ZA96543B - A method for mounting an electronic module in a card body - Google Patents
A method for mounting an electronic module in a card bodyInfo
- Publication number
- ZA96543B ZA96543B ZA96543A ZA96543A ZA96543B ZA 96543 B ZA96543 B ZA 96543B ZA 96543 A ZA96543 A ZA 96543A ZA 96543 A ZA96543 A ZA 96543A ZA 96543 B ZA96543 B ZA 96543B
- Authority
- ZA
- South Africa
- Prior art keywords
- module
- mounting
- electronic module
- card body
- recess
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19502398A DE19502398A1 (de) | 1995-01-26 | 1995-01-26 | Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA96543B true ZA96543B (en) | 1996-08-15 |
Family
ID=7752376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA96543A ZA96543B (en) | 1995-01-26 | 1996-01-26 | A method for mounting an electronic module in a card body |
Country Status (9)
Country | Link |
---|---|
US (1) | US5951810A (xx) |
EP (1) | EP0724228B2 (xx) |
JP (1) | JPH08258471A (xx) |
AT (1) | ATE237168T1 (xx) |
DE (2) | DE19502398A1 (xx) |
DK (1) | DK0724228T3 (xx) |
ES (1) | ES2192210T5 (xx) |
PT (1) | PT724228E (xx) |
ZA (1) | ZA96543B (xx) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19637213C1 (de) * | 1996-08-22 | 1998-02-19 | Pav Card Gmbh | Verfahren und Fügewerkzeug zum Herstellen einer Chipkarte |
DE19921230B4 (de) * | 1999-05-07 | 2009-04-02 | Giesecke & Devrient Gmbh | Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten |
FR2794552B1 (fr) * | 1999-06-03 | 2001-08-31 | Gemplus Card Int | Procede de collage a chaud d'un module electronique dans une carte a puce |
DE10110939B4 (de) * | 2001-03-07 | 2004-07-08 | Mühlbauer Ag | Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat |
US20040144472A1 (en) | 2003-01-24 | 2004-07-29 | G & D Cardtech, Inc. | Process for manufacturing laminated plastic products |
US6857552B2 (en) * | 2003-04-17 | 2005-02-22 | Intercard Limited | Method and apparatus for making smart card solder contacts |
DE102004041035B4 (de) * | 2004-04-14 | 2010-04-29 | Steinhauser, Jürgen | Verfahren zum Befestigen von Bauteilen auf einem Substrat |
US20060146271A1 (en) * | 2005-01-04 | 2006-07-06 | Pennaz Thomas J | Universal display module |
US7599192B2 (en) * | 2005-04-11 | 2009-10-06 | Aveso, Inc. | Layered structure with printed elements |
US7821794B2 (en) * | 2005-04-11 | 2010-10-26 | Aveso, Inc. | Layered label structure with timer |
DE102018112476B4 (de) | 2017-06-02 | 2022-01-27 | Ulrich Lang | Verfahren und Fertigungsanlage zum Herstellen eines Foliensubstrats |
WO2019224364A1 (de) | 2018-05-24 | 2019-11-28 | Ulrich Lang | Verfahren und fertigungsanlage zum herstellen eines foliensubstrats |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3166462A (en) * | 1961-11-01 | 1965-01-19 | Fr Hesser Maschinenfabrik Ag F | Method and apparatus for heat sealing packages |
US3600248A (en) * | 1966-07-13 | 1971-08-17 | Mojonnier Inc Albert | Method for heat sealing thermoplastic bodies |
US3692608A (en) * | 1971-01-20 | 1972-09-19 | Nasco Ind Inc | Sealing means and method |
US3951713A (en) * | 1973-12-19 | 1976-04-20 | Fortin Laminating Corporation | Method and apparatus for insulating electrically conductive elements |
DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
EP0128822B1 (fr) * | 1983-06-09 | 1987-09-09 | Flonic S.A. | Procédé de fabrication de cartes à mémoire et cartes obtenues suivant ce procédé |
US4543147A (en) * | 1984-08-20 | 1985-09-24 | Tetrahedron Associates, Inc. | Laminating process and apparatus |
FR2579799B1 (fr) * | 1985-03-28 | 1990-06-22 | Flonic Sa | Procede de fabrication de cartes a memoire electronique et cartes obtenues suivant ledit procede |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
JPS6433749A (en) * | 1987-07-30 | 1989-02-03 | Toshiba Corp | Manufacture for tracking channel of optical recording card |
FR2629236B1 (fr) * | 1988-03-22 | 1991-09-27 | Schlumberger Ind Sa | Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede |
US5145548A (en) * | 1989-09-16 | 1992-09-08 | Natec Incorporated | Laminating device for use in laminating a continuous id card material |
JP2687661B2 (ja) * | 1990-03-26 | 1997-12-08 | 三菱電機株式会社 | Icカードの製造方法 |
DE4040770C2 (de) * | 1990-12-19 | 1999-11-11 | Gao Ges Automation Org | Datenträger mit integriertem Schaltkreis |
FR2701139B1 (fr) * | 1993-02-01 | 1995-04-21 | Solaic Sa | Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté. |
FR2703806B1 (fr) * | 1993-04-06 | 1995-07-13 | Leroux Gilles Sa | Objet portatif et procede de fabrication. |
-
1995
- 1995-01-26 DE DE19502398A patent/DE19502398A1/de not_active Ceased
-
1996
- 1996-01-24 DK DK96101004T patent/DK0724228T3/da active
- 1996-01-24 ES ES96101004T patent/ES2192210T5/es not_active Expired - Lifetime
- 1996-01-24 AT AT96101004T patent/ATE237168T1/de not_active IP Right Cessation
- 1996-01-24 EP EP96101004A patent/EP0724228B2/de not_active Expired - Lifetime
- 1996-01-24 US US08/590,486 patent/US5951810A/en not_active Expired - Fee Related
- 1996-01-24 PT PT96101004T patent/PT724228E/pt unknown
- 1996-01-24 DE DE59610318T patent/DE59610318D1/de not_active Expired - Lifetime
- 1996-01-26 ZA ZA96543A patent/ZA96543B/xx unknown
- 1996-01-26 JP JP8011704A patent/JPH08258471A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0724228A2 (de) | 1996-07-31 |
DK0724228T3 (da) | 2003-09-01 |
EP0724228B2 (de) | 2006-04-05 |
DE19502398A1 (de) | 1996-08-01 |
ES2192210T5 (es) | 2006-07-16 |
PT724228E (pt) | 2003-08-29 |
US5951810A (en) | 1999-09-14 |
ES2192210T3 (es) | 2003-10-01 |
JPH08258471A (ja) | 1996-10-08 |
DE59610318D1 (de) | 2003-05-15 |
EP0724228A3 (de) | 1998-01-07 |
EP0724228B1 (de) | 2003-04-09 |
ATE237168T1 (de) | 2003-04-15 |
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