CN109853011A - A kind of silver plating process - Google Patents
A kind of silver plating process Download PDFInfo
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- CN109853011A CN109853011A CN201910284375.8A CN201910284375A CN109853011A CN 109853011 A CN109853011 A CN 109853011A CN 201910284375 A CN201910284375 A CN 201910284375A CN 109853011 A CN109853011 A CN 109853011A
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- silver
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Abstract
The invention discloses a kind of silver plating process, include the following steps: (1) ultrasonic degreasing；(2) electrolytic degreasing；(3) it washes；(4) microetch；(5) pickling；(6) it washes；(7) nickel plating；(8) high temperature nickel plating；(9) it washes；(10) pre- silver-plated；(11) silver-plated；(12) it washes；(13) hot water wash；(14) sealing of hole；(15) it dries.A kind of silver plating process of the invention, simple process operation, the period is short, high-efficient, and finished product light is wear-resisting, corrosion resistance and anti-discoloration ability are all relatively strong, and obtained thickness of coating is evenly distributed, compactness is high, binding force is good.
Description
Technical field
The present invention relates to a kind of electroplating technologies, and in particular to a kind of silver plating process of connector.
Background technique
Silver is argenteous metal, and atomic weight 108, density 10.5, silver-colored electrochemical equivalent is 4.025g/A.h, silver-colored
Standard electrode potential is 0.81V, and silvering has good electric conductivity and solderability, is easily polished, and has very high chemistry steady
It is qualitative.
Currently, silver plating process is mainly used on electrical connector, especially in recent years with the development of electronic technology, aluminium because
The advantages that its is cheap, light-weight, easy to process is widely used in electronic field at present, therefore, silver-plated skill on aluminium
Art is particularly important.
The most common silver plating process of electrical contact is that electrosilvering is asked by the way of cyanide bath rack plating there are following at present
Topic:
(1) rack plating is suitable for Single unit job lot production, and production efficiency is low；
(2) it is limited by technique and treatment before plating, binding force of cladding material is unreliable, causes coating to fall off in friction process；
(3) process of electrosilvering is carried out in the electroplate liquid of cyanide, and cyanide has severe toxicity, easily causes to hurt to the person
It does harm to and pollutes the environment.
Summary of the invention
Goal of the invention: the present invention aiming at the shortcomings in the prior art, proposes a kind of silver plating process, simple process operation, week
Phase is short, high-efficient, and finished product light is wear-resisting, corrosion resistance and anti-discoloration ability are all relatively strong, and obtained thickness of coating be evenly distributed,
Compactness is high, binding force is good.
Technical solution: a kind of silver plating process of the present invention includes the following steps:
(1) ultrasonic degreasing；(2) electrolytic degreasing；(3) it washes；(4) microetch；(5) pickling；(6) it washes；(7) nickel plating；(8)
High temperature nickel plating；(9) it washes；(10) pre- silver-plated；(11) silver-plated；(12) it washes；(13) hot water wash；(14) sealing of hole；(15) it dries.
Further, the electric current of ultrasonic degreasing is greater than 0.2A in step (1), and temperature is 55-65 DEG C, degreasing chemical concentration
For 40-60g/L.
Further, the electric current of electrolytic degreasing is 25-35A in step (2), and temperature is 55-65 DEG C, and degreasing chemical concentration is
40-60g/L。
Further, micro-etching agent dosage is 60-180g/L, sulfuric acid concentration 1-3%, Cu2+ in step (4) microetching step: <
15g/L。
Further, electric current 10-20A in step (7) nickel plating and step (8) high temperature nickel plating, 55-65 DEG C of temperature；Material is dense
Degree selection: Ni2+:110-150g/L；Nickel oxide: 5-15G/L；Boric acid: 35-50G/L.
Further, the pre- silver-plated middle material concentration selection of step (10): KCN:1.8-3g/l dissociates silver cyanide: 75-
112.5G/L；Electric current 1-3A.
Further, the silver-plated middle material concentration selection of step (11): KCN:41-49g/l dissociates silver cyanide: 101-135G/
L；25-35 DEG C of temperature；Electric current 2-4A.
Further, step (13) hot water wash electric current be greater than 0.5A, 40-60 DEG C of temperature.
Further, 80-120 DEG C of drying temperature of step (15).
The utility model has the advantages that a kind of silver plating process of the invention, simple process operation, the period is short, high-efficient, and finished product light is resistance to
Mill, corrosion resistance and anti-discoloration ability are all relatively strong, and obtained thickness of coating is evenly distributed, compactness is high, binding force is good.
Specific embodiment
The present invention is further explained in the light of specific embodiments:
Embodiment 1
A kind of silver plating process, includes the following steps:
(1) ultrasonic degreasing: carrying out in ultrasonic degreasing slot, and electric current is greater than 0.2A, and temperature is 55 DEG C, and degreasing liquid medicine is dense
Degree is 40g/L；
(2) it electrolytic degreasing: is carried out in solution degreasing bath, electric current 25A, temperature is 55 DEG C, and degreasing chemical concentration is
40g/L；
(3) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(4) microetch: carrying out in microetch slot, and micro-etching agent dosage is 60g/L, sulfuric acid concentration 1%, Cu2+ < 15g/L；
(5) pickling: carrying out in activated bath, concentration 10BE0；
(6) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(7) nickel plating: carrying out in nickel bath, electric current 10A, and 55 DEG C of temperature；Material concentration selection: Ni2+:110g/L；Oxidation
Nickel: 5G/L；Boric acid: 35G/L；
(8) high temperature nickel plating carries out in nickel bath, electric current 10A, and 55 DEG C of temperature；Material concentration selection: Ni2+:110g/L；
Nickel oxide: 5G/L；Boric acid: 35G/L；
(9) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(10) pre- silver-plated: to be carried out in silver-plating bath, material concentration selection: KCN:1.8g/l dissociates silver cyanide: 75G/L；Electricity
Flow 1A；
(11) silver-plated: to be carried out in silver-plating bath, material concentration selection: KCN:41g/l dissociates silver cyanide: 101G/L；Temperature
25℃；Electric current 2A；
(12) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(13) hot water wash: carrying out in hot water washing groove, electric current be greater than 0.5A, 40 DEG C of temperature；
(14) it sealing of hole: is carried out in epithelium treatment trough, temperature 45 C；
(15) it dries: being carried out in drying box, drying temperature is 80 DEG C.
Embodiment 2
A kind of silver plating process, includes the following steps:
(1) ultrasonic degreasing: carrying out in ultrasonic degreasing slot, and electric current is greater than 0.2A, and temperature is 65 DEG C, and degreasing liquid medicine is dense
Degree is 60g/L；
(2) it electrolytic degreasing: is carried out in solution degreasing bath, electric current 35A, temperature is 65 DEG C, and degreasing chemical concentration is
60g/L；
(3) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(4) microetch: carrying out in microetch slot, and micro-etching agent dosage is 180g/L, sulfuric acid concentration 3%, Cu2+ < 15g/L；
(5) pickling: carrying out in activated bath, concentration 20BE0；
(6) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；；
(7) nickel plating: carrying out in nickel bath, electric current 20A, and 65 DEG C of temperature；Material concentration selection: Ni2+150g/L；Oxidation
Nickel 15G/L；Boric acid 50G/L；
(8) high temperature nickel plating carries out in nickel bath, electric current 20A, and 65 DEG C of temperature；Material concentration selection: Ni2+150g/L；Oxygen
Change nickel 15G/L；Boric acid 50G/L；
(9) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(10) pre- silver-plated: to be carried out in silver-plating bath, material concentration selection: KCN:3g/l dissociates silver cyanide: 112.5G/L；Electricity
Flow 3A；
(11) silver-plated: to be carried out in silver-plating bath, material concentration selection: KCN:49g/l dissociates silver cyanide: 135G/L；Temperature
35℃；Electric current 4A；
(12) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(13) hot water wash: carrying out in hot water washing groove, electric current be greater than 0.5A, 40 DEG C of temperature；
(14) sealing of hole: carrying out in epithelium treatment trough, and 45-55 DEG C of temperature；
(15) it dries: being carried out in drying box, drying temperature is 80-120 DEG C.
Embodiment 3
A kind of silver plating process, includes the following steps:
(1) ultrasonic degreasing: carrying out in ultrasonic degreasing slot, and electric current is greater than 0.2A, and temperature is 60 DEG C, and degreasing liquid medicine is dense
Degree is 50g/L；
(2) it electrolytic degreasing: is carried out in solution degreasing bath, electric current 30A, temperature is 60 DEG C, and degreasing chemical concentration is
50g/L；
(3) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(4) microetch: carrying out in microetch slot, and micro-etching agent dosage is 120g/L, sulfuric acid concentration 2%, Cu2+ < 15g/L；
(5) pickling: carrying out in activated bath, concentration 15BE0；
(6) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；；
(7) nickel plating: carrying out in nickel bath, electric current 15A, temperature 60 C；Material concentration selection: Ni2+:130g/L；Oxidation
Nickel: 10G/L；Boric acid: 45G/L；
(8) high temperature nickel plating carries out in nickel bath, electric current 15A, temperature 60 C；Material concentration selection: Ni2+:130g/L；
Nickel oxide: 10G/L；Boric acid: 45G/L；
(9) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(10) pre- silver-plated: to be carried out in silver-plating bath, material concentration selection: KCN:2.4g/l dissociates silver cyanide: 88G/L；Electricity
Flow 2A；
(11) silver-plated: to be carried out in silver-plating bath, material concentration selection: KCN:45g/l dissociates silver cyanide: 128G/L；Temperature
30℃；Electric current 3A；
(12) it washes: being carried out in rinsing bowl, using water knife cleaning way, air knife mouth is directed at material strip from top to bottom；
(13) hot water wash: carrying out in hot water washing groove, electric current be greater than 0.5A, 40 DEG C of temperature；
(14) sealing of hole: carrying out in epithelium treatment trough, and 45-55 DEG C of temperature；
(15) it dries: being carried out in drying box, drying temperature is 80-120 DEG C.
A kind of silver plating process of the invention, simple process operation, the period is short, high-efficient, and finished product light is wear-resisting, corrosion resistance
It is all relatively strong with anti-discoloration ability, and obtained thickness of coating is evenly distributed, compactness is high, binding force is good.
The above described is only a preferred embodiment of the present invention, be not intended to limit the present invention in any form, though
So the present invention has been disclosed as a preferred embodiment, and however, it is not intended to limit the invention, any technology people for being familiar with this profession
Member, without departing from the scope of the present invention, when the technology contents using the disclosure above make a little change or modification
For the equivalent embodiment of equivalent variations, but anything that does not depart from the technical scheme of the invention content, according to the technical essence of the invention
Any simple modification, equivalent change and modification to the above embodiments, all of which are still within the scope of the technical scheme of the invention.
Claims (9)
1. a kind of silver plating process, characterized by the following steps:
(1) ultrasonic degreasing；(2) electrolytic degreasing；(3) it washes；(4) microetch；(5) pickling；(6) it washes；(7) nickel plating；(8) high temperature
Nickel plating；(9) it washes；(10) pre- silver-plated；(11) silver-plated；(12) it washes；(13) hot water wash；(14) sealing of hole；(15) it dries.
2. a kind of silver plating process according to claim 1, it is characterised in that: the electric current of ultrasonic degreasing is big in step (1)
In 0.2A, temperature is 55-65 DEG C, and degreasing chemical concentration is 40-60g/L.
3. a kind of silver plating process according to claim 1, it is characterised in that: the electric current of electrolytic degreasing is 25- in step (2)
35A, temperature are 55-65 DEG C, and degreasing chemical concentration is 40-60g/L.
4. a kind of silver plating process according to claim 1, it is characterised in that: micro-etching agent dosage in step (4) microetching step
For 60-180g/L, sulfuric acid concentration 1-3%, Cu2+: < 15g/L.
5. a kind of silver plating process according to claim 1, it is characterised in that: step (7) nickel plating and step (8) high temperature nickel plating
Middle electric current 10-20A, 55-65 DEG C of temperature；Material concentration selection: Ni2+:110-150g/L；Nickel oxide: 5-15G/L；Boric acid: 35-
50G/L。
6. a kind of silver plating process according to claim 1, it is characterised in that: the pre- silver-plated middle material concentration choosing of step (10)
It selects: KCN:1.8-3g/l to dissociate silver cyanide: 75-112.5G/L；Electric current 1-3A.
7. a kind of silver plating process according to claim 1, it is characterised in that: the silver-plated middle material concentration selection of step (11):
KCN:41-49g/l dissociates silver cyanide: 101-135G/L；25-35 DEG C of temperature；Electric current 2-4A.
8. a kind of silver plating process according to claim 1, it is characterised in that: step (13) hot water wash electric current is greater than 0.5A,
40-60 DEG C of temperature.
9. a kind of silver plating process according to claim 1, it is characterised in that: 80-120 DEG C of drying temperature of step (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910284375.8A CN109853011A (en) | 2019-04-09 | 2019-04-09 | A kind of silver plating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910284375.8A CN109853011A (en) | 2019-04-09 | 2019-04-09 | A kind of silver plating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109853011A true CN109853011A (en) | 2019-06-07 |
Family
ID=66903553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910284375.8A Pending CN109853011A (en) | 2019-04-09 | 2019-04-09 | A kind of silver plating process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111118481A (en) * | 2020-01-15 | 2020-05-08 | 中思缘环保科技有限公司 | Full-automatic silver plating equipment and method |
| CN114318449A (en) * | 2020-10-12 | 2022-04-12 | 江苏澳光电子有限公司 | Innovative process for plating thin gold on silver |
-
2019
- 2019-04-09 CN CN201910284375.8A patent/CN109853011A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111118481A (en) * | 2020-01-15 | 2020-05-08 | 中思缘环保科技有限公司 | Full-automatic silver plating equipment and method |
| CN114318449A (en) * | 2020-10-12 | 2022-04-12 | 江苏澳光电子有限公司 | Innovative process for plating thin gold on silver |
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Application publication date: 20190607 |