ES2586148T3 - Sistema de suministro de haz flexible para sistemas láser de alta potencia - Google Patents

Sistema de suministro de haz flexible para sistemas láser de alta potencia Download PDF

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Publication number
ES2586148T3
ES2586148T3 ES11769234.3T ES11769234T ES2586148T3 ES 2586148 T3 ES2586148 T3 ES 2586148T3 ES 11769234 T ES11769234 T ES 11769234T ES 2586148 T3 ES2586148 T3 ES 2586148T3
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ES
Spain
Prior art keywords
laser
polarization
laser energy
impact
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES11769234.3T
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English (en)
Spanish (es)
Inventor
Brent C. Dane
Edward W. H. Lao
Fritz B. Harris
Randall L. Hurd
Jon E. Rankin
Scott N. Fochs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metal Improvement Co LLC
Original Assignee
Metal Improvement Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Metal Improvement Co LLC filed Critical Metal Improvement Co LLC
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Publication of ES2586148T3 publication Critical patent/ES2586148T3/es
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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/10—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void
    • G01J1/20—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle
    • G01J1/22—Photometry, e.g. photographic exposure meter by comparison with reference light or electric value provisionally void intensity of the measured or reference value being varied to equalise their effects at the detectors, e.g. by varying incidence angle using a variable element in the light-path, e.g. filter, polarising means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B23K26/043—Automatically aligning the laser beam along the beam path, i.e. alignment of laser beam axis relative to laser beam apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details
    • G01J1/04—Optical or mechanical part supplementary adjustable parts
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses
    • G02B27/0966—Cylindrical lenses

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Microscoopes, Condenser (AREA)
ES11769234.3T 2010-04-16 2011-03-03 Sistema de suministro de haz flexible para sistemas láser de alta potencia Active ES2586148T3 (es)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34257810P 2010-04-16 2010-04-16
US342578P 2010-04-16
US945713 2010-11-12
US12/945,713 US10072971B2 (en) 2010-04-16 2010-11-12 Flexible beam delivery system for high power laser systems
PCT/US2011/026949 WO2011129921A2 (en) 2010-04-16 2011-03-03 Flexible beam delivery system for high power laser systems

Publications (1)

Publication Number Publication Date
ES2586148T3 true ES2586148T3 (es) 2016-10-11

Family

ID=44787438

Family Applications (1)

Application Number Title Priority Date Filing Date
ES11769234.3T Active ES2586148T3 (es) 2010-04-16 2011-03-03 Sistema de suministro de haz flexible para sistemas láser de alta potencia

Country Status (7)

Country Link
US (2) US10072971B2 (https=)
EP (1) EP2558242B1 (https=)
JP (1) JP6046033B2 (https=)
CA (1) CA2795993C (https=)
ES (1) ES2586148T3 (https=)
SG (1) SG184894A1 (https=)
WO (2) WO2011129921A2 (https=)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012199359A (ja) * 2011-03-22 2012-10-18 Sony Corp レーザー照射装置および微小粒子測定装置
DK2564973T3 (en) * 2011-09-05 2015-01-12 Alltec Angewandte Laserlicht Technologie Ges Mit Beschränkter Haftung Marking apparatus having a plurality of lasers and a kombineringsafbøjningsindretning
DK2565994T3 (en) 2011-09-05 2014-03-10 Alltec Angewandte Laserlicht Technologie Gmbh Laser device and method for marking an object
ES2438751T3 (es) 2011-09-05 2014-01-20 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Dispositivo y procedimiento para marcar un objeto por medio de un rayo láser
ES2544269T3 (es) * 2011-09-05 2015-08-28 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres de gas con tubos de resonancia y medios de deflexión ajustables individualmente
DK2565996T3 (da) 2011-09-05 2014-01-13 Alltec Angewandte Laserlicht Technologie Gmbh Laserindretning med en laserenhed og en fluidbeholder til en køleindretning af laserenheden
ES2530070T3 (es) * 2011-09-05 2015-02-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Aparato de marcado con una pluralidad de láseres y conjuntos ajustables individualmente de medios de desviación
EP2564976B1 (en) 2011-09-05 2015-06-10 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with at least one gas laser and heat dissipator
EP2564972B1 (en) * 2011-09-05 2015-08-26 ALLTEC Angewandte Laserlicht Technologie Gesellschaft mit beschränkter Haftung Marking apparatus with a plurality of lasers, deflection means and telescopic means for each laser beam
WO2013170090A1 (en) * 2012-05-11 2013-11-14 California Institute Of Technology Control imaging methods in advanced ultrafast electron microscopy
JP6159513B2 (ja) * 2012-09-04 2017-07-05 株式会社アマダホールディングス レーザ加工ヘッド
US9445946B2 (en) 2012-11-02 2016-09-20 Optimedica Corporation Laser eye surgery system
CN103063411A (zh) * 2012-12-13 2013-04-24 华中科技大学 一种高功率线偏振激光光束性能的测量装置
CN103203543B (zh) * 2013-02-04 2015-03-11 中国航空工业集团公司北京航空制造工程研究所 一种用于激光冲击强化叶片的水约束层的喷射方法和装置
WO2014144506A1 (en) * 2013-03-15 2014-09-18 Abbott Cardiovascular Systems Inc. Laser cutting process monitoring and control
CN103468925B (zh) * 2013-08-29 2014-11-05 温州大学 一种飞机叶片榫槽底部平面激光冲击强化方法和装置
WO2015185152A1 (de) * 2014-06-06 2015-12-10 Trumpf Lasersystems For Semiconductor Manufacturing Gmbh Vorrichtung und verfahren zur überwachung eines laserstrahls
KR101962046B1 (ko) * 2014-07-03 2019-03-25 신닛테츠스미킨 카부시키카이샤 레이저 가공 장치
RU2563908C1 (ru) * 2014-07-21 2015-09-27 Общество с ограниченной ответственностью "НАУЧНО-ТЕХНИЧЕСКИЕ ОБЪЕДИНЕНИЕ "ИРЭ-Полюс" (ООО НТО "ИРЭ-Полюс") Способ распределения лазерного излучения и многолучевая лазерная система для его осуществления
JP2016033484A (ja) * 2014-07-31 2016-03-10 横河電機株式会社 参照光分岐用光学系
US9878398B2 (en) * 2014-11-13 2018-01-30 Lsp Technologies, Inc. Automated dynamic laser peening system
US11858065B2 (en) 2015-01-09 2024-01-02 Lsp Technologies, Inc. Method and system for use in laser shock peening and laser bond inspection process
CA2973382A1 (en) * 2015-01-09 2016-07-14 Lsp Technologies, Inc. Method and apparatus for use in laser shock peening processes
WO2016154239A1 (en) * 2015-03-26 2016-09-29 Dana Automotive Systems Group, Llc Laser welding of balance weights to driveshafts
US10596661B2 (en) * 2015-09-28 2020-03-24 Ecole Polytechnique Federale De Lausanne (Epfl) Method and device for implementing laser shock peening or warm laser shock peening during selective laser melting
WO2018071979A1 (en) * 2016-10-20 2018-04-26 Spookfish Innovations Pty Ltd An aerial camera boresight calibration system
US20180178322A1 (en) * 2016-12-28 2018-06-28 Metal Industries Research & Development Centre Laser processing device and laser processing method
JP6496340B2 (ja) * 2017-03-17 2019-04-03 ファナック株式会社 スキャナ制御装置、ロボット制御装置及びリモートレーザ溶接ロボットシステム
US10241036B2 (en) * 2017-05-08 2019-03-26 Siemens Energy, Inc. Laser thermography
JP6595558B2 (ja) * 2017-10-30 2019-10-23 ファナック株式会社 レーザ加工システム
WO2019162464A1 (en) * 2018-02-23 2019-08-29 Avonisys Ag A method of machining a bore extending from an outer wall of a workpiece with liquid-jet guided laser beam
US11215814B2 (en) 2018-08-24 2022-01-04 Amo Development, Llc Detection of optical surface of patient interface for ophthalmic laser applications using a non-confocal configuration
US11707805B2 (en) 2018-12-14 2023-07-25 Raytheon Technologies Corporation System and method for laser drilling of shaped cooling holes
DE102019102512A1 (de) * 2019-01-31 2020-08-06 Trumpf Laser- Und Systemtechnik Gmbh Lasersystem
CN109870823B (zh) * 2019-04-03 2020-12-15 中国科学院理化技术研究所 一种偏振光强整形装置
CN110923701A (zh) * 2019-12-05 2020-03-27 西安必盛激光科技有限公司 一种深盲孔内壁激光熔覆装置
JP7308355B2 (ja) * 2020-04-07 2023-07-13 株式会社アマダウエルドテック レーザ加工モニタ装置、レーザ加工モニタ方法、およびレーザ加工装置
KR20210131510A (ko) * 2020-04-23 2021-11-03 삼성디스플레이 주식회사 라인 빔 형성 장치
US12121218B2 (en) * 2020-05-11 2024-10-22 Welch Allyn, Inc. Configuring optical light path having beam overlap on image sensor
US12030735B2 (en) * 2020-10-30 2024-07-09 Delta Industrial Services, Inc. Adjustable field of view laser system for web processing
JP7604298B2 (ja) * 2021-03-24 2024-12-23 株式会社ディスコ レーザー加工装置
JP7789508B2 (ja) * 2021-08-19 2025-12-22 株式会社ディスコ パルス幅計測治具
US20230065240A1 (en) * 2021-08-25 2023-03-02 The United States of America As Represented By The Director Of The National Geospatial-Intelligence Method and apparatus for the display of volumetric solids using distributed photochromic compounds
CN119643032B (zh) * 2025-02-18 2025-04-15 深圳东仪精工设备有限公司 玻璃内应力性能测试方法、装置、介质及应力检测仪

Family Cites Families (81)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3586424A (en) * 1968-09-13 1971-06-22 American Optical Corp Monocular indirect ophthalmoscope
US3724930A (en) 1972-07-21 1973-04-03 Us Air Force Method of forming and cooling pinhole spatial filter for high power laser
US3841760A (en) * 1973-02-27 1974-10-15 D Guyton Zonal focus method for determining the amount of astigmatic correction for an optical system
JPS6025133B2 (ja) 1976-04-28 1985-06-17 旭光学工業株式会社 マニピユレタ−
US4191928A (en) 1978-01-11 1980-03-04 The United States Of America As Represented By The United States Department Of Energy Laser system using regenerative amplifier
US4208129A (en) * 1978-06-30 1980-06-17 The United States Of America As Represented By The Secretary Of The Air Force Sensitive laser spectroscopy measurement system
US4426155A (en) * 1981-10-08 1984-01-17 Monchalin Jean Pierre Method and apparatus for the interferometric wavelength measurement of frequency tunable C.W. lasers
US4401477A (en) 1982-05-17 1983-08-30 Battelle Development Corporation Laser shock processing
US4656433A (en) 1982-08-19 1987-04-07 Hughes Aircraft Company Laser amplifier buffer
US4539462A (en) 1983-01-24 1985-09-03 Westinghouse Electric Corp. Robotic laser beam delivery apparatus
US4623229A (en) 1983-09-29 1986-11-18 Photon Sources, Inc. Articulated laser arm
US4698479A (en) 1984-02-06 1987-10-06 Spectra-Physics, Inc. Beam delivery system for a CO2 laser
GB8420861D0 (en) 1984-08-16 1984-09-19 Atomic Energy Authority Uk Laser control system
US4621924A (en) 1984-12-17 1986-11-11 Lockheed Missiles & Space Company, Inc. Optical alignment apparatus
US4632553A (en) * 1985-02-25 1986-12-30 Nicolet Instrument Corporation Silicon beamsplitter
US4794222A (en) 1986-06-30 1988-12-27 Manabu Funayama Laser beam machining apparatus
US4908493A (en) 1988-05-31 1990-03-13 Midwest Research Institute Method and apparatus for optimizing the efficiency and quality of laser material processing
GB8813315D0 (en) 1988-06-06 1988-07-13 Serrano J P Beam delivery system
JPH02108489A (ja) 1988-10-17 1990-04-20 Fanuc Ltd 多関節型レーザロボットの手首機構
US4936649A (en) * 1989-01-25 1990-06-26 Lymer John D Damage evaluation system and method using optical fibers
US4937421A (en) 1989-07-03 1990-06-26 General Electric Company Laser peening system and method
US5022033A (en) 1989-10-30 1991-06-04 The United States Of America As Represented By The United States Department Of Energy Ring laser having an output at a single frequency
EP0510124B1 (en) 1990-01-11 1995-06-28 Battelle Memorial Institute Improving material properties
US5075893A (en) 1990-12-07 1991-12-24 Battelle Memorial Institute Unpolarized laser oscillators
US5142118A (en) 1991-05-14 1992-08-25 Progressive Tool & Industries Co. Laser welding unit
DE4129278A1 (de) 1991-09-03 1993-03-11 Weidmueller Interface Werkzeugkopf mit automatisch verstellbarer fokussierungsoptik
US5239408A (en) 1992-01-21 1993-08-24 Regents Of The University Of California High power, high beam quality regenerative amplifier
US5329350A (en) * 1992-05-21 1994-07-12 Photon, Inc. Measuring laser beam parameters using non-distorting attenuation and multiple simultaneous samples
US5382770A (en) 1993-01-14 1995-01-17 Reliant Laser Corporation Mirror-based laser-processing system with visual tracking and position control of a moving laser spot
JP2809959B2 (ja) * 1993-01-29 1998-10-15 株式会社ニデック レ−ザビ−ムによるアブレーション装置およびその方法
US5384803A (en) 1993-02-22 1995-01-24 Lai; Shui T. Laser wave mixing and harmonic generation of laser beams
US5449879A (en) 1993-10-07 1995-09-12 Laser Machining, Inc. Laser beam delivery system for heat treating work surfaces
DE69431314T2 (de) 1993-12-07 2003-01-23 Toyota Jidosha K.K., Toyota Laser-Schock-Behandlungsverfahren unter Verwendung eines lichtabsorbierenden Filmmaterials
JP3373638B2 (ja) 1994-03-09 2003-02-04 株式会社東芝 レーザーピーニング方法
US6215097B1 (en) 1994-12-22 2001-04-10 General Electric Company On the fly laser shock peening
JP3141715B2 (ja) 1994-12-22 2001-03-05 松下電器産業株式会社 レーザ加工方法
US5569018A (en) 1995-03-06 1996-10-29 General Electric Company Technique to prevent or divert cracks
US5525429A (en) 1995-03-06 1996-06-11 General Electric Company Laser shock peening surface enhancement for gas turbine engine high strength rotor alloy repair
FR2735056B1 (fr) 1995-06-09 1997-08-22 Bouygues Offshore Installation pour travailler une zone d'un tube au moyen d'un faisceau laser et application aux tubes d'une canalisation sur une barge de pose en mer ou de recuperation de cette canalisation.
US5689363A (en) 1995-06-12 1997-11-18 The Regents Of The University Of California Long-pulse-width narrow-bandwidth solid state laser
US5741559A (en) 1995-10-23 1998-04-21 Lsp Technologies, Inc. Laser peening process and apparatus
US5674328A (en) 1996-04-26 1997-10-07 General Electric Company Dry tape covered laser shock peening
US5674329A (en) 1996-04-26 1997-10-07 General Electric Company Adhesive tape covered laser shock peening
JPH09314361A (ja) * 1996-05-24 1997-12-09 Amada Co Ltd レーザーによる表面焼入れ方法
JP3380416B2 (ja) 1997-02-05 2003-02-24 本田技研工業株式会社 レーザ溶接装置
US5986234A (en) 1997-03-28 1999-11-16 The Regents Of The University Of California High removal rate laser-based coating removal system
DE69706827T2 (de) * 1997-05-02 2002-03-28 Agilent Technologies Inc., A Delaware Corp. Wellenlängenmessgerät und eine Einrichtung zur Regelung der Wellenlänge einer Lichtquelle
DE19743493C2 (de) * 1997-10-01 2001-02-22 Mueller Wirts Thomas Verfahren und Vorrichtung zur Laserfrequenzmessung und -Stabilisierung
US6064035A (en) 1997-12-30 2000-05-16 Lsp Technologies, Inc. Process chamber for laser peening
US6409718B1 (en) * 1998-02-03 2002-06-25 Lasersight Technologies, Inc. Device and method for correcting astigmatism by laser ablation
US6198069B1 (en) 1998-08-13 2001-03-06 The Regents Of The University Of California Laser beam temporal and spatial tailoring for laser shock processing
JP2000117480A (ja) 1998-10-15 2000-04-25 Fanuc Ltd レーザ加工機
US6259055B1 (en) 1998-10-26 2001-07-10 Lsp Technologies, Inc. Apodizers for laser peening systems
US6288358B1 (en) 1998-12-15 2001-09-11 Lsp Technologies, Inc. Mobile laser peening system
US6392192B1 (en) 1999-09-15 2002-05-21 W. A. Whitney Co. Real time control of laser beam characteristics in a laser-equipped machine tool
US6410884B1 (en) 1999-07-19 2002-06-25 The Regents Of The University Of California Contour forming of metals by laser peening
KR100348883B1 (ko) * 1999-09-03 2002-08-17 엘지전자주식회사 비점수차 방지 광픽업 장치
JP3288671B2 (ja) * 2000-02-17 2002-06-04 科学技術振興事業団 試料の物理的性質の測定装置
JP2002038222A (ja) * 2000-07-27 2002-02-06 Toshiba Corp 残留応力改善方法
JP3383832B2 (ja) 2000-12-25 2003-03-10 川崎重工業株式会社 レーザ照射装置
US6657160B2 (en) 2001-01-25 2003-12-02 The Regents Of The University Of California Laser peening of components of thin cross-section
US6867390B2 (en) 2001-04-30 2005-03-15 Lsp Technologies, Inc Automated positioning of mobile laser peening head
US6528763B1 (en) 2001-04-30 2003-03-04 Lsp Technologies, Inc. Laser search peening for exfoliation corrosion detection
EP1207417B1 (en) * 2001-05-22 2004-08-04 Agilent Technologies, Inc. (a Delaware corporation) Polarization-corrected optical measuring unit
US7095497B2 (en) * 2001-06-27 2006-08-22 Canon Kabushiki Kaisha Beam splitting apparatus, transmittance measurement apparatus, and exposure apparatus
DE10255037A1 (de) * 2002-11-26 2004-06-09 Kuka Roboter Gmbh Verfahren und Vorrichtung zum Bearbeiten eines Werkstücks
US7880117B2 (en) * 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
JP4494045B2 (ja) * 2003-03-11 2010-06-30 株式会社半導体エネルギー研究所 ビームホモジナイザ及びレーザ照射装置、並びに半導体装置の作製方法
JP2005028438A (ja) 2003-07-11 2005-02-03 Disco Abrasive Syst Ltd レーザ光線を利用する加工装置
US7109436B2 (en) 2003-08-29 2006-09-19 General Electric Company Laser shock peening target
US7521651B2 (en) 2003-09-12 2009-04-21 Orbotech Ltd Multiple beam micro-machining system and method
US7435927B2 (en) * 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7851725B2 (en) 2004-11-17 2010-12-14 Metal Improvement Company Llc Active beam delivery system with image relay
US7750266B2 (en) * 2004-11-17 2010-07-06 Metal Improvement Company Llc Active beam delivery system for laser peening and laser peening method
US7718921B2 (en) 2004-11-17 2010-05-18 Metal Improvement Company Llc Active beam delivery system with variable optical path segment through air
JP4988160B2 (ja) * 2005-02-08 2012-08-01 日産自動車株式会社 レーザ溶接装置、レーザ溶接システム、およびレーザ溶接方法
FR2889669B1 (fr) * 2005-08-12 2007-11-02 Snecma Piece metallique traitee par mise en compression de sous couches. procede pour obtenir une telle piece.
US7626152B2 (en) 2006-08-16 2009-12-01 Raytheon Company Beam director and control system for a high energy laser within a conformal window
US20080110869A1 (en) 2006-11-15 2008-05-15 Button International Co., Ltd. Method of machining mold surface using laser
JP5159516B2 (ja) * 2008-08-27 2013-03-06 株式会社東芝 レーザ照射装置
JP5221254B2 (ja) * 2008-08-28 2013-06-26 株式会社ディスコ レーザー加工装置

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US10072971B2 (en) 2018-09-11
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US20110253690A1 (en) 2011-10-20
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US20110255088A1 (en) 2011-10-20
EP2558242B1 (en) 2016-05-11
CA2795993C (en) 2017-05-30
US8810792B2 (en) 2014-08-19
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WO2011129921A2 (en) 2011-10-20
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