ES270210A1 - Composition and processes relating to electroless plating - Google Patents

Composition and processes relating to electroless plating

Info

Publication number
ES270210A1
ES270210A1 ES0270210A ES270210A ES270210A1 ES 270210 A1 ES270210 A1 ES 270210A1 ES 0270210 A ES0270210 A ES 0270210A ES 270210 A ES270210 A ES 270210A ES 270210 A1 ES270210 A1 ES 270210A1
Authority
ES
Spain
Prior art keywords
sodium
chlorides
electroless plating
solution
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0270210A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of ES270210A1 publication Critical patent/ES270210A1/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Cosmetics (AREA)

Abstract

An aqueous acidic solution for sensitizing surfaces prior to currentless deposition of copper comprises 0.01-5.0 grams per litre of precious metal ions (i.e. Os Ir Pt Pd Au or Rh) and a stoichrometric excess of Sn(ous) ions. The salts may be chlorides, bromides, fluorides, fluobarates, iodides, nitrates, sulphates or acetates, the use of chlorides being preferable. They are dissolved in an aqueous solution of HCl, HF, HBF4, HI, H2SO4 or CU3COOH which may have a concentration of 0.001N-15N. The bases treated may be Cu, Co, Ag, Au, steel, brass, sterling silver, or plastics, and the use of the solution in the manufacture of printed circuits is described when a further copper coating may be applied by electroplating or electroless plating. The use of an alkaline cleaner comprising: sodium isopropyl naphthalene sulphonate 3 g.p.l., sodium sulphate 1 g.p.l., sodium tripolyphosphate 14 g.p.l., sodium metasilicate 5 g.p.l., and tetra sodium pyrophosphate 27 g.p.l., and ammonium persulphate and cupric chloride etchant solutions is also described. Specifications 494,559, 674,630, and U.S.A. Specification 2,908,557 are referred to.
ES0270210A 1960-09-01 1961-09-01 Composition and processes relating to electroless plating Expired ES270210A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5335260A 1960-09-01 1960-09-01

Publications (1)

Publication Number Publication Date
ES270210A1 true ES270210A1 (en) 1962-03-16

Family

ID=21983612

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0270210A Expired ES270210A1 (en) 1960-09-01 1961-09-01 Composition and processes relating to electroless plating

Country Status (5)

Country Link
AT (1) AT249468B (en)
CH (1) CH453842A (en)
DE (1) DE1446224B2 (en)
ES (1) ES270210A1 (en)
GB (1) GB942850A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3682671A (en) * 1970-02-05 1972-08-08 Kollmorgen Corp Novel precious metal sensitizing solutions
ZA774561B (en) * 1976-09-20 1978-06-28 Kollmorgen Tech Corp Preparation of solid precious metal sensitizing compositions
DE3843903C1 (en) * 1988-12-24 1990-06-28 Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De Activation solution for electrically non-conductive plastic substrate surfaces and process for the preparation thereof and the use thereof
CN103908963B (en) * 2013-01-04 2016-01-20 吉林师范大学 The preparation method of the Graphene-Au, Pt, Pd compound of high catalytic activity electronation

Also Published As

Publication number Publication date
DE1446224A1 (en) 1969-01-30
DE1446224B2 (en) 1971-09-16
CH453842A (en) 1968-03-31
AT249468B (en) 1966-09-26
GB942850A (en) 1963-11-27

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