343A1/es not_active Expired
- 1975-03-10 US US05/556,867 patent/US3947303A/en not_active Expired - Lifetime
- 1975-03-20 FR FR7508680A patent/FR2280977A1/fr active Granted
- 1975-04-11 JP JP4347575A patent/JPS5429345B2/ja not_active Expired
- 1975-04-14 IT IT22297/75A patent/IT1037271B/it active
- 1975-05-15 GB GB20500/75A patent/GB1509227A/en not_active Expired
- 1975-07-08 BR BR5500/75D patent/BR7504290A/pt unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3947303A (en) | 1976-03-30 |
| BR7504290A (pt) | 1976-07-13 |
| DE2436600A1 (de) | 1976-02-19 |
| JPS5117670A (US20100223739A1-20100909-C00025.png) | 1976-02-12 |
| CH590557A5 (US20100223739A1-20100909-C00025.png) | 1977-08-15 |
| FR2280977A1 (fr) | 1976-02-27 |
| IT1037271B (it) | 1979-11-10 |
| SE7501979L (sv) | 1976-02-02 |
| JPS5429345B2 (US20100223739A1-20100909-C00025.png) | 1979-09-22 |
| SE397902B (sv) | 1977-11-21 |
| AR202062A1 (es) | 1975-05-09 |
| FR2280977B1 (US20100223739A1-20100909-C00025.png) | 1979-03-02 |
| GB1509227A (en) | 1978-05-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR950704837A (ko) | 다이와 칩 캐리어간의 인터페이스 형성방법 (method of forming interface between die and chip carrier) | |
| IT967608B (it) | Processo perfezionato per la fab bricazione di dispositivi semicon duttori e a circuito integrato | |
| MY118036A (en) | Wafer dicing/bonding sheet and process for producing semiconductor device | |
| ATE59733T1 (de) | Ein verfahren zum herstellen einer halbleiteranordnung mit leiter-steckerstiften. | |
| BR7605354A (pt) | Conjunto semicondutor encapsulado e passivado e processo de fabrica-lo | |
| ES435343A1 (es) | Procedimiento para obtener una capa protectora de laca parasemiconductores. | |
| NL7502844A (nl) | Halfgeleiderinrichting voor het opwekken van incoherente straling, en werkwijze ter ver- vaardiging daarvan. | |
| ES417197A1 (es) | Perfeccionamientos en la fabricacion de capsulas para pla- cas de circuitos integrados, particularmente del denominado tipo lsi. | |
| SE8504295D0 (sv) | Sett att inkapsla pa ett berarband monterade halvledarekomponenter | |
| NL174684C (nl) | Werkwijze voor het vervaardigen van een halfgeleiderinrichting omvattende het op een deel van een lichaam van halfgeleidermateriaal aanbrengen in een patroon van een laag van een metaal dat is gedoteerd met tenminste een de elektrische geleidingseigenschappen van het halfgeleidermateriaal wijzigende activator, het met handhaving van de maskerlaag aan een warmtebehandeling blootstellen van het halfgeleiderlichaam en de metaallaag, teneinde activatoratomen in het aan de metaallaag grenzende deel van het halfgeleiderlichaam te diffunderen en het aan de metaallaag bevestigen van een uitwendige aansluitgeleider. | |
| SE8205932D0 (sv) | Medical bag and method for manufacturing the same | |
| BR7502515A (pt) | Camada de material semicondutor monocristalino, transistor bipolar planar e processo de fabricacao de um transistor bipolar | |
| US3689336A (en) | Fabrication of packages for integrated circuits | |
| JPS55121669A (en) | Method of forming inactive layer on integrated circuit device having substrate of semiconductor material | |
| JPS531464A (en) | Bonding for crystal base | |
| GB1142816A (en) | Improvements in or relating to the manufacture of semiconductor components | |
| ES374056A1 (es) | Dispositivo de barrera de pontencial. | |
| JPS5632736A (en) | Sealing method of hybrid integrated circuit device | |
| US11125513B2 (en) | Formable interface and shielding structures | |
| NL7403470A (nl) | Werkwijze voor het vervaardigen van een half- geleiderinrichting met een in een halfgelei- derlichaam verzonken isolatielaag en halfge- leiderinrichting vervaardigd volgens deze werkwijze. | |
| JPS5229831A (en) | Adhesive tape | |
| JPS5630732A (en) | Mounting method of semiconductor pellet | |
| JPS5236985A (en) | Method of connecting semiconductor devices etc. | |
| JPS5488081A (en) | Mounting method of semiconductor device | |
| JPS5650544A (en) | Resin sealing structure for ic |