ES3073091T3 - X-ray image acquisition device and x-ray image acquisition system - Google Patents
X-ray image acquisition device and x-ray image acquisition systemInfo
- Publication number
- ES3073091T3 ES3073091T3 ES22841749T ES22841749T ES3073091T3 ES 3073091 T3 ES3073091 T3 ES 3073091T3 ES 22841749 T ES22841749 T ES 22841749T ES 22841749 T ES22841749 T ES 22841749T ES 3073091 T3 ES3073091 T3 ES 3073091T3
- Authority
- ES
- Spain
- Prior art keywords
- pixel
- sections
- summing
- pixel portions
- imaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/30—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming X-rays into image signals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/768—Addressed sensors, e.g. MOS or CMOS sensors for time delay and integration [TDI]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/779—Circuitry for scanning or addressing the pixel array
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/30—Accessories, mechanical or electrical features
- G01N2223/33—Accessories, mechanical or electrical features scanning, i.e. relative motion for measurement of successive object-parts
- G01N2223/3307—Accessories, mechanical or electrical features scanning, i.e. relative motion for measurement of successive object-parts source and detector fixed; object moves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/50—Detectors
- G01N2223/505—Detectors scintillation
Landscapes
- Multimedia (AREA)
- Signal Processing (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Toxicology (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Measurement Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021115658 | 2021-07-13 | ||
| PCT/JP2022/016600 WO2023286401A1 (ja) | 2021-07-13 | 2022-03-31 | X線画像取得装置及びx線画像取得システム |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES3073091T3 true ES3073091T3 (en) | 2026-07-08 |
Family
ID=84919324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES22841749T Active ES3073091T3 (en) | 2021-07-13 | 2022-03-31 | X-ray image acquisition device and x-ray image acquisition system |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US12584867B2 (de) |
| EP (1) | EP4358505B1 (de) |
| JP (2) | JP7311731B2 (de) |
| KR (1) | KR20240032111A (de) |
| CN (1) | CN117716695A (de) |
| ES (1) | ES3073091T3 (de) |
| FI (1) | FI4358505T3 (de) |
| WO (1) | WO2023286401A1 (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121729635A (zh) * | 2023-08-30 | 2026-03-24 | 浜松光子学株式会社 | X射线图像获取装置、x射线图像获取系统及x射线图像获取方法 |
| CN118229522B (zh) * | 2024-02-29 | 2025-02-28 | 北京长远佳信息科技有限公司 | 一种全景x射线片生成方法及装置 |
Family Cites Families (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0449113B1 (de) * | 1990-03-22 | 1994-10-26 | Matsushita Electric Industrial Co., Ltd. | Verfahren zur Feststellung des Massenanteils eines Target- materials mit Hilfe eines mehrkanaligen Röntgen-Bildsensors |
| US5323186A (en) * | 1992-06-17 | 1994-06-21 | The United States Of America As Represented By The Secretary Of The Army | Focal plane array for man and machine visions |
| JPH08219880A (ja) * | 1995-02-10 | 1996-08-30 | Fujitsu Ltd | 赤外線撮像装置 |
| JP3319905B2 (ja) * | 1995-03-24 | 2002-09-03 | 株式会社モリタ製作所 | デジタルx線撮影装置 |
| JP3307519B2 (ja) * | 1995-03-24 | 2002-07-24 | 株式会社モリタ製作所 | 医療用x線撮影装置 |
| US5898332A (en) * | 1997-03-28 | 1999-04-27 | Northern Telecom Limited | Time delay charge integration circuit |
| JP3809713B2 (ja) * | 1997-09-09 | 2006-08-16 | 富士通株式会社 | Tdi回路、画像信号読出回路及び撮像デバイス |
| US6825877B1 (en) * | 2000-01-07 | 2004-11-30 | Raytheon Company | Multiplex bucket brigade circuit |
| US6762795B1 (en) * | 2000-01-07 | 2004-07-13 | Raytheon Company | Bi-directional capable bucket brigade circuit |
| JP4246964B2 (ja) * | 2002-05-27 | 2009-04-02 | 浜松ホトニクス株式会社 | 固体撮像装置及び固体撮像装置アレイ |
| JP4107269B2 (ja) * | 2004-02-23 | 2008-06-25 | ソニー株式会社 | 固体撮像装置 |
| DE102005003226B4 (de) * | 2005-01-24 | 2014-02-06 | Siemens Aktiengesellschaft | Verfahren und Einrichtung zur Wiedergabe eines Röntgenbildes |
| DE102005003225A1 (de) * | 2005-01-24 | 2006-07-27 | Siemens Ag | Verfahren und Einrichtung zum Erzeugen eines Röntgenbildes |
| JP2007294734A (ja) | 2006-04-26 | 2007-11-08 | Sanyo Electric Co Ltd | 固体撮像素子 |
| US7675561B2 (en) * | 2006-09-28 | 2010-03-09 | Cypress Semiconductor Corporation | Time delayed integration CMOS image sensor with zero desynchronization |
| DE102007030985B4 (de) | 2007-07-04 | 2009-04-09 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Bildsensor, Verfahren zum Betreiben eines Bildsensors und Computerprogramm |
| GB0806427D0 (en) | 2008-04-09 | 2008-05-14 | Cmosis Nv | Parallel analog-to-digital conversion in pixel arrays |
| JP5257134B2 (ja) * | 2009-02-25 | 2013-08-07 | コニカミノルタビジネステクノロジーズ株式会社 | 固体撮像素子およびそれを備えた撮像装置 |
| FR2959902B1 (fr) * | 2010-05-04 | 2013-08-23 | E2V Semiconductors | Capteur d'image lineaire a defilement et sommation analogique et numerique et procede correspondant |
| EP2571252A4 (de) * | 2010-05-13 | 2014-04-23 | Konica Minolta Business Tech | Festkörper-bildaufnahmevorrichtung, bildaufnahmevorrichtung und antriebsverfahren dafür |
| GB2486039B (en) * | 2010-11-30 | 2016-10-05 | X-Scan Imaging Corp | CMOS time delay integration sensor for X-ray imaging applications |
| JP5827064B2 (ja) * | 2011-08-05 | 2015-12-02 | 株式会社日立ハイテクサイエンス | 透過x線分析装置及び方法 |
| US8989348B2 (en) * | 2011-11-18 | 2015-03-24 | Visuum, Llc | Multi-linear X-ray scanning systems and methods for X-ray scanning |
| JP2013156172A (ja) * | 2012-01-31 | 2013-08-15 | X-Ray Precision Inc | X線検査装置 |
| JP5875403B2 (ja) * | 2012-02-21 | 2016-03-02 | 株式会社日立ハイテクサイエンス | 透過x線分析装置 |
| CN102595067A (zh) * | 2012-03-07 | 2012-07-18 | 天津大学 | 模拟、数字混合累加型tdi-cis图像传感器 |
| US8969780B2 (en) | 2012-06-15 | 2015-03-03 | Caeleste Cvba | CMOS circuit for sensor with reduced read noise |
| JP6118429B2 (ja) * | 2013-10-09 | 2017-04-19 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 適合されたエネルギー閾値を用いてエネルギー分解x線画像を生成するための方法及びデバイス、当該方法を実施するプログラム、当該プログラムが記憶されているコンピュータ可読媒体 |
| CA2929440C (en) | 2013-11-06 | 2022-01-25 | Thorlabs, Inc. | Method for correcting images acquired via asynchronously triggered acquisition |
| JP6450075B2 (ja) * | 2014-02-24 | 2019-01-09 | アンリツインフィビス株式会社 | X線検査装置 |
| DE102014218243A1 (de) * | 2014-09-11 | 2016-03-17 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Tdi-hochgeschwindigkeits-zeilensensor |
| JP6512980B2 (ja) * | 2015-07-29 | 2019-05-15 | 株式会社日立ハイテクサイエンス | X線透過検査装置及びx線透過検査方法 |
| JP6266574B2 (ja) * | 2015-09-10 | 2018-01-24 | 株式会社日立ハイテクサイエンス | X線検査方法及びx線検査装置 |
| US10310106B2 (en) * | 2015-10-24 | 2019-06-04 | X-Scan Imaging Corporation | Dual/multiple-energy x-ray sensor with separation between pixels and active circuitry |
| JP2018197673A (ja) * | 2017-05-23 | 2018-12-13 | 株式会社 システムスクエア | 非破壊検査装置 |
| JP6255527B1 (ja) * | 2017-08-01 | 2017-12-27 | 浜松ホトニクス株式会社 | 固体撮像装置 |
| US20200241150A1 (en) | 2017-10-24 | 2020-07-30 | System Square Inc. | Electromagnetic wave detection module, electromagnetic wave detection module array, and non-destructive inspection apparatus |
| JP6569069B1 (ja) | 2018-03-14 | 2019-09-04 | 株式会社 システムスクエア | 検査装置 |
| US10681289B2 (en) * | 2018-04-25 | 2020-06-09 | L3 Cincinnati Electronics Corporation | Designs and methods of multi-function digital readout integrated circuits with an embedded programmable gate array |
| JP7201481B2 (ja) * | 2019-03-04 | 2023-01-10 | 株式会社日立ハイテクサイエンス | X線検査装置及びx線検査方法 |
| JP7365823B2 (ja) * | 2019-08-23 | 2023-10-20 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、撮像装置、および、固体撮像素子の制御方法 |
| CN114175259B (zh) * | 2019-09-05 | 2025-12-19 | 索尼半导体解决方案公司 | 固态摄像器件和摄像装置 |
| US11933717B2 (en) * | 2019-09-27 | 2024-03-19 | Kla Corporation | Sensitive optical metrology in scanning and static modes |
| KR102335638B1 (ko) | 2019-12-27 | 2021-12-07 | 한국과학기술원 | 리드아웃 회로 및 이를 포함한 이미지센서 |
| WO2021159285A1 (zh) * | 2020-02-12 | 2021-08-19 | 深圳华大智造科技股份有限公司 | 光学成像系统及应用所述光学成像系统的生化物质检测系统 |
| WO2022044808A1 (ja) * | 2020-08-26 | 2022-03-03 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| US12360061B2 (en) * | 2020-09-10 | 2025-07-15 | Beamsense Co., Ltd. | X-ray radioscope |
| US12506987B2 (en) * | 2021-07-01 | 2025-12-23 | Sony Semiconductor Solutions Corporation | Imaging unit and information processing system |
-
2022
- 2022-03-31 EP EP22841749.9A patent/EP4358505B1/de active Active
- 2022-03-31 ES ES22841749T patent/ES3073091T3/es active Active
- 2022-03-31 WO PCT/JP2022/016600 patent/WO2023286401A1/ja not_active Ceased
- 2022-03-31 FI FIEP22841749.9T patent/FI4358505T3/fi active
- 2022-03-31 CN CN202280049252.6A patent/CN117716695A/zh active Pending
- 2022-03-31 KR KR1020247004538A patent/KR20240032111A/ko active Pending
- 2022-03-31 US US18/578,029 patent/US12584867B2/en active Active
- 2022-03-31 JP JP2023520330A patent/JP7311731B2/ja active Active
-
2023
- 2023-07-06 JP JP2023111528A patent/JP2023118936A/ja active Pending
-
2026
- 2026-01-20 US US19/453,033 patent/US20260153452A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FI4358505T3 (fi) | 2026-07-13 |
| EP4358505A4 (de) | 2025-02-26 |
| US12584867B2 (en) | 2026-03-24 |
| JPWO2023286401A1 (de) | 2023-01-19 |
| KR20240032111A (ko) | 2024-03-08 |
| US20240319116A1 (en) | 2024-09-26 |
| JP2023118936A (ja) | 2023-08-25 |
| US20260153452A1 (en) | 2026-06-04 |
| EP4358505A1 (de) | 2024-04-24 |
| CN117716695A (zh) | 2024-03-15 |
| WO2023286401A1 (ja) | 2023-01-19 |
| JP7311731B2 (ja) | 2023-07-19 |
| EP4358505B1 (de) | 2026-05-27 |