ES2542411T3 - Composición de poliamida de elevada conductividad térmica - Google Patents

Composición de poliamida de elevada conductividad térmica Download PDF

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Publication number
ES2542411T3
ES2542411T3 ES12711189.6T ES12711189T ES2542411T3 ES 2542411 T3 ES2542411 T3 ES 2542411T3 ES 12711189 T ES12711189 T ES 12711189T ES 2542411 T3 ES2542411 T3 ES 2542411T3
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ES
Spain
Prior art keywords
composition
weight
polyamide
composition according
fire retardant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES12711189.6T
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English (en)
Spanish (es)
Inventor
Tae-Kyun Kim
Yeong Chool Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhodia Operations SAS
Original Assignee
Rhodia Operations SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhodia Operations SAS filed Critical Rhodia Operations SAS
Application granted granted Critical
Publication of ES2542411T3 publication Critical patent/ES2542411T3/es
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34922—Melamine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34928—Salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/20—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
ES12711189.6T 2011-04-04 2012-03-30 Composición de poliamida de elevada conductividad térmica Active ES2542411T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1152863A FR2973387B1 (fr) 2011-04-04 2011-04-04 Composition polyamide de forte conductivite thermique
FR1152863 2011-04-04
PCT/EP2012/055821 WO2012136590A1 (fr) 2011-04-04 2012-03-30 Composition polyamide de forte conductivite thermique

Publications (1)

Publication Number Publication Date
ES2542411T3 true ES2542411T3 (es) 2015-08-05

Family

ID=45908054

Family Applications (1)

Application Number Title Priority Date Filing Date
ES12711189.6T Active ES2542411T3 (es) 2011-04-04 2012-03-30 Composición de poliamida de elevada conductividad térmica

Country Status (9)

Country Link
US (1) US9570665B2 (cg-RX-API-DMAC10.html)
EP (1) EP2694588B1 (cg-RX-API-DMAC10.html)
JP (1) JP5847287B2 (cg-RX-API-DMAC10.html)
KR (2) KR101908770B1 (cg-RX-API-DMAC10.html)
CN (2) CN107266910B (cg-RX-API-DMAC10.html)
BR (1) BR112013025583B1 (cg-RX-API-DMAC10.html)
ES (1) ES2542411T3 (cg-RX-API-DMAC10.html)
FR (1) FR2973387B1 (cg-RX-API-DMAC10.html)
WO (1) WO2012136590A1 (cg-RX-API-DMAC10.html)

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CN103980700A (zh) * 2014-06-09 2014-08-13 惠州市华聚塑化科技有限公司 一种抗静电无卤阻燃尼龙工程塑料及其制备方法
CN104610737A (zh) * 2014-10-15 2015-05-13 东莞市雷毅德塑胶科技有限公司 一种高抗冲击阻燃的导热绝缘塑胶材料
CN105255171A (zh) * 2015-09-16 2016-01-20 安徽省和翰光电科技有限公司 一种led用纳米氧化铝-石墨短纤维填充改性的pa6/abs复合导热塑料及其制备方法
JP2017190407A (ja) * 2016-04-14 2017-10-19 ユニチカ株式会社 ポリアミド樹脂組成物およびそれからなる成形体
CN106439732A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯用反射罩成型材料的制备方法
CN106439555A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯的反射罩的制造方法
CN106439553A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯
CN106439554A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯的反射罩
CN106426497A (zh) * 2016-11-10 2017-02-22 吉林省林业科学研究院 一种纤维板及其制备方法
FR3074362B1 (fr) * 2017-11-24 2019-11-15 Arkema France Dispositif de refroidissement et/ou chauffage d'une batterie de vehicule automobile electrique ou hybride et circuit de refroidissement et/ou chauffage associe
US20230357539A1 (en) * 2022-05-06 2023-11-09 Celanese International Corporation Fiber Reinforced Thermoplastic Polymer Composition With Flame Retardant Properties
CH722231A2 (de) * 2024-10-22 2026-04-30 Ems Chemie Ag Flammgeschützte Polyamid-Formmassen

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US4749736A (en) * 1986-10-20 1988-06-07 Allied Corporation Nucleating system for polyamides
EP0869987B2 (fr) 1995-12-29 2006-02-15 Rhodia Engineering Plastics Srl Composition contenant un polyamide et procede de fabrication de celle-ci
DE19614424A1 (de) 1996-04-12 1997-10-16 Hoechst Ag Synergistische Flammschutzmittel-Kombination für Polymere
DE19629432A1 (de) 1996-07-22 1998-01-29 Hoechst Ag Aluminiumsalze von Phosphinsäuren
FR2779730B1 (fr) 1998-06-11 2004-07-16 Nyltech Italia Polyamides a fluidite elevee, son procede de fabrication, compositions comprenant ce copolyamide
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Also Published As

Publication number Publication date
KR20150114580A (ko) 2015-10-12
FR2973387A1 (fr) 2012-10-05
EP2694588B1 (fr) 2015-04-22
CN107266910A (zh) 2017-10-20
FR2973387B1 (fr) 2013-03-29
CN107266910B (zh) 2021-04-30
BR112013025583B1 (pt) 2021-04-20
JP2014523449A (ja) 2014-09-11
KR20130138317A (ko) 2013-12-18
KR101908770B1 (ko) 2018-10-17
CN103459505A (zh) 2013-12-18
BR112013025583A2 (pt) 2020-06-16
US9570665B2 (en) 2017-02-14
WO2012136590A1 (fr) 2012-10-11
US20140048841A1 (en) 2014-02-20
JP5847287B2 (ja) 2016-01-20
EP2694588A1 (fr) 2014-02-12

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