FR2343815A1 - Procede de depot de metal sur une surface - Google Patents
Procede de depot de metal sur une surfaceInfo
- Publication number
- FR2343815A1 FR2343815A1 FR7706616A FR7706616A FR2343815A1 FR 2343815 A1 FR2343815 A1 FR 2343815A1 FR 7706616 A FR7706616 A FR 7706616A FR 7706616 A FR7706616 A FR 7706616A FR 2343815 A1 FR2343815 A1 FR 2343815A1
- Authority
- FR
- France
- Prior art keywords
- metal deposit
- deposit process
- metal
- deposit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1415—Applying catalyst after applying plating resist
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/664,610 US4100037A (en) | 1976-03-08 | 1976-03-08 | Method of depositing a metal on a surface |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2343815A1 true FR2343815A1 (fr) | 1977-10-07 |
FR2343815B1 FR2343815B1 (fr) | 1980-03-07 |
Family
ID=24666696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7706616A Granted FR2343815A1 (fr) | 1976-03-08 | 1977-03-07 | Procede de depot de metal sur une surface |
Country Status (5)
Country | Link |
---|---|
US (1) | US4100037A (fr) |
JP (1) | JPS52116738A (fr) |
DE (1) | DE2709928B2 (fr) |
FR (1) | FR2343815A1 (fr) |
NL (1) | NL7702431A (fr) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4381951A (en) * | 1978-01-25 | 1983-05-03 | Western Electric Co. Inc. | Method of removing contaminants from a surface |
US4322457A (en) * | 1978-01-25 | 1982-03-30 | Western Electric Co., Inc. | Method of selectively depositing a metal on a surface |
US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
US4377619A (en) * | 1981-05-08 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Prevention of surface mass migration by means of a polymeric surface coating |
US4360968A (en) * | 1981-07-27 | 1982-11-30 | Western Electric Company, Incorporated | Method for reducing solder sticking on a printed wiring board |
US4555414A (en) * | 1983-04-15 | 1985-11-26 | Polyonics Corporation | Process for producing composite product having patterned metal layer |
US4666735A (en) * | 1983-04-15 | 1987-05-19 | Polyonics Corporation | Process for producing product having patterned metal layer |
US4683036A (en) * | 1983-06-10 | 1987-07-28 | Kollmorgen Technologies Corporation | Method for electroplating non-metallic surfaces |
JPS6074599A (ja) * | 1983-09-30 | 1985-04-26 | 株式会社日立製作所 | プリント配線板及びその製造方法 |
EP0150733A3 (fr) * | 1984-01-26 | 1987-01-14 | LeaRonal, Inc. | Procédé de fabrication de circuit imprimé |
US4759952A (en) * | 1984-01-26 | 1988-07-26 | Learonal, Inc. | Process for printed circuit board manufacture |
US4761304A (en) * | 1984-01-26 | 1988-08-02 | Learonal, Inc. | Process for printed circuit board manufacture |
US4847114A (en) * | 1984-01-26 | 1989-07-11 | Learonal, Inc. | Preparation of printed circuit boards by selective metallization |
US4668532A (en) * | 1984-09-04 | 1987-05-26 | Kollmorgen Technologies Corporation | System for selective metallization of electronic interconnection boards |
GB2253415A (en) * | 1991-02-08 | 1992-09-09 | Eid Empresa De Investigacao E | Selective process for printed circuit board manufacturing employing noble metal oxide catalyst. |
US6060121A (en) * | 1996-03-15 | 2000-05-09 | President And Fellows Of Harvard College | Microcontact printing of catalytic colloids |
US6355198B1 (en) * | 1996-03-15 | 2002-03-12 | President And Fellows Of Harvard College | Method of forming articles including waveguides via capillary micromolding and microtransfer molding |
US6426470B1 (en) | 2001-01-17 | 2002-07-30 | International Business Machines Corporation | Formation of multisegmented plated through holes |
US6824857B2 (en) | 2001-04-02 | 2004-11-30 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
EP1383364A3 (fr) * | 2002-05-23 | 2006-01-04 | Nashua Corporation | Eléments de circuit ayant un revêtement récepteur d'encre et une trace conductrice et leur procédé de fabrication |
US7735451B2 (en) * | 2002-11-15 | 2010-06-15 | Ebara Corporation | Substrate processing method and apparatus |
US6900126B2 (en) | 2002-11-20 | 2005-05-31 | International Business Machines Corporation | Method of forming metallized pattern |
JP2006229034A (ja) * | 2005-02-18 | 2006-08-31 | Toshiba Corp | 配線基板とその製造方法 |
US11501967B2 (en) * | 2019-02-06 | 2022-11-15 | Intel Corporation | Selective metal deposition by patterning direct electroless metal plating |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2441960A (en) * | 1943-02-02 | 1948-05-25 | Eisler Paul | Manufacture of electric circuit components |
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
US3532518A (en) * | 1967-06-28 | 1970-10-06 | Macdermid Inc | Colloidal metal activating solutions for use in chemically plating nonconductors,and process of preparing such solutions |
SE332214B (fr) * | 1968-07-12 | 1971-02-01 | Gylling & Co | |
US3640765A (en) * | 1969-08-06 | 1972-02-08 | Rca Corp | Selective deposition of metal |
US3627724A (en) * | 1969-12-03 | 1971-12-14 | Cabot Corp | Rubber compositions |
US3657003A (en) * | 1970-02-02 | 1972-04-18 | Western Electric Co | Method of rendering a non-wettable surface wettable |
US3764280A (en) * | 1970-11-02 | 1973-10-09 | Gen Electric | Electroconductive coatings on non conductive substrates |
US3775117A (en) * | 1971-07-13 | 1973-11-27 | Siemens Ag | Process for selective metallization of insulating material bodies |
US3760091A (en) * | 1971-11-16 | 1973-09-18 | Ibm | Multilayer circuit board |
BE791374A (fr) * | 1971-11-26 | 1973-03-01 | Western Electric Co | Procede pour realiser un depot metallique a la surface d'un substrat |
US3791939A (en) * | 1972-05-15 | 1974-02-12 | Western Electric Co | Method of selectively depositing a metal on a surface |
US3841881A (en) * | 1972-09-13 | 1974-10-15 | Rca Corp | Method for electroless deposition of metal using improved colloidal catalyzing solution |
-
1976
- 1976-03-08 US US05/664,610 patent/US4100037A/en not_active Expired - Lifetime
-
1977
- 1977-03-07 NL NL7702431A patent/NL7702431A/xx not_active Application Discontinuation
- 1977-03-07 FR FR7706616A patent/FR2343815A1/fr active Granted
- 1977-03-08 DE DE772709928A patent/DE2709928B2/de active Granted
- 1977-03-08 JP JP2452677A patent/JPS52116738A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2709928C3 (fr) | 1979-10-18 |
NL7702431A (nl) | 1977-09-12 |
US4100037A (en) | 1978-07-11 |
JPS52116738A (en) | 1977-09-30 |
DE2709928B2 (de) | 1979-03-01 |
DE2709928A1 (de) | 1977-09-15 |
FR2343815B1 (fr) | 1980-03-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |