ES426548A1 - Procedimiento de obtencion de composiciones acuosas acidi- cas adecuadas para la electrodeposicion de una aleacion es- tano-plomo brillante de alta soldabilidad. - Google Patents
Procedimiento de obtencion de composiciones acuosas acidi- cas adecuadas para la electrodeposicion de una aleacion es- tano-plomo brillante de alta soldabilidad.Info
- Publication number
- ES426548A1 ES426548A1 ES426548A ES426548A ES426548A1 ES 426548 A1 ES426548 A1 ES 426548A1 ES 426548 A ES426548 A ES 426548A ES 426548 A ES426548 A ES 426548A ES 426548 A1 ES426548 A1 ES 426548A1
- Authority
- ES
- Spain
- Prior art keywords
- bright
- aromatic
- solder plating
- bath
- bright solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- 238000007747 plating Methods 0.000 title 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- 150000003934 aromatic aldehydes Chemical class 0.000 abstract 1
- 150000004982 aromatic amines Chemical class 0.000 abstract 1
- 125000003118 aryl group Chemical group 0.000 abstract 1
- -1 aryl primary amine Chemical class 0.000 abstract 1
- 239000010953 base metal Substances 0.000 abstract 1
- 239000007859 condensation product Substances 0.000 abstract 1
- 230000002596 correlated effect Effects 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US00362595A US3850765A (en) | 1973-05-21 | 1973-05-21 | Bright solder plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES426548A1 true ES426548A1 (es) | 1976-07-01 |
Family
ID=23426724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES426548A Expired ES426548A1 (es) | 1973-05-21 | 1974-05-21 | Procedimiento de obtencion de composiciones acuosas acidi- cas adecuadas para la electrodeposicion de una aleacion es- tano-plomo brillante de alta soldabilidad. |
Country Status (11)
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE390986B (sv) * | 1973-10-18 | 1977-01-31 | Modo Kemi Ab | Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad |
| US4073701A (en) * | 1976-10-15 | 1978-02-14 | Bethlehem Steel Corporation | Acid electrotinning bath |
| US4139425A (en) * | 1978-04-05 | 1979-02-13 | R. O. Hull & Company, Inc. | Composition, plating bath, and method for electroplating tin and/or lead |
| US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
| SE8204505L (sv) * | 1981-09-08 | 1983-03-09 | Occidental Chem Co | Elektropletering for avsettning av tenn-blylegeringar pa olika underlag |
| US4662999A (en) * | 1985-06-26 | 1987-05-05 | Mcgean-Rohco, Inc. | Plating bath and method for electroplating tin and/or lead |
| DE3934866A1 (de) * | 1989-10-19 | 1991-04-25 | Blasberg Oberflaechentech | Verfahren zur abscheidung von blei- und bleihaltigen schichten, elektrolyte zur durchfuehrung des verfahrens sowie verwendung von tensiden in sauren blei-elektrolyten |
| US5326453A (en) * | 1993-02-19 | 1994-07-05 | Motorola, Inc. | Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy |
| US5545440A (en) * | 1994-12-05 | 1996-08-13 | At&T Global Information Solutions Company (Aka Ncr Corporation) | Method and apparatus for polymer coating of substrates |
| US5597469A (en) * | 1995-02-13 | 1997-01-28 | International Business Machines Corporation | Process for selective application of solder to circuit packages |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3661730A (en) * | 1969-09-22 | 1972-05-09 | Kazuo Nishihara | Process for the formation of a super-bright solder coating |
| US3730853A (en) * | 1971-06-18 | 1973-05-01 | Schloetter M | Electroplating bath for depositing tin-lead alloy plates |
| US3749649A (en) * | 1971-12-16 | 1973-07-31 | M & T Chemicals Inc | Bright tin-lead alloy plating |
-
1973
- 1973-05-21 US US00362595A patent/US3850765A/en not_active Expired - Lifetime
-
1974
- 1974-05-14 JP JP5380074A patent/JPS5736990B2/ja not_active Expired
- 1974-05-16 FR FR7417056A patent/FR2230752B1/fr not_active Expired
- 1974-05-17 AT AT409774A patent/AT333093B/de not_active IP Right Cessation
- 1974-05-17 DE DE2424070A patent/DE2424070C2/de not_active Expired
- 1974-05-17 CA CA200,246A patent/CA1031291A/en not_active Expired
- 1974-05-20 IT IT51116/74A patent/IT1023029B/it active
- 1974-05-20 GB GB2244174A patent/GB1476176A/en not_active Expired
- 1974-05-21 NL NL7406817A patent/NL7406817A/xx not_active Application Discontinuation
- 1974-05-21 BE BE144600A patent/BE815368A/xx not_active IP Right Cessation
- 1974-05-21 ES ES426548A patent/ES426548A1/es not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2230752A1 (enrdf_load_stackoverflow) | 1974-12-20 |
| AU6893474A (en) | 1975-11-20 |
| GB1476176A (en) | 1977-06-10 |
| AT333093B (de) | 1976-11-10 |
| JPS5736990B2 (enrdf_load_stackoverflow) | 1982-08-06 |
| FR2230752B1 (enrdf_load_stackoverflow) | 1983-07-22 |
| NL7406817A (enrdf_load_stackoverflow) | 1974-11-25 |
| IT1023029B (it) | 1978-05-10 |
| DE2424070C2 (de) | 1985-08-22 |
| DE2424070A1 (de) | 1974-12-12 |
| CA1031291A (en) | 1978-05-16 |
| BE815368A (fr) | 1974-11-21 |
| ATA409774A (de) | 1976-02-15 |
| US3850765A (en) | 1974-11-26 |
| JPS5041728A (enrdf_load_stackoverflow) | 1975-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| SE7606209L (sv) | Forfarande for elektrolytisk beleggning av en aluminiumberare | |
| ES426548A1 (es) | Procedimiento de obtencion de composiciones acuosas acidi- cas adecuadas para la electrodeposicion de una aleacion es- tano-plomo brillante de alta soldabilidad. | |
| ES434856A1 (es) | Perfeccionamientos en la produccion de banos acidos acuososde electro-deposicion de estano. | |
| US3101305A (en) | Acid copper plating bath | |
| IT1058137B (it) | Metodo per placcare metalli su sostrati metallici ed oggetti placcati ottenuti | |
| FR2347460A1 (fr) | Procede de revetement de surface de cuivre par depot electrolytique | |
| US3730853A (en) | Electroplating bath for depositing tin-lead alloy plates | |
| KR840002463A (ko) | 아연 용융도금 강판의 제조방법 | |
| FR2409327A1 (fr) | Bains d'electroplacage pour le depot brillant d'etain ou d'alliages d'etain | |
| ES382607A1 (es) | Procedimiento de obtencion de banos acuosos para el deposi-to electrolitico de oro o de una aleacion de oro sobre un articulo conductor. | |
| SE7702440L (sv) | Sett att galvanisera jernforemal | |
| SE8300416L (sv) | Zink-coboltbaserat elektropleteringsbad, forfarande for framstellningen av en zink-koboltpletering och derigenom framstellt, pleterat foremal | |
| SE7812869L (sv) | Surt zinkelektropleteringsforfarande och komposition | |
| ES434016A1 (es) | Mejoras introducidas en un procedimiento para producir un electrodeposito brillante de aleacion de hierro-niquel. | |
| JPS5340035A (en) | Coating method | |
| ES410631A1 (es) | Procedimiento para preparar banos acuosos, acidos, de elec-trodeposicion. | |
| ES326510A1 (es) | Mejoras introducidas en la preparacion de baños galvanoplasticos acidos para depositar estaño. | |
| KR840004185A (ko) | 금속의 킬레이트화 | |
| SE8204505D0 (sv) | Electrodeposition of tin/lead alloys | |
| ES384199A1 (es) | Procedimiento para la formacion de un revestimiento com- puesto que contiene niquel, de tres capas, protectorcontra la corrosion, sobre una superficie metalica base susceptiblede corroerse. | |
| ES393019A1 (es) | Procedimiento para la preparacion de un bano de cinc galva-nico acido. | |
| BE752573A (fr) | Depot de protection par electrodeposition de composes chromes sur des substrats metalliques | |
| ES394896A1 (es) | Procedimiento para mejorar el comportamiento mecanico del cobre chapado. | |
| ES388291A1 (es) | Un procedimiento de depositar electronicamente oro desde unbano de chapado acuoso que tiene un ph acido o neutro. | |
| Mayer et al. | Electrodeposition of Tin--Lead Alloys |