ES2192210T3 - Metodo de montaje de un modulo electronico en el cuerpo de una tarjeta. - Google Patents

Metodo de montaje de un modulo electronico en el cuerpo de una tarjeta.

Info

Publication number
ES2192210T3
ES2192210T3 ES96101004T ES96101004T ES2192210T3 ES 2192210 T3 ES2192210 T3 ES 2192210T3 ES 96101004 T ES96101004 T ES 96101004T ES 96101004 T ES96101004 T ES 96101004T ES 2192210 T3 ES2192210 T3 ES 2192210T3
Authority
ES
Spain
Prior art keywords
card
assembly
module
electronic module
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96101004T
Other languages
English (en)
Other versions
ES2192210T5 (es
Inventor
Thomas Tarantino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
Original Assignee
Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7752376&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2192210(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Application granted granted Critical
Publication of ES2192210T3 publication Critical patent/ES2192210T3/es
Publication of ES2192210T5 publication Critical patent/ES2192210T5/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

SE DESCRIBE UN PROCEDIMIENTO PARA MONTAJE DE UN MODULO ELECTRONICO EN LA CAVIDAD DE UN CUERPO DE TARJETA BAJO UTILIZACION DE PRESION Y CALOR. PARA EVITAR LA CARGA TERMICA DEL MODULO ELECTRONICO Y DEL CUERPO DE TARJETA DURANTE LA FASE DE CALENTAMIENTO RELATIVAMENTE CORTA EN UN PROCESO DE FABRICACION EN INTERVALOS, SE SUBDIVIDE EL PROCEDIMIENTO EN MULTIPLES ETAPAS, DONDE O BIEN EL CALENTAMIENTO DEL MODULO ELECTRONICO Y DEL CUERPO DE TARJETA Y EVENTUALMENTE DE UN PEGAMENTO TERMOACTIVABLE SE CONSIGUE EN MULTIPLES ETAPAS DEL PROCEDIMIENTO O BIEN SE OBTIENE UN PEGAMENTO TERMOACTIVABLE EN UNA PRIMERA ETAPA DE PROCEDIMIENTO DONDE SE CALIENTA Y SE OBTIENE EL MONTAJE DEL MODULO ELECTRONICO EN UNA SEGUNDA ETAPA DEL PROCEDIMIENTO BAJO PRESION O BAJO PRESION Y CALOR.
ES96101004T 1995-01-26 1996-01-24 Metodo de montaje de un modulo electronico en el cuerpo de una tarjeta. Expired - Lifetime ES2192210T5 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19502398 1995-01-26
DE19502398A DE19502398A1 (de) 1995-01-26 1995-01-26 Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper

Publications (2)

Publication Number Publication Date
ES2192210T3 true ES2192210T3 (es) 2003-10-01
ES2192210T5 ES2192210T5 (es) 2006-07-16

Family

ID=7752376

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96101004T Expired - Lifetime ES2192210T5 (es) 1995-01-26 1996-01-24 Metodo de montaje de un modulo electronico en el cuerpo de una tarjeta.

Country Status (9)

Country Link
US (1) US5951810A (es)
EP (1) EP0724228B2 (es)
JP (1) JPH08258471A (es)
AT (1) ATE237168T1 (es)
DE (2) DE19502398A1 (es)
DK (1) DK0724228T3 (es)
ES (1) ES2192210T5 (es)
PT (1) PT724228E (es)
ZA (1) ZA96543B (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19637213C1 (de) * 1996-08-22 1998-02-19 Pav Card Gmbh Verfahren und Fügewerkzeug zum Herstellen einer Chipkarte
DE19921230B4 (de) * 1999-05-07 2009-04-02 Giesecke & Devrient Gmbh Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten
FR2794552B1 (fr) * 1999-06-03 2001-08-31 Gemplus Card Int Procede de collage a chaud d'un module electronique dans une carte a puce
DE10110939B4 (de) * 2001-03-07 2004-07-08 Mühlbauer Ag Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat
US20040144472A1 (en) 2003-01-24 2004-07-29 G & D Cardtech, Inc. Process for manufacturing laminated plastic products
US6857552B2 (en) * 2003-04-17 2005-02-22 Intercard Limited Method and apparatus for making smart card solder contacts
DE102004041035B4 (de) * 2004-04-14 2010-04-29 Steinhauser, Jürgen Verfahren zum Befestigen von Bauteilen auf einem Substrat
US20060146271A1 (en) * 2005-01-04 2006-07-06 Pennaz Thomas J Universal display module
US7599192B2 (en) * 2005-04-11 2009-10-06 Aveso, Inc. Layered structure with printed elements
US7821794B2 (en) * 2005-04-11 2010-10-26 Aveso, Inc. Layered label structure with timer
DE102018112476B4 (de) 2017-06-02 2022-01-27 Ulrich Lang Verfahren und Fertigungsanlage zum Herstellen eines Foliensubstrats
WO2019224364A1 (de) 2018-05-24 2019-11-28 Ulrich Lang Verfahren und fertigungsanlage zum herstellen eines foliensubstrats

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3166462A (en) * 1961-11-01 1965-01-19 Fr Hesser Maschinenfabrik Ag F Method and apparatus for heat sealing packages
US3600248A (en) * 1966-07-13 1971-08-17 Mojonnier Inc Albert Method for heat sealing thermoplastic bodies
US3692608A (en) * 1971-01-20 1972-09-19 Nasco Ind Inc Sealing means and method
US3951713A (en) * 1973-12-19 1976-04-20 Fortin Laminating Corporation Method and apparatus for insulating electrically conductive elements
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
EP0128822B1 (fr) * 1983-06-09 1987-09-09 Flonic S.A. Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé
US4543147A (en) * 1984-08-20 1985-09-24 Tetrahedron Associates, Inc. Laminating process and apparatus
FR2579799B1 (fr) * 1985-03-28 1990-06-22 Flonic Sa Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede
DE3639630A1 (de) * 1986-11-20 1988-06-01 Gao Ges Automation Org Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
JPS6433749A (en) * 1987-07-30 1989-02-03 Toshiba Corp Manufacture for tracking channel of optical recording card
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
US5145548A (en) * 1989-09-16 1992-09-08 Natec Incorporated Laminating device for use in laminating a continuous id card material
JP2687661B2 (ja) * 1990-03-26 1997-12-08 三菱電機株式会社 Ｉｃカードの製造方法
DE4040770C2 (de) * 1990-12-19 1999-11-11 Gao Ges Automation Org Datenträger mit integriertem Schaltkreis
FR2701139B1 (fr) * 1993-02-01 1995-04-21 Solaic Sa Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté.
FR2703806B1 (fr) * 1993-04-06 1995-07-13 Leroux Gilles Sa Objet portatif et procede de fabrication.

Also Published As

Publication number Publication date
EP0724228A2 (de) 1996-07-31
DK0724228T3 (da) 2003-09-01
EP0724228B2 (de) 2006-04-05
DE19502398A1 (de) 1996-08-01
ZA96543B (en) 1996-08-15
ES2192210T5 (es) 2006-07-16
PT724228E (pt) 2003-08-29
US5951810A (en) 1999-09-14
JPH08258471A (ja) 1996-10-08
DE59610318D1 (de) 2003-05-15
EP0724228A3 (de) 1998-01-07
EP0724228B1 (de) 2003-04-09
ATE237168T1 (de) 2003-04-15

Similar Documents

Publication Publication Date Title
ES2192210T3 (es) Metodo de montaje de un modulo electronico en el cuerpo de una tarjeta.
DE59511102D1 (de) Datenträger mit integriertem Schaltkreis
TW327250B (en) Wafer dicing/bonding sheet and process for producing semiconductor device
EP1526476A3 (de) Minichipkarte sowie Verfahren zu ihrer Herstellung
TW329565B (en) The semiconductor component & its manufacturing method
ES2182873T3 (es) Procedimiento de fabricacion de una tarjeta sin contacto.
EP0789334A3 (en) Integrated circuit device having an opening exposing the integrated circuit die and related methods
SG66292A1 (en) A method for incorporating a carrier element
EP0338232A3 (en) Method for mounting a flexible film electronic device carrier on or for separating it from a substrate
SG77704A1 (en) Semiconductor device and method of fabricating the same
DK0791446T3 (da) Fremgangsmåde og plast-sprøjtestøbeform til fremstilling af et kompositlegeme
ES2074139T3 (es) Tarjeta de c.i. que tiene un modulo de circuito integrado.
MY119389A (en) Silicone bonding agent for optical memory element optical memory element, and method for manufacturing optical memory element
DE50015826D1 (de) Display zur Integration in kartenförmige Trägermedien
BR9605487A (pt) Vidraça feita de vidro laminado que pode ser aquecida eletricamente
ES2164739T3 (es) Procedimiento y dispositivo para la fabricacion de tarjetas con chip de microcircuito integrado y tarjeta con chip de microcircuito integrado.
EP1369910A3 (en) Mounting method of semiconductor device
FR2773642B1 (fr) Procede de connexion de plots d'un composant a circuits integres a des plages de connexion d'un substrat plastique au moyen de protuberances
DE59914977D1 (de) Chipkartenmodul
IL162178A0 (en) Foil battery with integrated component for use in a chip card
MX9703533A (es) Dispositivo fotovoltaico y proceso para la produccion del mismo.
DE50015980D1 (de) Etikettierte Chipkarte
RO100658A2 (ro) Adeziv pentru lipirea pieilor pe placile de sticla
HUP9903579A2 (hu) Elektronikus kártya elektromagnetikusan létesített adatcseréhez
KR980700190A (ko) 컨벤셔널 다이렉트 글레이징(Conventional-Direct-Glasing)