ES2164739T3 - Procedimiento y dispositivo para la fabricacion de tarjetas con chip de microcircuito integrado y tarjeta con chip de microcircuito integrado. - Google Patents

Procedimiento y dispositivo para la fabricacion de tarjetas con chip de microcircuito integrado y tarjeta con chip de microcircuito integrado.

Info

Publication number
ES2164739T3
ES2164739T3 ES95119842T ES95119842T ES2164739T3 ES 2164739 T3 ES2164739 T3 ES 2164739T3 ES 95119842 T ES95119842 T ES 95119842T ES 95119842 T ES95119842 T ES 95119842T ES 2164739 T3 ES2164739 T3 ES 2164739T3
Authority
ES
Spain
Prior art keywords
circuit chip
integrated micro
micro circuit
card
cards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95119842T
Other languages
English (en)
Inventor
Frank-Thomas Dr Dipl-C Schmidt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ods Landis & Gyr & Co KG GmbH
Original Assignee
Ods Landis & Gyr & Co KG GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ods Landis & Gyr & Co KG GmbH filed Critical Ods Landis & Gyr & Co KG GmbH
Application granted granted Critical
Publication of ES2164739T3 publication Critical patent/ES2164739T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Paints Or Removers (AREA)

Abstract

EN UN PROCEDIMIENTO PARA LA ELABORACION DE TARJETAS DE CHIPS, DONDE AL MENOS UN MODULO DE TARJETAS DE CHIP SE ENCAJA EN UNA PROFUNDIDAD DE TARJETAS DE CHIPS Y DONDE SE PEGA DE FORMA FIJA POR MEDIO DE UN PEGAMENTO LIQUIDO, SE APLICA UN PEGAMENTO AL MENOS ENDURECIBLE MEDIANTE RADIACION Y DE FORMA INMEDIATA ANTES O DESPUES DEL ENCAJADO DEL MODULO DE TARJETAS DE CHIPS SE DISPONE EL ENDURECIMIENTO POR MEDIO DE RADIACION QUE ACTUA DE FORMA CONDUCTORA PARA EL PROCESO DE ENDURECIMIENTO. EN LA TARJETA (C) DE CHIP GENERADA DE ESTA FORMA EL MODULO (M) DE TARJETA DE CHIP ESTA PEGADO CON EL PEGAMENTO (S) ENDURECIBLE MEDIANTE RADIACION, EN PARTICULAR UN PEGAMENTO DE ACRILATO O EPOXI DUROPLASTICO. EL DISPOSITIVO PARA LA ELABORACION DE LAS TARJETAS DE CHIPS CONTIENE AL MENOS UNA FUENTE (M) DE RADIACION PARA EL PEGAMENTO (S) ENDURECIBLE MEDIANTE RADIACION QUE ACTIVA EL PROCESO DE ENDURECIMIENTO.
ES95119842T 1994-12-15 1995-12-15 Procedimiento y dispositivo para la fabricacion de tarjetas con chip de microcircuito integrado y tarjeta con chip de microcircuito integrado. Expired - Lifetime ES2164739T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4444789A DE4444789C3 (de) 1994-12-15 1994-12-15 Verfahren zum Herstellen von Chipkarten, Chipkarte und Vorrichtung zum Durchführen des Verfahrens

Publications (1)

Publication Number Publication Date
ES2164739T3 true ES2164739T3 (es) 2002-03-01

Family

ID=6535946

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95119842T Expired - Lifetime ES2164739T3 (es) 1994-12-15 1995-12-15 Procedimiento y dispositivo para la fabricacion de tarjetas con chip de microcircuito integrado y tarjeta con chip de microcircuito integrado.

Country Status (6)

Country Link
EP (1) EP0717371B1 (es)
CN (1) CN1110014C (es)
AT (1) ATE207226T1 (es)
DE (2) DE4444789C3 (es)
ES (1) ES2164739T3 (es)
ZA (1) ZA9510646B (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998006062A1 (fr) * 1996-08-05 1998-02-12 Gemplus S.C.A. Perfectionnement a un procede de realisation de cartes a memoire et cartes ainsi obtenues
DE19826971C2 (de) * 1998-06-18 2002-03-14 Reiner Goetzen Verfahren zum mechanischen und elektrischen Verbinden von Systembauteilen
FI112288B (fi) * 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
FI112287B (fi) 2000-03-31 2003-11-14 Rafsec Oy Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
DE10110939B4 (de) * 2001-03-07 2004-07-08 Mühlbauer Ag Verfahren und Vorrichtung zum Heißpressverbinden eines Chipmoduls mit einem Trägersubstrat
DE10160390A1 (de) * 2001-12-10 2003-06-18 Cubit Electronics Gmbh Spulenanordnung und Verfahren zu ihrer Herstellung
DE10353648A1 (de) * 2003-11-17 2005-06-16 Giesecke & Devrient Gmbh Verfahren zum Fixieren eines Chipmoduls
WO2015026612A2 (en) 2013-08-21 2015-02-26 X-Card Holdings, Llc Apparatus and method for making information carrying cards through radiation curing, and resulting products
DE102015000006B4 (de) * 2015-01-06 2019-09-26 Jenoptik Optical Systems Gmbh Bauteilvorrichtung und Verfahren zum Fügen von Bauteilen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
JPH02178096A (ja) * 1988-12-28 1990-07-11 Citizen Watch Co Ltd Ｉｃカード
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
DE4229639C1 (de) * 1992-09-04 1993-12-09 Tomas Meinen Verfahren und Vorrichtung zur Herstellung von IC-Karten
DE4423575A1 (de) * 1994-07-05 1996-01-11 Giesecke & Devrient Gmbh Datenträger mit einem Modul mit integriertem Schaltkreis

Also Published As

Publication number Publication date
CN1132375A (zh) 1996-10-02
DE4444789A1 (de) 1996-06-27
EP0717371B1 (de) 2001-10-17
DE4444789C2 (de) 1997-08-28
CN1110014C (zh) 2003-05-28
ATE207226T1 (de) 2001-11-15
DE59509719D1 (de) 2001-11-22
EP0717371A2 (de) 1996-06-19
ZA9510646B (en) 1996-07-11
EP0717371A3 (de) 1997-02-26
DE4444789C3 (de) 2001-05-10

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