FR2973387B1 - Composition polyamide de forte conductivite thermique - Google Patents

Composition polyamide de forte conductivite thermique

Info

Publication number
FR2973387B1
FR2973387B1 FR1152863A FR1152863A FR2973387B1 FR 2973387 B1 FR2973387 B1 FR 2973387B1 FR 1152863 A FR1152863 A FR 1152863A FR 1152863 A FR1152863 A FR 1152863A FR 2973387 B1 FR2973387 B1 FR 2973387B1
Authority
FR
France
Prior art keywords
thermal conductivity
high thermal
polyamide composition
composition
graphite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1152863A
Other languages
English (en)
French (fr)
Other versions
FR2973387A1 (fr
Inventor
Tae Kyun Kim
Yeong Chool Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhodia Operations SAS
Original Assignee
Rhodia Operations SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR1152863A priority Critical patent/FR2973387B1/fr
Application filed by Rhodia Operations SAS filed Critical Rhodia Operations SAS
Priority to CN201710531579.8A priority patent/CN107266910B/zh
Priority to US14/009,882 priority patent/US9570665B2/en
Priority to ES12711189.6T priority patent/ES2542411T3/es
Priority to KR1020157025986A priority patent/KR101908770B1/ko
Priority to BR112013025583-8A priority patent/BR112013025583B1/pt
Priority to CN2012800172670A priority patent/CN103459505A/zh
Priority to PCT/EP2012/055821 priority patent/WO2012136590A1/fr
Priority to JP2014503090A priority patent/JP5847287B2/ja
Priority to EP12711189.6A priority patent/EP2694588B1/fr
Priority to KR1020137028780A priority patent/KR20130138317A/ko
Publication of FR2973387A1 publication Critical patent/FR2973387A1/fr
Application granted granted Critical
Publication of FR2973387B1 publication Critical patent/FR2973387B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0066—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34922—Melamine; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34928—Salts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H05B33/20—Light sources with substantially two-dimensional [2D] radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
FR1152863A 2011-04-04 2011-04-04 Composition polyamide de forte conductivite thermique Expired - Fee Related FR2973387B1 (fr)

Priority Applications (11)

Application Number Priority Date Filing Date Title
FR1152863A FR2973387B1 (fr) 2011-04-04 2011-04-04 Composition polyamide de forte conductivite thermique
JP2014503090A JP5847287B2 (ja) 2011-04-04 2012-03-30 高い熱伝導率を有するポリアミド組成物
ES12711189.6T ES2542411T3 (es) 2011-04-04 2012-03-30 Composición de poliamida de elevada conductividad térmica
KR1020157025986A KR101908770B1 (ko) 2011-04-04 2012-03-30 열전도율이 높은 폴리아미드 조성물
BR112013025583-8A BR112013025583B1 (pt) 2011-04-04 2012-03-30 composição, componentes associados a díodos eletroluminescentes e aparelho de iluminação
CN2012800172670A CN103459505A (zh) 2011-04-04 2012-03-30 具有高热传导率的聚酰胺组合物
CN201710531579.8A CN107266910B (zh) 2011-04-04 2012-03-30 具有高热传导率的聚酰胺组合物
US14/009,882 US9570665B2 (en) 2011-04-04 2012-03-30 Polyamide composition having high thermal conductivity
EP12711189.6A EP2694588B1 (fr) 2011-04-04 2012-03-30 Composition polyamide de forte conductivite thermique
KR1020137028780A KR20130138317A (ko) 2011-04-04 2012-03-30 열전도율이 높은 폴리아미드 조성물
PCT/EP2012/055821 WO2012136590A1 (fr) 2011-04-04 2012-03-30 Composition polyamide de forte conductivite thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1152863A FR2973387B1 (fr) 2011-04-04 2011-04-04 Composition polyamide de forte conductivite thermique

Publications (2)

Publication Number Publication Date
FR2973387A1 FR2973387A1 (fr) 2012-10-05
FR2973387B1 true FR2973387B1 (fr) 2013-03-29

Family

ID=45908054

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1152863A Expired - Fee Related FR2973387B1 (fr) 2011-04-04 2011-04-04 Composition polyamide de forte conductivite thermique

Country Status (9)

Country Link
US (1) US9570665B2 (cg-RX-API-DMAC10.html)
EP (1) EP2694588B1 (cg-RX-API-DMAC10.html)
JP (1) JP5847287B2 (cg-RX-API-DMAC10.html)
KR (2) KR101908770B1 (cg-RX-API-DMAC10.html)
CN (2) CN107266910B (cg-RX-API-DMAC10.html)
BR (1) BR112013025583B1 (cg-RX-API-DMAC10.html)
ES (1) ES2542411T3 (cg-RX-API-DMAC10.html)
FR (1) FR2973387B1 (cg-RX-API-DMAC10.html)
WO (1) WO2012136590A1 (cg-RX-API-DMAC10.html)

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CN104610737A (zh) * 2014-10-15 2015-05-13 东莞市雷毅德塑胶科技有限公司 一种高抗冲击阻燃的导热绝缘塑胶材料
CN105255171A (zh) * 2015-09-16 2016-01-20 安徽省和翰光电科技有限公司 一种led用纳米氧化铝-石墨短纤维填充改性的pa6/abs复合导热塑料及其制备方法
JP2017190407A (ja) * 2016-04-14 2017-10-19 ユニチカ株式会社 ポリアミド樹脂組成物およびそれからなる成形体
CN106439732A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯用反射罩成型材料的制备方法
CN106439555A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯的反射罩的制造方法
CN106439553A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯
CN106439554A (zh) * 2016-09-28 2017-02-22 合肥海宝节能科技有限公司 节能灯的反射罩
CN106426497A (zh) * 2016-11-10 2017-02-22 吉林省林业科学研究院 一种纤维板及其制备方法
FR3074362B1 (fr) * 2017-11-24 2019-11-15 Arkema France Dispositif de refroidissement et/ou chauffage d'une batterie de vehicule automobile electrique ou hybride et circuit de refroidissement et/ou chauffage associe
US20230357539A1 (en) * 2022-05-06 2023-11-09 Celanese International Corporation Fiber Reinforced Thermoplastic Polymer Composition With Flame Retardant Properties
CH722231A2 (de) * 2024-10-22 2026-04-30 Ems Chemie Ag Flammgeschützte Polyamid-Formmassen

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Also Published As

Publication number Publication date
KR20150114580A (ko) 2015-10-12
FR2973387A1 (fr) 2012-10-05
EP2694588B1 (fr) 2015-04-22
CN107266910A (zh) 2017-10-20
CN107266910B (zh) 2021-04-30
BR112013025583B1 (pt) 2021-04-20
ES2542411T3 (es) 2015-08-05
JP2014523449A (ja) 2014-09-11
KR20130138317A (ko) 2013-12-18
KR101908770B1 (ko) 2018-10-17
CN103459505A (zh) 2013-12-18
BR112013025583A2 (pt) 2020-06-16
US9570665B2 (en) 2017-02-14
WO2012136590A1 (fr) 2012-10-11
US20140048841A1 (en) 2014-02-20
JP5847287B2 (ja) 2016-01-20
EP2694588A1 (fr) 2014-02-12

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