FR2347460A1 - Procede de revetement de surface de cuivre par depot electrolytique - Google Patents
Procede de revetement de surface de cuivre par depot electrolytiqueInfo
- Publication number
- FR2347460A1 FR2347460A1 FR7631777A FR7631777A FR2347460A1 FR 2347460 A1 FR2347460 A1 FR 2347460A1 FR 7631777 A FR7631777 A FR 7631777A FR 7631777 A FR7631777 A FR 7631777A FR 2347460 A1 FR2347460 A1 FR 2347460A1
- Authority
- FR
- France
- Prior art keywords
- coating process
- surface coating
- copper surface
- electrolytic deposit
- electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/20—Pretreatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/44—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
- C09D5/4419—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
- C09D5/4461—Polyamides; Polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Metallurgy (AREA)
- Molecular Biology (AREA)
- Wood Science & Technology (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/624,352 US4019877A (en) | 1975-10-21 | 1975-10-21 | Method for coating of polyimide by electrodeposition |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2347460A1 true FR2347460A1 (fr) | 1977-11-04 |
Family
ID=24501663
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7631777A Withdrawn FR2347460A1 (fr) | 1975-10-21 | 1976-10-21 | Procede de revetement de surface de cuivre par depot electrolytique |
Country Status (8)
Country | Link |
---|---|
US (1) | US4019877A (fr) |
JP (1) | JPS5251436A (fr) |
CA (1) | CA1070262A (fr) |
DE (1) | DE2647625A1 (fr) |
FR (1) | FR2347460A1 (fr) |
GB (1) | GB1570683A (fr) |
IT (1) | IT1069189B (fr) |
NL (1) | NL7611530A (fr) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4334973A (en) * | 1980-07-18 | 1982-06-15 | Westinghouse Electric Corp. | Process for electrophoretically forming an imide coating on wire |
US4391933A (en) * | 1980-12-22 | 1983-07-05 | Westinghouse Electric Corp. | Electrophoretic coating of epoxy resins from non-aqueous systems |
US4474658A (en) * | 1982-01-21 | 1984-10-02 | Westinghouse Electric Corp. | Method of preparing electrophorettable polymer emulsions |
GB2117794B (en) * | 1982-04-06 | 1986-05-21 | Standard Telephones Cables Ltd | Electrocoating electrical components |
GB8312770D0 (en) * | 1983-05-10 | 1983-06-15 | Albright & Wilson | Resin deposition |
JP2556838B2 (ja) * | 1986-06-25 | 1996-11-27 | 富士重工業株式会社 | 自動車車体塗装等における下塗り処理方法 |
US4950553A (en) * | 1987-02-24 | 1990-08-21 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from polyimide film |
US4992144A (en) * | 1987-02-24 | 1991-02-12 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from polyimide film |
US4868071A (en) * | 1987-02-24 | 1989-09-19 | Polyonics Corporation | Thermally stable dual metal coated laminate products made from textured polyimide film |
US5248760A (en) * | 1991-01-25 | 1993-09-28 | Unc At Charlotte | Chemically cured low temperature polyimides |
US5164332A (en) * | 1991-03-15 | 1992-11-17 | Microelectronics And Computer Technology Corporation | Diffusion barrier for copper features |
CA2159296C (fr) * | 1994-10-14 | 2007-01-30 | Michel J. Soubeyrand | Mode d'application d'un revetement sur le verre et verre revetu ainsi obtenu |
US5688391A (en) * | 1996-03-26 | 1997-11-18 | Microfab Technologies, Inc. | Method for electro-deposition passivation of ink channels in ink jet printhead |
US5908542A (en) * | 1997-07-02 | 1999-06-01 | Gould Electronics Inc. | Metal foil with improved bonding to substrates and method for making the foil |
US20020151234A1 (en) * | 2001-02-05 | 2002-10-17 | Ube Industries, Ltd. | Water-soluble polyimide precursor, aqueous polyimide precursor solution, polyimide, impregnated material with polyimide binder, and laminate |
JP4998871B2 (ja) * | 2006-08-23 | 2012-08-15 | 独立行政法人産業技術総合研究所 | 電着ポリイミド薄膜及びその成膜方法 |
JP2008050635A (ja) * | 2006-08-23 | 2008-03-06 | National Institute Of Advanced Industrial & Technology | Cu−Ni−有機電着薄膜積層構造体及びその形成方法 |
TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
WO2009051561A1 (fr) * | 2007-10-17 | 2009-04-23 | Agency For Science, Technology And Research | Films composites comprenant des nanotubes de carbone et un polymère |
KR101370137B1 (ko) * | 2008-06-24 | 2014-03-05 | 후루카와 덴키 고교 가부시키가이샤 | 전기전자 부품용 복합재료 및 그것을 이용한 전기전자 부품 |
GB2473247B (en) | 2009-09-04 | 2015-02-11 | Sony Corp | A method and apparatus for image alignment |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2725353A (en) * | 1950-07-21 | 1955-11-29 | Western Electric Co | Electropolishing metallic articles |
US2753301A (en) * | 1952-01-11 | 1956-07-03 | Dow Chemical Co | Electropolishing of copper and its alloys |
DE1796176A1 (de) * | 1967-09-14 | 1972-03-23 | Sumitomo Electric Industries | Isolierter Draht und Verfahren zu dessen Herstellung |
US3846269A (en) * | 1972-04-19 | 1974-11-05 | Westinghouse Electric Corp | Method for continuous coating of polyimide by electrodeposition |
JPS5514879B2 (fr) * | 1973-04-19 | 1980-04-19 | ||
JPS5436579B2 (fr) * | 1973-11-19 | 1979-11-09 |
-
1975
- 1975-10-21 US US05/624,352 patent/US4019877A/en not_active Expired - Lifetime
-
1976
- 1976-10-05 CA CA262,763A patent/CA1070262A/fr not_active Expired
- 1976-10-19 IT IT41665/76A patent/IT1069189B/it active
- 1976-10-19 NL NL7611530A patent/NL7611530A/xx not_active Application Discontinuation
- 1976-10-21 FR FR7631777A patent/FR2347460A1/fr not_active Withdrawn
- 1976-10-21 JP JP51125594A patent/JPS5251436A/ja active Pending
- 1976-10-21 GB GB43703/76A patent/GB1570683A/en not_active Expired
- 1976-10-21 DE DE19762647625 patent/DE2647625A1/de active Pending
Also Published As
Publication number | Publication date |
---|---|
IT1069189B (it) | 1985-03-25 |
DE2647625A1 (de) | 1977-04-28 |
NL7611530A (nl) | 1977-04-25 |
JPS5251436A (en) | 1977-04-25 |
GB1570683A (en) | 1980-07-09 |
CA1070262A (fr) | 1980-01-22 |
US4019877A (en) | 1977-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |