ES2457231T3 - Cabezal de focalización láser con lentes de ZnS que tienen un espesor en los bordes de al menos 5 mm; instalación y proceso de corte láser que emplean un cabezal de focalización de ese tipo - Google Patents

Cabezal de focalización láser con lentes de ZnS que tienen un espesor en los bordes de al menos 5 mm; instalación y proceso de corte láser que emplean un cabezal de focalización de ese tipo Download PDF

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Publication number
ES2457231T3
ES2457231T3 ES10762988.3T ES10762988T ES2457231T3 ES 2457231 T3 ES2457231 T3 ES 2457231T3 ES 10762988 T ES10762988 T ES 10762988T ES 2457231 T3 ES2457231 T3 ES 2457231T3
Authority
ES
Spain
Prior art keywords
focusing
laser
lens
laser beam
focusing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
ES10762988.3T
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English (en)
Spanish (es)
Inventor
Francis Briand
Gaia Ballerini
Isabelle Debecker
Thomas Jouanneau
Hakim Maazaoui
Eric Verna
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Original Assignee
LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=42105843&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2457231(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude filed Critical LAir Liquide SA pour lEtude et lExploitation des Procedes Georges Claude
Application granted granted Critical
Publication of ES2457231T3 publication Critical patent/ES2457231T3/es
Active legal-status Critical Current
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0009Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
    • G02B19/0014Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0052Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938Using specific optical elements
    • G02B27/095Refractive optical elements
    • G02B27/0955Lenses
    • G02B27/0966Cylindrical lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/30Collimators
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/40Optical focusing aids

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lenses (AREA)
  • Lasers (AREA)
  • Optical Elements Other Than Lenses (AREA)
  • Optical Couplings Of Light Guides (AREA)
ES10762988.3T 2009-09-01 2010-08-17 Cabezal de focalización láser con lentes de ZnS que tienen un espesor en los bordes de al menos 5 mm; instalación y proceso de corte láser que emplean un cabezal de focalización de ese tipo Active ES2457231T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0955949 2009-09-01
FR0955949A FR2949618B1 (fr) 2009-09-01 2009-09-01 Tete de focalisation laser pour installation laser solide
PCT/FR2010/051723 WO2011027065A1 (fr) 2009-09-01 2010-08-17 Tete de focalisation laser avec des lentilles en zns ayant une epaisseur aux bords d'au moins 5 mm; installation et procede de coupage laser employant une telle tete de focalisation

Publications (1)

Publication Number Publication Date
ES2457231T3 true ES2457231T3 (es) 2014-04-25

Family

ID=42105843

Family Applications (1)

Application Number Title Priority Date Filing Date
ES10762988.3T Active ES2457231T3 (es) 2009-09-01 2010-08-17 Cabezal de focalización láser con lentes de ZnS que tienen un espesor en los bordes de al menos 5 mm; instalación y proceso de corte láser que emplean un cabezal de focalización de ese tipo

Country Status (13)

Country Link
US (1) US20120154922A1 (enExample)
EP (1) EP2473315B1 (enExample)
JP (1) JP2013503751A (enExample)
CN (1) CN102481665B (enExample)
BR (1) BR112012004680A2 (enExample)
DK (1) DK2473315T3 (enExample)
ES (1) ES2457231T3 (enExample)
FR (1) FR2949618B1 (enExample)
IN (1) IN2012DN00926A (enExample)
PL (1) PL2473315T3 (enExample)
PT (1) PT2473315E (enExample)
RU (1) RU2553152C2 (enExample)
WO (1) WO2011027065A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5766423B2 (ja) * 2010-10-15 2015-08-19 三菱重工業株式会社 レーザ切断装置及びレーザ切断方法
JP5642493B2 (ja) * 2010-10-15 2014-12-17 三菱重工業株式会社 レーザ切断装置及びレーザ切断方法
EP3693122B1 (en) 2010-12-16 2022-07-20 Bystronic Laser AG Laser beam machining device comprising a single lens for light focussing
US8881553B2 (en) * 2011-06-01 2014-11-11 US Conec, Ltd Assembly for precision datum alignment and method of use
DE102013102442B4 (de) * 2013-03-12 2014-11-27 Highyag Lasertechnologie Gmbh Optische Vorrichtung zur Strahlformung
JP5805256B1 (ja) * 2014-04-07 2015-11-04 ハイヤグ レーザーテクノロジー ゲーエムベーハーHIGHYAG Lasertechnologie GmbH ビーム整形のための光学デバイス
US9678281B2 (en) 2014-04-25 2017-06-13 US Conec, Ltd Apparatus for and method of terminating a multi-fiber ferrule
CN103962731B (zh) * 2014-04-30 2016-04-27 武汉锐科光纤激光器技术有限责任公司 光纤激光负压切割8mm以上厚金属材料的方法
JP5919356B2 (ja) * 2014-10-15 2016-05-18 株式会社アマダホールディングス レーザ光による板金の加工方法及びこれを実行するレーザ加工装置
JP6025917B1 (ja) * 2015-06-10 2016-11-16 株式会社アマダホールディングス レーザ切断方法
IT201600070259A1 (it) * 2016-07-06 2018-01-06 Adige Spa Procedimento di lavorazione laser di un materiale metallico con controllo della posizione dell'asse ottico del laser rispetto ad un flusso di gas di assistenza, nonché macchina e programma per elaboratore per l'attuazione di un tale procedimento.
DE112018004574T5 (de) * 2017-10-17 2020-06-25 Mitsubishi Electric Corporation Laserbearbeitungsmaschine
GB201801796D0 (en) * 2018-02-02 2018-03-21 Spi Lasers Uk Ltd Apparatus and method for laser processing a material
DE102018218006A1 (de) * 2018-10-22 2020-04-23 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren und Vorrichtung zur Überwachung eines Schneidprozesses
DE102019212360A1 (de) 2019-08-19 2021-02-25 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Brennschneiden mittels eines Laserstrahls
KR102324548B1 (ko) * 2019-12-31 2021-11-10 (주)미래컴퍼니 레이저 가공 시스템 및 레이저 가공 방법
DE102020121440B4 (de) * 2020-08-14 2025-01-09 TRUMPF Laser- und Systemtechnik SE Vorrichtung zum Erzeugen einer definierten Laserlinie auf einer Arbeitsebene
RU2760443C1 (ru) * 2020-12-07 2021-11-25 Общество с Ограниченной Ответственностью Научно Исследовательский Центр «Астрофизика» Устройство фокусировки для лазерной обработки
US20220203481A1 (en) * 2020-12-29 2022-06-30 American Air Liquide, Inc. Donut keyhole laser cutting
US12265207B2 (en) * 2021-03-04 2025-04-01 Ii-Vi Delaware, Inc. Dynamic focus for laser processing head
DE102022101322A1 (de) 2022-01-20 2023-07-20 TRUMPF Werkzeugmaschinen SE + Co. KG Laserschneideverfahren mit Fokuslage innerhalb einer Schneiddüse mit kleinem Mündungsdurchmesser

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3435363A (en) * 1965-03-23 1969-03-25 Bell Telephone Labor Inc Self-focusing laser
JPH0716067B2 (ja) * 1988-12-22 1995-02-22 富士電機株式会社 レーザ加工装置
JPH0957479A (ja) * 1995-08-28 1997-03-04 Amada Co Ltd レーザ加工ヘッド
JPH1058181A (ja) * 1996-08-23 1998-03-03 Amada Eng Center:Kk レーザビームの遮光装置
US6289155B1 (en) * 1997-12-13 2001-09-11 Lightchip, Inc. Wavelength division multiplexing/demultiplexing devices using dual high index of refraction crystalline lenses
RU12887U1 (ru) * 1998-04-15 2000-02-20 Экспериментальное научно-производственное объединение "Специализированные электронные системы" Лазерная установка
US6325794B1 (en) * 1998-05-13 2001-12-04 Samsung Electronics Co., Ltd. Laser handpiece
JP2001009580A (ja) * 1999-06-28 2001-01-16 Amada Eng Center Co Ltd レーザ光集光装置
JP2002006122A (ja) * 2000-06-19 2002-01-09 Ishikawajima Harima Heavy Ind Co Ltd レーザミラー
JP3608504B2 (ja) * 2000-11-14 2005-01-12 住友電気工業株式会社 赤外線レーザ用光学部品の製造方法
RU2226183C2 (ru) * 2002-02-21 2004-03-27 Алексеев Андрей Михайлович Способ резки прозрачных неметаллических материалов
JP4357944B2 (ja) * 2003-12-05 2009-11-04 トヨタ自動車株式会社 固体レーザ加工装置およびレーザ溶接方法
JP4182034B2 (ja) * 2004-08-05 2008-11-19 ファナック株式会社 切断加工用レーザ装置
FR2897007B1 (fr) * 2006-02-03 2008-04-11 Air Liquide Procede de coupage avec un laser a fibre avec controle des parametres du faisceau
JP2009063941A (ja) * 2007-09-10 2009-03-26 Sumitomo Electric Ind Ltd 遠赤外線カメラ用レンズ、レンズユニット及び撮像装置
JP5033693B2 (ja) * 2008-03-25 2012-09-26 株式会社アマダ ファイバレーザ加工機における集光直径の変換制御方法及びその装置
RU86129U1 (ru) * 2008-04-15 2009-08-27 Открытое акционерное общество Национальный институт авиационных технологий (ОАО НИАТ) Лазерная режущая установка
CN101323053A (zh) * 2008-07-16 2008-12-17 上海大学 飞秒激光微球打孔方法和装置
FR2935916B1 (fr) * 2008-09-12 2011-08-26 Air Liquide Procede et installation de coupage laser avec modification du facteur de qualite du faisceau laser

Also Published As

Publication number Publication date
FR2949618A1 (fr) 2011-03-04
CN102481665A (zh) 2012-05-30
CN102481665B (zh) 2015-07-01
BR112012004680A2 (pt) 2019-09-24
US20120154922A1 (en) 2012-06-21
FR2949618B1 (fr) 2011-10-28
RU2012112398A (ru) 2013-10-10
IN2012DN00926A (enExample) 2015-04-03
EP2473315A1 (fr) 2012-07-11
EP2473315B1 (fr) 2014-01-15
DK2473315T3 (da) 2014-04-07
RU2553152C2 (ru) 2015-06-10
PL2473315T3 (pl) 2014-06-30
WO2011027065A1 (fr) 2011-03-10
PT2473315E (pt) 2014-04-15
JP2013503751A (ja) 2013-02-04

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