ES2777174T3 - Sistema y método para la fabricación aditiva de un objeto - Google Patents
Sistema y método para la fabricación aditiva de un objeto Download PDFInfo
- Publication number
- ES2777174T3 ES2777174T3 ES12723927T ES12723927T ES2777174T3 ES 2777174 T3 ES2777174 T3 ES 2777174T3 ES 12723927 T ES12723927 T ES 12723927T ES 12723927 T ES12723927 T ES 12723927T ES 2777174 T3 ES2777174 T3 ES 2777174T3
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Links
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 239000000654 additive Substances 0.000 title claims abstract description 18
- 230000000996 additive effect Effects 0.000 title claims abstract description 18
- 239000004566 building material Substances 0.000 claims abstract description 71
- 239000000203 mixture Substances 0.000 claims abstract description 40
- 238000005516 engineering process Methods 0.000 claims abstract description 8
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 64
- 239000002904 solvent Substances 0.000 claims description 14
- 230000005855 radiation Effects 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 2
- 239000004035 construction material Substances 0.000 abstract description 12
- 239000000463 material Substances 0.000 description 83
- 238000000151 deposition Methods 0.000 description 23
- 230000008021 deposition Effects 0.000 description 21
- 239000000976 ink Substances 0.000 description 8
- 238000010146 3D printing Methods 0.000 description 7
- 239000004020 conductor Substances 0.000 description 7
- 238000010276 construction Methods 0.000 description 6
- 238000004590 computer program Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
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- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000010100 freeform fabrication Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000012432 intermediate storage Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012800 visualization Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
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- 239000012876 carrier material Substances 0.000 description 1
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- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000004886 head movement Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/165—Processes of additive manufacturing using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
- B29C64/321—Feeding
- B29C64/336—Feeding of two or more materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
- B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
- B29K2995/0005—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Dispersion Chemistry (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201161476275P | 2011-04-17 | 2011-04-17 | |
| PCT/IL2012/050137 WO2012143923A2 (en) | 2011-04-17 | 2012-04-17 | System and method for additive manufacturing of an object |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2777174T3 true ES2777174T3 (es) | 2020-08-04 |
Family
ID=46172830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES12723927T Active ES2777174T3 (es) | 2011-04-17 | 2012-04-17 | Sistema y método para la fabricación aditiva de un objeto |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US9649811B2 (enExample) |
| EP (1) | EP2699406B1 (enExample) |
| JP (3) | JP6000334B2 (enExample) |
| CN (2) | CN103747943B (enExample) |
| ES (1) | ES2777174T3 (enExample) |
| IL (1) | IL228914B (enExample) |
| WO (1) | WO2012143923A2 (enExample) |
Families Citing this family (103)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2699406B1 (en) * | 2011-04-17 | 2020-02-19 | Stratasys Ltd. | System and method for additive manufacturing of an object |
| US9473760B2 (en) * | 2012-08-08 | 2016-10-18 | Makerbot Industries, Llc | Displays for three-dimensional printers |
| US8961167B2 (en) | 2012-12-21 | 2015-02-24 | Stratasys, Inc. | Automated additive manufacturing system for printing three-dimensional parts, printing farm thereof, and method of use thereof |
| US9216544B2 (en) | 2012-12-21 | 2015-12-22 | Stratasys, Inc. | Automated additive manufacturing system for printing three-dimensional parts, printing farm thereof, and method of use thereof |
| US9533451B2 (en) | 2013-03-15 | 2017-01-03 | 3D Systems, Inc. | Direct writing for additive manufacturing systems |
| EP2991818B1 (en) | 2013-05-03 | 2018-07-04 | United Technologies Corporation | Method of eliminating sub-surface porosity |
| US10462907B2 (en) | 2013-06-24 | 2019-10-29 | President And Fellows Of Harvard College | Printed three-dimensional (3D) functional part and method of making |
| JP6145333B2 (ja) * | 2013-06-26 | 2017-06-07 | 矢崎総業株式会社 | 防食部成形方法 |
| DE102013220578A1 (de) * | 2013-10-11 | 2015-04-16 | Arburg Gmbh + Co. Kg | Dreidimensionaler Gegenstand mit selbsttragend hergestellter Wandung |
| TW201522013A (zh) * | 2013-12-12 | 2015-06-16 | 三緯國際立體列印科技股份有限公司 | 立體列印裝置 |
| EP2887011B1 (de) | 2013-12-20 | 2017-02-08 | Hexagon Technology Center GmbH | Koordinatenmessmaschine mit hochpräziser 3D-Druckfunktionalität |
| US9011136B1 (en) * | 2014-02-19 | 2015-04-21 | Massivit 3D Printing Technologies Ltd | Additive manufacturing device |
| CN106538074B (zh) | 2014-03-25 | 2020-03-06 | 斯特拉塔西斯公司 | 用在制造跨层图案的方法及系统 |
| TWI491496B (zh) * | 2014-05-08 | 2015-07-11 | 三緯國際立體列印科技股份有限公司 | 立體列印裝置及其列印校正板與立體列印校正方法 |
| US10052824B2 (en) * | 2014-05-13 | 2018-08-21 | Massachusetts Institute Of Technology | Systems, devices, and methods for three-dimensional printing |
| DE102014007562B4 (de) * | 2014-05-22 | 2017-02-23 | Hendrik John | Verfahren zur Herstellung von dreidimensionalen Formteilen mit integrierter Leiterbildstruktur durch Additive Manufacturing |
| CN104461211B (zh) * | 2014-05-31 | 2017-07-04 | 福州大学 | 一种电阻式触摸屏的3d制造方法 |
| CN104407726B (zh) * | 2014-05-31 | 2017-09-22 | 福州大学 | 一种集成触摸功能显示屏及其制造方法 |
| CN104411122B (zh) * | 2014-05-31 | 2017-10-20 | 福州大学 | 一种多层柔性电路板的3d打印方法 |
| CN104057611B (zh) * | 2014-06-05 | 2016-03-23 | 浙江大学 | 一种基于扫描线倾角优化的3d打印填充路径生成方法 |
| US9833802B2 (en) * | 2014-06-27 | 2017-12-05 | Pulse Finland Oy | Methods and apparatus for conductive element deposition and formation |
| CN106536165B (zh) * | 2014-07-09 | 2020-10-13 | 应用材料公司 | 增材制造中的层状加热、线状加热、等离子体加热及多重馈给材料 |
| EP4194177A1 (en) | 2014-07-13 | 2023-06-14 | Stratasys Ltd. | Method and system for rotational 3d printing |
| US20160052056A1 (en) * | 2014-08-22 | 2016-02-25 | Arcam Ab | Enhanced electron beam generation |
| JP6396723B2 (ja) * | 2014-08-25 | 2018-09-26 | 株式会社ミマキエンジニアリング | 液滴吐出装置及び液滴吐出方法 |
| US9656428B2 (en) * | 2014-09-09 | 2017-05-23 | Disney Enterprises, Inc. | Three dimensional (3D) printed objects with embedded identification (ID) elements |
| US20160092041A1 (en) * | 2014-09-29 | 2016-03-31 | Madesolid, Inc. | System and method to facilitate material selection for a three dimensional printing object |
| WO2016085334A2 (en) * | 2014-11-24 | 2016-06-02 | Additive Industries B.V. | Apparatus for producing an object by means of additive manufacturing |
| EP3227090B1 (en) * | 2014-12-01 | 2019-01-30 | SABIC Global Technologies B.V. | Rapid nozzle cooling for additive manufacturing |
| FR3029838A1 (fr) * | 2014-12-11 | 2016-06-17 | Centre Nat Rech Scient | Procede de fabrication additive d'un objet mecatronique 3d |
| FR3030903B1 (fr) * | 2014-12-18 | 2018-04-20 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d'un dispositif de communication radio frequence |
| US9610733B2 (en) | 2015-01-06 | 2017-04-04 | Stratasys, Inc. | Additive manufacturing with soluble build sheet and part marking |
| JP6625653B2 (ja) * | 2015-02-02 | 2019-12-25 | マッシビット スリーディー プリンティング テクノロジーズ リミテッド | 3d物体プリンティング用の硬化システム |
| CN107428085B (zh) * | 2015-03-06 | 2020-04-17 | 飞利浦照明控股有限公司 | 石墨烯(氧化石墨烯)复合材料的3d打印 |
| WO2016146374A1 (en) * | 2015-03-17 | 2016-09-22 | Philips Lighting Holding B.V. | Making 3d printed shapes with interconnects and embedded components. |
| HK1245727A1 (zh) * | 2015-03-25 | 2018-08-31 | 斯特拉塔西斯公司 | 导电油墨原位烧结的方法和系统 |
| EP3234924A4 (en) * | 2015-04-24 | 2018-12-26 | Hewlett-Packard Development Company, L.P. | Three-dimensional object representation |
| CN105094088A (zh) * | 2015-06-04 | 2015-11-25 | 周建钢 | 一种在流水线上大规模定制个性化产品的方法及设备 |
| CN106273521A (zh) * | 2015-06-05 | 2017-01-04 | 成都金采科技有限公司 | 一种多轴多喷嘴的3d打印机 |
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2017
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2018
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- 2018-05-22 US US15/985,778 patent/US10406752B2/en active Active
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2019
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2022
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|---|---|
| WO2012143923A3 (en) | 2013-03-28 |
| JP6626149B2 (ja) | 2019-12-25 |
| CN103747943A (zh) | 2014-04-23 |
| JP6000334B2 (ja) | 2016-09-28 |
| US10406752B2 (en) | 2019-09-10 |
| JP2016221975A (ja) | 2016-12-28 |
| US20220266523A1 (en) | 2022-08-25 |
| CN108058373B (zh) | 2021-03-16 |
| CN103747943B (zh) | 2017-05-24 |
| US9649811B2 (en) | 2017-05-16 |
| US10016937B2 (en) | 2018-07-10 |
| IL228914B (en) | 2019-05-30 |
| JP6317791B2 (ja) | 2018-04-25 |
| US20190389133A1 (en) | 2019-12-26 |
| HK1252019A1 (zh) | 2019-05-10 |
| IL228914A0 (en) | 2013-12-31 |
| CN108058373A (zh) | 2018-05-22 |
| US20180264734A1 (en) | 2018-09-20 |
| JP2014514193A (ja) | 2014-06-19 |
| WO2012143923A2 (en) | 2012-10-26 |
| US11254057B2 (en) | 2022-02-22 |
| US11872766B2 (en) | 2024-01-16 |
| US20170225390A1 (en) | 2017-08-10 |
| US20140036455A1 (en) | 2014-02-06 |
| EP2699406B1 (en) | 2020-02-19 |
| EP2699406A2 (en) | 2014-02-26 |
| JP2018139292A (ja) | 2018-09-06 |
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